BS EN 62047-4-2010 Semiconductor devices Micro-electromechanical devices Generic specification for MEMS《半导体装置 微电机装置 微电子机械系统(MEMS)一般规格》.pdf

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor devices Micro-electromechanical devicesPart 4: Generic specification for MEMSBS EN 62047-4:2010National forewordThis British Standard is the UK implementation of EN

2、 62047-4:2010. It isidentical to IEC 62047-4:2008.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the n

3、ecessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 56857 2ICS 31.080.99Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the StandardsPolicy and Strategy

4、Committee on 30 November 2010.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62047-4:2010EUROPEAN STANDARD EN 62047-4 NORME EUROPENNE EUROPISCHE NORM October 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Elect

5、rotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62047-4:2010 E ICS 31.080.99 English version Semiconductor de

6、vices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008) Dispositifs semiconducteurs - Dispositifs microlectromcaniques - Partie 4: Spcification gnrique pour les MEMS (CEI 62047-4:2008) Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 4: Fachg

7、rundspezifikation fr Mikrosystemtechnik (IEC 62047-4:2008) This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard wi

8、thout any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other lang

9、uage made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Rep

10、ublic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. EN 62047-4:2010 - 2 - Foreword The text of doc

11、ument 47/1975/FDIS, future edition 1 of IEC 62047-4, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62047-4 on 2010-10-01. Attention is drawn to the possibility that some of the elements of this document may be the subje

12、ct of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2011-07-01 la

13、test date by which the national standards conflicting with the EN have to be withdrawn (dow) 2013-10-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62047-4:2008 was approved by CENELEC as a European Standard without any modification. In the off

14、icial version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60721-3-0 NOTE Harmonized as EN 60721-3-0. IEC 60721-3-1 NOTE Harmonized as EN 60721-3-1. _ BS EN 62047-4:2010- 3 - EN 62047-4:2010 Annex ZA (normative) Normative references to international public

15、ations with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) appl

16、ies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60027 Series Letter symbols to be used in electrical technology EN 60027 Series IEC 60068-2 Series Environmental testing - Part

17、 2: Tests EN 60068-2 Series IEC 60617 - Graphical symbols for diagrams - - IEC 60747-1 2006 Semiconductor devices - Part 1: General - - IEC 60749 Series Semiconductor devices - Mechanical and climatic test methods EN 60749 Series IEC 61193-2 - Quality assessment systems - Part 2: Selection and use o

18、f sampling plans for inspection of electronic components and packages EN 61193-2 - IEC 62047-1 - Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions EN 62047-1 - IEC QC 001002-3 2005 IEC Quality Assessment System for Electronic Components (IECQ) - Rules of Procedu

19、re - Part 3: Approval procedures - - ISO 1000 - SI units and recommendations for the use of their multiples and of certain other units - - ISO 2859-1 - Sampling procedures for inspection by attributes - Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection - -

20、BS EN 62047-4:2010 4 62047-4 IEC:2008 CONTENTS 1 Scope.5 2 Normative references .5 3 Terms, definitions, units and symbols .6 4 Standard environmental conditions.7 5 Marking 7 5.1 Device identification 7 5.2 Device traceability.7 5.3 Packing .7 6 Quality assessment procedures7 6.1 General .7 6.1.1 E

21、ligibility for qualification and/or capability approval 7 6.1.2 Primary stage of manufacture7 6.1.3 Formation of inspection lots.7 6.1.4 Structurally similar device7 6.1.5 Subcontracting 8 6.1.6 Incorporated components 8 6.1.7 Validity of release8 6.2 Qualification approval procedure .8 6.2.1 Qualif

22、ication approval testing.8 6.2.2 Environmental and climatic tests .8 6.2.3 Granting of qualification approval 8 6.2.4 Statistical sampling procedures .11 6.2.5 Endurance tests 11 6.2.6 Endurance tests where the failure rate is specified 11 6.2.7 Accelerated test procedures 12 7 Test and measurement

23、procedures.12 7.1 Standard conditions and general precautions 12 7.1.1 Standard conditions.12 7.1.2 General precautions 13 7.1.3 Precision of measurements .13 7.2 Physical examination.13 7.2.1 Visual examination 13 7.2.2 Dimensions .13 7.3 Climatic and mechanical tests .13 7.4 Alternative test metho

24、ds13 Annex A (normative) Sampling procedures 14 Annex B (informative) Classification for MEMS technologies and devices 15 Bibliography19 Table 1 MEMS categories and terms6 Table 2 Subgrouping for Group B and Group C10 BS EN 62047-4:201062047-4 IEC:2008 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL

25、 DEVICES Part 4: Generic specification for MEMS 1 Scope This part of IEC 62047 describes generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as

26、 sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general procedures for quality assessment to be used in IECQ-CECC systems and establishes general principles for describing and testing of electrical, optical, mechanical and environmental charact

27、eristics. This part of IEC 62047 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described in this standard

28、are basically made of semiconductor material. However, the statements made in this standard are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials. 2 Normative references The following referenced documents are indispensable fo

29、r the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60027 (all parts), Letter symbols to be used in electrical technology IEC 60068-2 (all parts), Envir

30、onmental testing Part 2: Tests IEC 60617, Graphical symbols for diagrams IEC 60747-1:2006, Semiconductor devices Part 1: General IEC 60749 (all parts), Semiconductor devices Mechanical and climatic test methods IEC 61193-2, Quality assessment systems Part 2: Selection and use of sampling plans for i

