BS EN 61189-5-2006 Test methods for electrical nmaterials interconnection nstructures and assemblies –– nPart 5 Test methods for printed board assemblies《电气材料、互连结构和组件的试验方法 印制电路板组件.pdf

1、Test methods for electrical materials, interconnectionstructures and assemblies Part 5: Test methods for printed board assembliesBS EN 61189-5:2006raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI British StandardsLicensed Copy: Wang Bin, ISO/EXCHAN

2、GE CHINA STANDARDS, 17/06/2009 04:14, Uncontrolled Copy, (c) BSINational forewordThis British Standard is the UK implementation of EN 61189-5:200 . It isidentical to IEC 61189-5:200 .The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic assembly technology.A

3、 list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisionsof a contract. Users are responsible for its correct application. BSI 2008ISBN 978 0 580 53522 2ICS 31.180Compliance with a British

4、 Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 61189-5:2006662 2009February8Licensed Copy: Wang Bin, IS

5、O/EXCHANGE CHINA STANDARDS, 17/06/2009 04:14, Uncontrolled Copy, (c) BSIEUROPEAN STANDARD EN 61189-5 NORME EUROPENNE EUROPISCHE NORM September 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische

6、 Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61189-5:2006 E ICS 31.180 English version Test methods for electrical materials, interconnection structures a

7、nd assemblies Part 5: Test methods for printed board assemblies (IEC 61189-5:2006) Mthodes dessais pour les matriaux lectriques, les structures dinterconnexion et les ensembles Partie 5: Mthodes dessais pour les cartes imprimes quipes (CEI 61189-5:2006) Prfverfahren fr Elektromaterialien, Verbindung

8、sstrukturen und Baugruppen Teil 5: Prfverfahren fr bestckte Leiterplatten (IEC 61189-5:2006) This European Standard was approved by CENELEC on 2006-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard th

9、e status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, Ge

10、rman). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus

11、, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 61189-5:2006Licensed Copy

12、: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 17/06/2009 04:14, Uncontrolled Copy, (c) BSIEN 61189-5:2006 - 2 - Foreword The text of document 91/564/FDIS, future edition 1 of IEC 61189-5, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was appro

13、ved by CENELEC as EN 61189-5 on 2006-09-01. This standard forms part of a series and should be used in conjunction with other parts in the same series, under the main title Test methods for electrical materials, interconnection structures and assemblies: Part 1: General test methods and methodology

14、Part 2: Test methods for materials for interconnection structures Part 3: Test methods for interconnection structures (printed boards) Part 4: Test methods for electronic components assembling characteristics Part 5: Test methods for printed board assemblies Part 6: Test methods for materials used i

15、n electronic assemblies It should also be read in conjunction with EN 60068, Environmental testing. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-06-01 latest date by w

16、hich the national standards conflicting with the EN have to be withdrawn (dow) 2009-09-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61189-5:2006 was approved by CENELEC as a European Standard without any modification. _ BS EN 61189-5:2006Lice

17、nsed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 17/06/2009 04:14, Uncontrolled Copy, (c) BSI- 3 - EN 61189-5:2006 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the app

18、lication of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevan

19、t EN/HD applies. Publication Year Title EN/HD Year IEC 60068-1 1988 Environmental testing Part 1: General and guidance EN 60068-11) 1994 IEC 60068-2-20 -2)Environmental testing Part 2: Tests - Test T: Soldering HD 323.2.20 S3 19883)IEC 61189-1 -2)Test methods for electrical materials, printed boards

20、 and other interconnection structures and assemblies Part 1: General test methods and methodology EN 61189-1 19973)IEC 61189-3 -2)Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3: Test methods for interconnection structures (printed boa

21、rds) EN 61189-3 19973)IEC 61189-6 -2)Test methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies EN 61189-6 20063)IEC 61190-1-1 -2)Attachment materials for electronic assembly Part 1-1: Requirements f

22、or soldering fluxes for high-quality interconnections in electronics assembly EN 61190-1-1 20023)IEC 61190-1-2 2002 Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly EN 61190-1-2 2002 IEC 61190-1-3 -2)Attac

23、hment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 20023)1) EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1. 2)Undated reference. 3)Valid ed

24、ition at date of issue. BS EN 61189-5:2006Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 17/06/2009 04:14, Uncontrolled Copy, (c) BSIEN 61189-5:2006 - 4 - Publication Year Title EN/HD Year IEC 61249-2-7 -2)Materials for printed boards and other interconnecting structures Part 2-7: Reinforced

25、 base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad EN 61249-2-7 + corr. September 20023)2005 IEC 62137 + corr. January 2004 2005 Environmental and endurance testing - Test methods for surface-mount boards of area arra

26、y type packages FBGA, BGA, FLGA, LGA, SON and QFN EN 62137 + corr. February 2004 2005 ISO 5725-2 -2)Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method - - ISO 9001 -2)Qu

