BS EN 61189-6-2006 Test methods for electrical materials interconnection structures and assemblies - Test methods for materials used in manufacturing electronic assemblies《电气材料、互连结.pdf

1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assem

2、bliesThe European Standard EN 61189-6:2006 has the status of a British StandardICS 31.180Test methods for electrical materials, interconnection BRITISH STANDARDBS EN 61189-6:2006BS EN 61189-6:2006This British Standard was published under the authority of the Standards Policy and Strategy Committee o

3、n 29 September 2006 BSI 2006ISBN 0 580 49293 1Amendments issued since publicationAmd. No. Date Commentscontract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.National forewordThis British Standard was published by

4、BSI. It is the UK implementation of EN 61189-6:2006. It is identical with IEC 61189-6:2006.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on EPL/501 can be obtained on request to its secretary.T

5、his publication does not purport to include all the necessary provisions of a EUROPEAN STANDARD EN 61189-6 NORME EUROPENNE EUROPISCHE NORM August 2006 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnis

6、che Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61189-6:2006 E ICS 31.180 English version Test methods for electrical materials, interconnection structure

7、s and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006) Mthodes dessais pour les matriaux lectriques, les structures dinterconnexion et les ensembles Partie 6: Mthodes dessais pour les matriaux utiliss dans la fabrication des assemblages lec

8、troniques (CEI 61189-6:2006) Prfverfahren fr Elektromaterialien, Verbindungsstrukturen und Baugruppen Teil 6: Prfverfahren fr Materialien, die bei der Herstellung elektronischer Baugruppen eingesetzt werden (IEC 61189-6:2006) This European Standard was approved by CENELEC on 2006-08-01. CENELEC memb

9、ers are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on applicati

10、on to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat h

11、as the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norw

12、ay, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Foreword The text of document 91/593/FDIS, future edition 1 of IEC 61189-6, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by

13、 CENELEC as EN 61189-6 on 2006-08-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2007-05-01 latest date by which the national standards conflicting with the EN have to be

14、 withdrawn (dow) 2009-08-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61189-6:2006 was approved by CENELEC as a European Standard without any modification. _ EN 61189-6:2006 2 3 EN 61189-6:2006 CONTENTS INTRODUCTION.5 1 Scope 6 2 Normative re

15、ferences .6 3 Accuracy, precision and resolution6 3.1 Accuracy .7 3.2 Precision .7 3.3 Resolution.8 3.4 Report.8 3.5 Students “t“ distribution.8 3.6 Suggested uncertainty limits 9 4 Catalogue of approved test methods .10 5 P: Preparation/conditioning test methods 10 6 V: Visual test methods10 7 D: D

16、imensional test methods 10 8 C: Chemical test methods .10 8.1 Test 6C01: Determination of acid value of liquid soldering flux potentiometric and visual titration methods.10 8.2 Test 6C02: Determination of halides in fluxes, silver chromate method .13 8.3 Test 6C03: Solids content, flux.15 8.4 Test 6

17、C04: Quantitative determination of halide content in fluxes (chloride and bromide) .16 8.5 Test 6C05: Qualitative analysis of fluorides and fluxes by spot test.21 8.6 Test 6C06: Quantitative determination of fluoride concentration in fluxes 22 8.7 Test 6C07: Acid number of rosin 25 8.8 Test 6C08: Sp

18、ecific gravity 25 8.9 Test 6C09: Determination of the percentage of flux on/in flux-coated and/or flux-cored solder26 8.10 Test 6C10: Flux induced corrosion (copper mirror method) .27 9 M: Mechanical test methods29 10 E: Electrical test methods .29 11 N: Environmental test methods .29 12 X: Miscella

19、neous test methods30 12.1 Test 6X01: Determination of solder powder particle size distribution Screen method for types 1-430 12.2 Test 6X02: Solder powder particle size distribution-measuring microscope method32 12.3 Test 6X03: Solder powder particle size distribution Optical image analyser method33

20、 12.4 Test 6X04: Solder powder particle size distribution Measuring laser diffraction method35 12.5 Test 6X05: Determination of maximum solder powder particle size .37 12.6 Test 6X06: Solder paste metal content by weight .38 EN 61189-6:2006 4 Annex ZA (normative) Normative references to internationa

21、l publications with their corresponding European publications41 Figure 1 Chlorides and/or bromides test results 15 Figure 2 Test equipment of specific gravity (hydrometer reading) 25 Figure 3 Flux type classification by copper mirror test.29 Table 1 Students “t“ distribution.9 Table 2 Relation betwe

22、en halide content and mass of specimen .19 Table 3 Mixing ratio from specimen size to water quantity.22 Table 4 Specimen size to chloroform mixture23 Table 5 Screen opening .31 Table 6 Portions of particle sizes by weight % nominal values31 Table 7 Powder particle size distribution record31 Table 8

23、Powder particle size distribution record33 Table 9 Powder particle size distribution record (optical analysis) .35 Table 10 Powder particle size distribution record 36 Table 11 Acceptance of powders by particle sizes 37 Table 12 Test report on solder paste 38 Table 13 Test report on solder paste 40

24、5 EN 61189-6:2006 INTRODUCTION IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. The IEC 61189 series is divided into separate parts, covering information for the desig

25、ner and the test methodology engineer or technician. Each part has a specific focus; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (e.g. TC 104) have been reproduced from existing

26、 IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of IEC 61189 contains

27、test methods for evaluating materials used in manufacturing electronic assemblies. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard are grouped according t

28、o the following principles: P: preparation/conditioning methods V: visual test methods D: dimensional test methods C: chemical test methods M: mechanical test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate reference to the tests, to retai

29、n consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect to an eventual test se

30、quence; that responsibility rests with the relevant specification that calls for the method being performed. The relevant specification, in most instances, also describes pass/fail criterion. The letter and number combinations are for reference purposes, to be used by the relevant specification. Thu

31、s “6C02“ represents the s chemical test method described in this “Part 6” of IEC 61189. In this example, 6 is the part of IEC standard (61189-6), C is the group of methods, and 02 is the test number. EN 61189-6:2006 6 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES P

32、art 6: Test methods for materials used in manufacturing electronic assemblies 1 Scope This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies. 2 Normative references The following ref

33、erenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1:1988, Environmental testing Part 1: General and guidan

34、ce IEC 61189-1, Test methods for electrical materials, interconnection structures and assemblies Part 1: General test methods and methodology IEC 61190-1-1, Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assem

35、bly IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications ISO 9001, Quality management systems Requirements ISO 9455 (all parts), Soft soldering fluxes Test m

36、ethods 3 Accuracy, precision and resolution Errors and uncertainties are inherent in all measurement processes. The information given below enables valid estimates of the amount of error and uncertainty to be taken into account. Test data serve a number of purposes which include: monitoring a proces

37、s; enhancing confidence in quality conformance; arbitrating between customer and supplier. In any of these circumstances, it is essential that confidence can be placed upon the test data in terms of accuracy; calibration of the test instruments and/or system, precision; the repeatability and uncerta

38、inty of the measurement, resolution; the suitability of the test instrument and/or system. 7 EN 61189-6:2006 3.1 Accuracy The regime by which routine calibration of the test equipment is undertaken shall be clearly stated in the quality documentation of the supplier or agency conducting the test, an

39、d shall meet the requirements of ISO 9001. The calibration shall be conducted by an agency having accreditation to a national or international measurement standard institute. There should be an uninterrupted chain of calibration to a national or international standard. Where calibration to a nationa

40、l or international standard is not possible, “round robin“ techniques may be used and documented to enhance confidence in measurement accuracy. The calibration interval shall normally be one year. Equipment consistently found to be outside acceptable limits of accuracy shall be subject to shortened

41、calibration intervals. Equipment consistently found to be well within acceptable limits may be subject to relaxed calibration intervals. A record of the calibration and maintenance history shall be maintained for each instrument. These records should state the uncertainty of the calibration techniqu

42、e (in % deviation) in order that uncertainties of measurement can be aggregated and determined. A procedure shall be implemented to resolve any situation where an instrument is found to be outside calibration limits. 3.2 Precision The uncertainty budget of any measurement technique is made up of bot

43、h systematic and random uncertainties. All estimates shall be based upon a single confidence level, the minimum being 95 %. Systematic uncertainties are usually the predominant contributor, and will include all uncertainties not subject to random fluctuation. These include: calibration uncertainties

44、; errors due to the use of an instrument under conditions which differ from those under which it was calibrated; errors in the graduation of a scale of an analogue meter (scale shape error). Random uncertainties result from numerous sources but can be deduced from repeated measurement of a standard

45、item. Therefore, it is not necessary to isolate the individual contributions. These may include: random fluctuations such as those due to the variation of an influence parameter. Typically, changes in atmospheric conditions reduce the repeatability of a measurement; uncertainty in discrimination, su

46、ch as setting a pointer to a fiducial mark, or interpolating between graduations on an analogue scale. Aggregation of uncertainties: geometric addition (root-sum-square) of uncertainties may be used in most cases. Interpolation error is normally added separately and may be accepted as being 20 % of

47、the difference between the finest graduations of the scale of the instrument: i2r2st+ ) + ( = UUUU where Utis the total uncertainty; Usis the systematic uncertainty; EN 61189-6:2006 8 Uris the random uncertainty; Uiis the interpolation error. Determination of random uncertainties: random uncertainty

48、 can be determined by repeated measurement of a parameter, and subsequent statistical manipulation of the measured data. The technique assumes that the data exhibits a normal (Gaussian) distribution: nt U = rwhere Uris random uncertainty; n is the specimen size; t is the percentage point of the “t“

49、distribution from 3.5, statistical tables; is the standard deviation (n1). 3.3 Resolution It is paramount that the test equipment used is capable of sufficient resolution. Measurement systems used should be capable of resolving 10 % (or better) of the test limit tolerance. It is accepted that some technologies will place a physical limitation upon resolution (e.g. optical resolution). 3.4 Repor