31、nspection of electronic components and packages IEC 62047-1, Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions IEC QC 001002-3:2005, IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 3: Approval procedures ISO 1000, SI units and

32、recommendations for the use of their multiples and of certain other units ISO 2859-1, Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection BS EN 62047-4:2010 6 62047-4 IEC:2008 3 Terms, definitions, units and sy

33、mbols For the purposes of this document, terms shall, wherever possible, be taken from IEC 62047-1; units, and graphical and letter symbols shall, wherever possible, be taken from IEC 60027, IEC 60617 and ISO 1000. Any other units, symbols or terminology peculiar to one of the devices covered by thi

34、s generic specification shall be taken from the relevant IEC or ISO standards (see Clause 2) or derived in accordance with the principles of the standards listed above. Table 1 shows the categories and terms on MEMS area. Table 1 MEMS categories and terms Category Sub-category Terms General MEMS, MS

35、T, micromachine, micromachine technology Science and engineering Microscience and engineering, scale effect, mesotribology, microtribology, biomimetics, ciliary motion, self-organization Material science Shape memory polymer, modification Actuator Actuator, micro-actuator, electrostatic actuator, li

36、ght driven actuator, piezoelectric actuator, shape memory alloy actuator, sol-gel conversion actuator, comb drive actuator, wobble motor Sensor Microsensor, biosensor, integrated microprobe, ion sensitive field effect transistor (ISFET), accelerometer, micro-gyroscope Functional element Other Diaphr

37、agm structure, microcantilever, microchannel, micromirror, scanning mirror, microswitch, optical switch, microgripper, micropump, microvalve, integrated mass flow controller, micro fuel cell, photoelectric transducer General Micromachining Silicon process Silicon process, thick film technology, thin

38、 film technology, bulk micro-machining, surface micromachining, photolithography, electron beam lithography, photomask, photoresist, silicon-on-insulator (SOI) LIGA process LIGA process, UV-LIGA, X-ray lithography Beam process Beam processing, sputtering, focused ion beam machining Etching process E

39、tching process, wet etching, dry etching, isotropic etching, anisotropic etching, etch stop, lost wafer process, sacrificial etching, reactive ion etching （RIE), DRIE, ICP Deposition process Vapour deposition, physical vapour deposition process (PVD), electroforming Other removal process Micro-elect

40、ro-discharge machining Plastic working Hot embossing process Machining technology Other Micro-moulding, STM machining Bonding Bonding, adhesive bonding, anodic bonding, diffusion bonding, silicon fusion bonding Bonding/ assembling technology Other Micro-manipulator, non-contact handling, packaging,

41、wafer level packaging Microscope Scanning probe microscope (SPM), atomic force microscope (AFM), scanning tunneling microscope (STM), near-field microscope Evaluation technology Other Aspect ratio, power-to-weight ratio General Bio-MEMS, RF-MEMS, MOEMS, lab-on-a-chip, micro TAS, micro-reactor Biomed

42、ical use Microscopic surgery (micro-surgery), active catheter, fibre endoscope, smart pill, bio-chip, DNA-chip, protein chip, cell handling, cell fusion, polymerase chain reaction (PCR) Application technology Industrial use Microfactory BS EN 62047-4:201062047-4 IEC:2008 7 4 Standard environmental c

43、onditions Standard environmental conditions for the measurement of characteristics, tests and operating conditions shall be at a temperature of 25 C 3 C, a relative humidity of 25 % to 85 %, and a pressure of 86 kPa to 106 kPa. 5 Marking 5.1 Device identification The marking on the device shall have

44、 clear identification of the device and its quality level. 5.2 Device traceability The device shall be provided with a traceability code which enables back-tracking of the device to a certain production or inspection lot. 5.3 Packing Marking on the packing shall state a) the device identification co

45、de; b) the traceability code(s) of the enclosed devices; c) the number of enclosed devices; d) the required precautions, if any. This marking shall be in accordance with Customs regulations. NOTE Additional requirements can be specified in the relevant detail specification. 6 Quality assessment proc

46、edures 6.1 General When this standard, and related standards, are used for the purpose of a full quality assessment system such as IEC Quality Assessment System for Electronic Components (IECQ), this Clause 6 applies. 6.1.1 Eligibility for qualification and/or capability approval A type of device be

47、comes eligible for qualification and/or capability approval when the rules of the following procedures as set out below, are satisfied. Clause 3 of IEC QC 001002-3 describes the procedure for qualification approval (QA), the release for delivery and validity of release. 6.1.2 Primary stage of manufa

48、cture The primary stage of manufacture is defined in the sectional specification. 6.1.3 Formation of inspection lots See 3.3.1 of IEC QC 001002-3. 6.1.4 Structurally similar device See 3.3.2 of IEC QC 001002-3. BS EN 62047-4:2010 8 62047-4 IEC:2008 6.1.5 Subcontracting The use of subcontracting is p

49、ermitted, unreservedly. See 3.1.2.3 to 3.1.2.7 of IEC QC001002-3. 6.1.6 Incorporated components See 5.2.3 of IEC QC 001002-3. 6.1.7 Validity of release See 3.2.2 of IEC QC 001002-3. 6.2 Qualification approval procedure 6.2.1 Qualification approval testing Method a), b) or c) of 3.1.4 of IEC QC 001002-3 may be used at the manufacturers discretion in accordance with the inspection requirements given in the sectional or blank detail specifications. Samples may be composed o