BS EN 62137-1-1-2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Pull strength test《表面安装技术 表面安装焊接接缝的环境和耐久性试验方法 拉拔强度试验》.pdf

1、BRITISH STANDARD BS EN62137-1-1:2007 Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-1: Pull strength test The European Standard EN 62137-1-1:2007 has the status of a British Standard ICS 31.190 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PE

2、RMITTED BY COPYRIGHT LAW Amd. No. Date Comments BS EN 62137-1-1:2007 National foreword This British Standard is the UK implementation of EN 62137-1-1:2007. It is identical to IEC 62137-1-1:2007. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly

3、 technology. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer

4、 immunity from legal obligations. This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 October 2007 BSI 2007 ISBN 978 0 580 55335 6 Amendments issued since publication EUROPEAN STANDARD EN 62137-1-1NORME EUROPENNE EUROPISCHE NORM August 2007 IC

5、S 31.190 English version Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007) Technique du montage en surface - Mthodes dessai denvironnement et dendurance des joints de soudure pour montage en surfa

6、ce - Partie 1-1: Essai de force darrachement (CEI 62137-1-1:2007) Oberflchenmontage-Technik - Verfahren zur Prfung auf Umgebungseinflsse und zur Prfung der Haltbarkeit von Oberflchen-Ltverbindungen - Teil 1-1: Zugfestigkeitsprfung (IEC 62137-1-1:2007) This European Standard was approved by CENELEC o

7、n 2007-08-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards ma

8、y be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to

9、 the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxe

10、mbourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung C

11、entral Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62137-1-1:2007 E EN 62137-1-1:2007 2 Foreword The text of document 91/681/FDIS, future edition 1 of IEC 62137-1-1, prep

12、ared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-1 on 2007-08-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national st

13、andard or by endorsement (dop) 2008-05-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-08-01 Annex ZA has been added by CENELEC. Endorsement notice The text of the International Standard IEC 62137-1-1:2007 was approved by CENELEC as a European S

14、tandard without any modification. 3 EN 62137-1-1:2007 CONTENTS 1 Scope . 4 2 Normative references . 4 3 Terms and definitions .5 4 General remarks . 5 5 Test equipment and materials .6 5.1 Flow soldering equipment 6 5.2 Reflow soldering equipment 6 5.3 Pull strength test equipment 6 5.4 Optical micr

15、oscope 6 5.5 Test substrate . 6 5.6 Solder alloy . 7 5.7 Flux for flow soldering . 7 5.8 Solder paste 7 6 Mounting method 7 6.1 Flow soldering .7 6.2 Reflow soldering 8 7 Test conditions .9 7.1 Test: Rapid change of temperature9 7.2 Pull strength test .9 8 Test procedure .9 8.1 Test sequence .9 8.2

16、Pre-conditioning 10 8.3 Initial pull strength measurement . 10 8.4 Rapid change of temperature 10 8.5 Recovery . 10 8.6 Intermediate/final pull strength measurement 10 9 Items to be included in the test report . 10 10 Items to be given in the product specification . 11 Annex A (normative) Pull stren

17、gth test Details 12 Annex ZA (normative) Normative references to international publications with their corresponding European publications 15 Bibliography 14 Figure 1 Gull-wing leaded component 5 Figure 2 Area under evaluation in the pull strength test 6 Figure 3 Example of a flow soldering profile

18、(actual measurement for double-wave soldering) .8 Figure 4 Typical reflow profile 9 Figure 5 Test procedure . 10 Figure A.1 Pull strength test . 13 Figure A.2 An example of the shape of the tip of the pulling jig 13 Figure A.3 Failure modes in pull strength test 13 EN 62137-1-1:2007 4 SURFACE MOUNTI

19、NG TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-1: Pull strength test 1 Scope The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the

20、 solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate. 2 Normative references

21、The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1: Environmental testing Part 1: Genera

22、l and guidance IEC 60068-2-14: Environmental testing Part 2-14: Test N: Change of temperature IEC 60194: Printed board design, manufacture and assembly Terms and definitions IEC 61188-5-5, Printed boards and printed board assemblies Design and use Part 5-5: Sectional requirements - Attachment (land/

23、joint) considerations Components with gull-wing leads on four sides 1IEC 61190-1-1, Attachment materials for electronic assembly Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly IEC 61190-1-2: Attachment materials for electronic assembly Part 1-2:

24、 Requirements for solder pastes for high-quality interconnections in electronics assembly IEC 61190-1-3 Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications IEC 61249-2-7,

25、Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad 1 In preparation. 5 EN 62137-1-1:2007 3 Terms and definitions For the purposes of t

26、his document, the following terms and definitions apply. NOTE Key terms used in this standard are taken mostly from IEC 60194 and IEC 60068-1. 3.1 gull-wing lead lead stretching out from a surface mount component as illustrated in Figure 1 Gull-wing lead IEC 1173/07 Figure 1 Gull-wing leaded compone