27、ality management systems - Requirements EN ISO 9001 20003)ISO 9455-1 -2)Soft soldering fluxes - Test methods Part 1: Determination of non-volatile matter, gravimetric method EN 29455-1 19933)ISO 9455-2 -2)Soft soldering fluxes - Test methods Part 2: Determination of non-volatile matter, ebulliometri

28、c method EN ISO 9455-2 19953)BS EN 61189-5:2006Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 17/06/2009 04:14, Uncontrolled Copy, (c) BSI 2 61189-5 IEC:2006 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 Accuracy, precision and resolution .8 3.1 Accuracy .8 3.2 Pre

29、cision .8 3.3 Resolution.9 3.4 Report .9 3.5 Students t distribution.10 3.6 Suggested uncertainty limits10 4 Catalogue of approved test methods 11 5 P: Preparation/conditioning test methods11 5.1 Test 5P01: Test-board design guideline.11 5.2 Test 5P02: Standard mounting process for CSP/BGA packages

30、11 6 V: Visual test methods11 7 D: Dimensional test methods 11 8 C: Chemical test methods.11 8.1 Test 5C01: Corrosion, flux.11 9 M: Mechanical test methods .14 9.1 Test 5M01: Peel test method for test-board land .14 10 E: Electrical test methods.14 10.1 Test 5E01: Changes of the surface insulation r

31、esistance caused by fluxes14 10.2 Test 5E02: Surface insulation resistance, assemblies .21 11 N: Environmental test methods.29 11.1 Test 5N01: Reflow solderability test for soldering joint.29 11.2 Test 5N02: Resistance to reflow solderability of test board30 11.3 Test 5N03: Solderability test for te

32、st board land 30 12 X Miscellaneous test methods 30 12.1 Test 5X01: Liquid flux activity, wetting balance method 30 12.2 Test 5X02: Paste flux viscosity T-Bar spindle method 34 12.3 Test 5X03: Spread test, liquid or extracted solder flux, solder paste and extracted cored wires or preforms.34 12.4 Te

33、st 5X04: Solder paste viscosity T-Bar spin spindle method (applicable to 300 Pas to 1 600 Pas) .37 12.5 Test 5X05: Solder paste viscosity T-Bar spindle method (applicable to 300 Pas)39 12.6 Test 5X06: Solder paste viscosity Spiral pump method (applicable to 300 Pas to 1 600 Pas) 41 12.7 Test 5X07: S

34、older paste viscosity Spiral pump method (applicable to 300 Pas).43 12.8 Test 5X08: Solder paste Slump test45 12.9 Test 5X09: Solder paste Solder ball test 48 12.10 Test 5X10: Solder paste Tack test .50 12.11 Test 5X11: Solder paste Wetting test.52 12.12 Test 5X12: Flux residues Tackiness after dryi

35、ng 54 BS EN 61189-5:2006Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 17/06/2009 04:14, Uncontrolled Copy, (c) BSI61189-5 IEC:2006 3 12.13 Test 5X13: Spitting of flux-cored wire solder.55 12.14 Test 5X14: Solder pool test.58 Bibliography60 Figure 1 Surface insulation resistance pattern .15

36、Figure 2 Connector arrangement17 Figure 3 Specimen orientation in test chamber.18 Figure 4 Test method 5E0223 Figure 5 Resistor verification coupon .24 Figure 6 Resistor verification board with protective cover.25 Figure 7 Test specimen location with respect to chamber air flow 25 Figure 8 Wetting b

37、alance apparatus.32 Figure 9 Wetting balance curve33 Figure 10 Slump test stencil thickness, 0,20 mm46 Figure 11 Slump test stencil thickness, 0,10 mm47 Figure 12 Solder-ball test evaluation50 Figure 13 Solder wetting examples 53 Figure 14 Test apparatus for spitting test.57 Table 1 Students t distr

38、ibution.10 Table 2 Coupons for surface insulation resistance (SIR) testing.16 Table 3 Qualification test report .21 Table 4 Suggested test conditions .27 Table 5 Typical spread areas defined in mm235 Table 6 Example of a test report on solder paste .39 Table 7 Example of a test report on solder past

39、e .41 Table 8 Example of test report on solder paste 43 Table 9 Example of test report on solder paste 45 Table 10 Example of a test report Stencil thickness, 0,2 mm.48 Table 11 Example of a test report Stencil thickness, 0,1 mm.48 BS EN 61189-5:2006Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDA

40、RDS, 17/06/2009 04:14, Uncontrolled Copy, (c) BSI 4 61189-5 IEC:2006 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 5: Test methods for printed board assemblies FOREWORD 1) The International Electrotechnical Commissio

41、n (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in ad

42、dition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee inter

43、ested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance wi

44、th conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested

45、IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible fo

46、r the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between

47、 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users

48、should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other

49、damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn t