BS EN 61192-3-2003 Workmanship requirements for soldered electronic assemblies - Through-hole mount assemblies《钎焊电子组件的工艺要求 通孔安装组件》.pdf

1、BRITISH STANDARD BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies The European Standard EN 61192-3:2003 has the status of a British Standard ICS 31.190 BS EN 61192-3:2003 This British Standard was published under the authority of th

2、e Standards Policy and Strategy Committee on 7 April 2003 BSI 7 April 2003 ISBN 0 580 41544 9 National foreword This British Standard is the official English language version of EN 61192-3:2003. It is identical with IEC 61192-3:2002. The UK participation in its preparation was entrusted to Technical

3、 Committee EPL/501, Electronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this do

4、cument may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contrac

5、t. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for

6、change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 47 and a back cover. The BSI copyright date displayed in thi

7、s document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 61192-3 NORME EUROPENNE EUROPISCHE NORM February 2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique

8、 Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61192-3:2003 E ICS 31.190 English version Workmanship requirements f

9、or soldered electronic assemblies Part 3: Through-hole mount assemblies (IEC 61192-3:2002) Exigences relatives la qualit dexcution des assemblages lectroniques brass Partie 3: Assemblage au moyen de trous transversants (CEI 61192-3:2002) Anforderungen an die Ausfhrungsqualitt von Ltbaugruppen Teil 3

10、: Baugruppen in Durchsteckmontage (IEC 61192-3:2002) This European Standard was approved by CENELEC on 2003-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without

11、any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language m

12、ade by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germ

13、any, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.Foreword The text of document 91/334/FDIS, future edition 1 of IEC 61192-3, prepared by IEC TC 91, Electronics assembly technology, was submitted t

14、o the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61192-3 on 2003-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2003-11-01 latest date by which the na

15、tional standards conflicting with the EN have to be withdrawn (dow) 2006-02-01 This standard should be used in conjunction with the following parts of EN 61192, under the general title Workmanship requirements for soldered electronic assemblies: Part 1: General Part 2: Surface-mount assemblies Part

16、4: Terminal assemblies Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61192-3:2002 was approved by CENELEC as a European Standard without

17、 any modification. _ Page2 EN611923:2003 CONTENTS INTRODUCTION.6 1 Scope.7 2 Normative references7 3 Terms and definitions .8 4 General requirements .8 4.1 Classification.8 4.2 Conflict8 4.3 Inspection techniques 8 4.4 Interpretation of requirements8 5 Component preparation processes9 5.1 Lead formi

18、ng.9 5.2 Lead protrusion and clinching 10 5.3 Lead cutting/cropping 12 5.4 Pre-tinning.13 6 Masking attributes 13 6.1 Misalignment .13 6.2 Improper adhesion.13 6.3 Thermal capability .15 7 Insertion of through-hole components .16 7.1 General requirements 16 7.2 Orientation and mounting criteria .17

19、7.3 Missing component27 7.4 Wrong component.27 7.5 Damaged component.27 8 Soldering process attributes31 8.1 General requirements 31 8.2 Misalignment .34 8.3 Damaged components.34 8.4 Solder joint characteristics.34 9 Cleaning attributes40 9.1 Flux residues.41 9.2 Other residues.42 10 Rework/replace

20、ment attributes46 Annex ZA (normative) Normative references to international publications with their corresponding European publications47 Figure 1 Lead forming, lead extension 9 Figure 2 Lead forming, bend radius 9 Figure 3 Straight and partially clinched leads 10 Figure 4 Lead protrusion 10 Figure

21、 5 Lead protrusion, clinched11 Figure 6 Lead protrusion, partially clinched.11 Figure 7 Clinched lead Nonconforming 12 Page3 EN611923:2003 Figure 8 Lead cutting, target.12 Figure 9 Lead cutting Acceptable.12 Figure 10 Lead cutting Nonconforming.13 Figure 11 Acceptable solder mask14 Figure 12 Solder

22、mask Cracking or blistered14 Figure 13 Solder mask Loose particles 14 Figure 14 Permanent solder-mask blisters or wrinkling .15 Figure 15 Permanent solder-mask failure .15 Figure 16 Solder-mask degradation16 Figure 17 Component orientation Target17 Figure 18 Component orientation Acceptable.17 Figur

23、e 19 Component orientation Nonconforming.18 Figure 20 Radial lead component, horizontal installation Target .18 Figure 21 Radial lead component, horizontal installation Acceptable 18 Figure 22 Radial lead component, horizontal installation Nonconforming19 Figure 23 Axial lead component, vertical ins

24、tallation Target .19 Figure 24 Axial lead component, vertical installation Acceptable 19 Figure 25 Axial lead component, vertical installation Nonconforming 20 Figure 26 Radial lead component, vertical mounting Target .20 Figure 27 Radial lead component, vertical mounting Acceptable 20 Figure 28 Rad

25、ial lead component, vertical mounting Nonconforming 21 Figure 29 Axial lead component, horizontal mounting Target/Acceptable21 Figure 30 Axial leaded component, horizontal mounting Nonconforming.21 Figure 31 Dual in-line packs (DIPs) Target.22 Figure 32 Dual in-line packs (DIPs) Acceptable22 Figure

26、33 Dual in-line packs (DIPs) Nonconforming .22 Figure 34 Axial lead component, vertical mounting Target23 Figure 35 Axial lead component, vertical mounting Acceptable.23 Figure 36 Axial lead component, vertical mounting Nonconforming 24 Figure 37 Coating meniscus in hole Target 24 Figure 38 Coating

27、meniscus in hole Acceptable .25 Figure 39 Coating meniscus in hole Nonconforming.25 Figure 40 Leads crossing conductors Acceptable.25 Figure 41 Leads crossing conductors Nonconforming 26 Figure 42 Stress-relief axial leaded components.26 Figure 43 Stress-relief radial leaded components27 Figure 44 A

28、xial component lead damage Acceptable27 Figure 45 Axial component lead damage Nonconforming .28 Figure 46 Damage to axial component body .28 Figure 47 Axial lead component damage Nonconforming .28 Figure 48 Damage to axial component with glass body .29 Figure 49 Damage to radial component body Targe

29、t 29 Figure 50 Damage to radial component body Acceptable .29 Figure 51 Active area structural integrity Nonconforming30 Figure 52 Dual in-line component Target .30 Figure 53 Dual in-line component Acceptable 31 Page4 EN611923:2003 Figure 54 Dual in-line component Nonconforming 31 Figure 55 Through-

30、hole solder joints Acceptable32 Figure 56 Poor solder wetting Nonconforming32 Figure 57 Excess solder, bridging Nonconforming32 Figure 58 Excess solder Mounting hole Nonconforming.33 Figure 59 Solder balls and splashes Nonconforming 33 Figure 60 Solder webs Nonconforming.33 Figure 61 Solder wetting

31、Target.34 Figure 62 Solder wetting Acceptable34 Figure 63 Hole fill and lead configuration Acceptable .35 Figure 64 Hole solder fill Thermal plane.35 Figure 65 Solder fillet Target .36 Figure 66 Solder fillet Acceptable 36 Figure 67 Solder fillet Nonconforming 36 Figure 68 Solder pin holes and voids

32、 Acceptable .37 Figure 69 Solder joints Nonconforming 37 Figure 70 Clinched leads Non-plated through holes Acceptable.38 Figure 71 Clinched leads Plated through holes Acceptable38 Figure 72 Exposed basis metal Acceptable39 Figure 73 Exposed basis metal Nonconforming39 Figure 74 Trimmed leads Accepta

33、ble.40 Figure 75 Fractured leads Nonconforming .40 Figure 76 Cleaning Acceptable 41 Figure 77 Flux residue Nonconforming.41 Figure 78 Particulate matter .42 Figure 79 Particulate residues 42 Figure 80 Residue-free surface 43 Figure 81 White residue .43 Figure 82 Residue-free surface Corrosion44 Figu

34、re 83 Corrosion residues Acceptable.44 Figure 84 Nonconforming residues .45 Figure 85 Corrosion residues45 Figure 86 Embedded residues 46 Table 1 Lead bend requirements 9 Table 2 Lead protrusion requirements 10 Table 3 Component to board space 21 Table 4 Component-to-board spacing .23 Table 5 Minimu

35、m component lead acceptance conditions .35 Page5 EN611923:2003 INTRODUCTION This part of IEC 61192, combined with IEC 61192-1, is used to meet the end-product requirements defined in IEC 61191-1 and IEC 61191-3. This standard may be used to enable the suppliers and users of through-hole electronic a

36、ssemblies to specify good manufacturing practices as part of a contract. The respective requirements and guidelines for surface-mount and terminal assemblies are included in separate but related standard. Page6 EN611923:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES Part 3: Through

37、-hole mount assemblies 1 Scope This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are tota

38、lly through-hole or mixed assemblies that include surface- mounting or other related assembly technologies, for example, terminals, wires. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited ap

39、plies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical an

40、d electronic assemblies using surface mount and related assembly technologies IEC 61191-2, Printed board assemblies Part 2: Sectional specification Requirements for surface mount soldered assemblies IEC 61191-3, Printed board assemblies Part 3: Sectional specification Requirements for through-hole m

41、ount soldered assemblies IEC 61191-4, Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IEC 61192-1, Workmanship requirements for soldered electronic assemblies Part 1: General IEC 61192-2, Workmanship requirements for soldered electronic assembli

42、es Part 2: Surface- mount assemblies IEC 61192-4, Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies Page7 EN611923:2003 3 Terms and definitions For the purposes of this part of IEC 61192, the definitions of IEC 60194 apply. 4 General requirements The requirement

43、s of IEC 61192-1 are mandatory for this standard. 4.1 Classification The classification of assemblies is divided into three levels, that is, levels A, B, and C. Definitions of the classification categories and the status of product for each level are given in IEC 61192-1. In general, status is divid

44、ed into three workmanship conditions, as follows: a) target; b) acceptable; c) nonconforming. 4.2 Conflict Accept and/or reject decisions shall be based on applicable documentation such as contracts, drawings, specifications and reference documents. In the event of conflict, the following order of p

45、recedence shall apply: a) procurement documents as agreed between user and supplier; b) master assembly drawing; c) IEC 61191-1 and IEC 61192-1; d) this standard; e) other documents to the extent that they are specified in this standard. 4.3 Inspection techniques For visual inspection, individual sp

46、ecifications may call for magnification aids for examining printed-board assemblies. Binocular vision should be used, and may be accomplished with a single large field magnifier. Magnification of at least 3 shall be used for conventional inserted printed-board assemblies. Magnification higher than 1

47、0 will not be found practicable for routine high speed scanning inspection, but will be needed sometimes for detailed diagnosis or referee purposes. 4.4 Interpretation of requirements Unless otherwise specified by the user , the word “shall“ signifies that the requirement is mandatory. Deviation fro

48、m any “shall“ requirement requires written acceptance by the user, for example, via assembly drawing, specification or contract provision. The words “should“ and “may“ reflect recommendations and guidance, respectively, and are used whenever it is intended to express non-mandatory provisions. Page8 EN611923:2003 5 Component preparation processes Component preparation processes shall be carried out in accordanc