27、nt 3.2 pull strength maximum force to break the joint of a lead to board when a gull-wing lead of a surface mount component is pulled using a pulling tool at an angle of 45 to the board surface 3.3 pull speed moving speed of the pulling tool holding a gull-wing lead of a component mounted on board i

28、n pull strength test 4 General remarks The mechanical properties of the joint between leads to lands on a printed wiring board using lead-free solder are not the same for the joint using tin-lead solder due to the difference in composing elements of the solders. Thus it becomes important to test the

29、 mechanical properties of solder joints, using different solder alloys, and after temperature cycling stress have been applied. In this test method, the test specimens are mounted on a substrate either by flow soldering or by reflow soldering. The durability of the solder joints is evaluated first b

30、y exposing the electronic components to rapid changes of temperature and after that applying pull strength to the soldered joint. Users of gull-wing components subjected to these tests should check that the results ensure an adequate margin of attachment strength bearing in mind the mass of the comp

31、onent, the number of leads and the specified mechanical environment of the electronic assembly for which the component is intended. NOTE 1 The exposure temperatures in this test may exceed the rated temperature range of the specific electronic component. NOTE 2 This test is not a test to measure the

32、 strength of the electronic components. The test method to evaluate the robustness of the joint to a board is described in IEC 60068-2-21. NOTE W here the tests on a single component have been performed on more than one lead, the lowest strength figure should be assumed for all leads when calculatin

33、g the overall attachment strength EN 62137-1-1:2007 6 Component lead Solder Substrate The area of a joint to be evaluated is illustrated in Figure 2. Component lead Enlarge Evaluation area Plated layers Intermetallic compound layers Substrate Substrate land IEC 1174/07 Figure 2 Area under evaluation

34、 in the pull strength test 5 Test equipment and materials 5.1 Flow soldering equipment The equipment used for the flow soldering is a solder bath that can realize the temperature profile as specified in 6.1. An example of the temperature profile is given in Figure 3. 5.2 Reflow soldering equipment T

35、he reflow soldering oven shall be able to realize the temperature profile as specified in 6.2. An example of the temperature profile is given in Figure 4. 5.3 Pull strength test equipment Unless otherwise specified, equipment with the following features shall be used for the pull test. The pull stre

36、ngth test equipment is composed of tension testing machine, a pulling tool, a jig to fasten a substrate, and an electronic recorder. The tension testing machine shall realize the pull speed specified in Annex A. The jig to fasten a substrate shall be designed so that a pull force can be applied to a

37、 specimen lead at an angle of 45 to the substrate. The recorder shall be able to record the maximum force applied to a lead to break the soldered joint. The accuracy of the recorded data shall be better than 1 % of measured values. 5.4 Optical microscope The microscope shall be able to observe an ob

38、ject with a magnification approximately of 50X to 250X. It shall also be equipped with a lamp that can give an illumination level of approximately 2 000 lx to the object. 5.5 Test substrate Unless otherwise prescribed by the relevant specification, the test shall be conducted on a specimen (device)

39、mounted by its normal means on the following substrate. a) Material: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade (IEC 61249-2-7), with foil bonded to one side and a nominal thickness of the sheet, including the metal foil, of 1,6 mm with a tolerance of 0,20 mm. The

40、copper foil shall have a thickness of 0,035 mm 0,010 mm. 7 EN 62137-1-1:2007 b) Size: The size of the substrate depends on the size and shape of a surface mount device soldered on the substrate. The substrate shall be able to be fastened to the pull test equipment. c) Land geometry: The shape and si

41、ze of a land shall comply with IEC 61188-5-5 or the land geometry recommended by the respective component supplier. Since IEC 61188-5-5 provides for three different land pattern geometries, and different suppliers provide different recommendations, the relationship between the component gull-wing fo

42、ot print and the land pattern used in the testing shall be recorded in accordance with the following: land protrusion at the lead toe: minimum; land protrusion at the lead heel: minimum; land protrusion at the lead side: minimum. d) Surface protection: The solderable areas of the substrate (lands) s

43、hall be protected against oxidization by suitable means, e.g. by an organic surface protection layer (OSP). This protective layer shall not adversely have an effect on the solderability of the lands under the soldering conditions of the reflow soldering equipment described in 6.2. 5.6 Solder alloy U

44、nless otherwise specified, the solder alloy shall consist of a ternary composition of Sn, Ag and Cu with the Ag content ranking from 3,0 % to 4,0 % by weight and the Cu content ranking from 0,5 % to 1,0 % by weight with Sn for balance, e.g. SnAg3.0Cu0.5. The solder alloy shall be in accordance with

45、IEC 61190-1-3. 5.7 Flux for flow soldering Unless otherwise specified, the flux used in this test shall comply with IEC 61190-1-1. 5.8 Solder paste Unless otherwise specified, the solder paste used in this test shall comply with IEC 61190-1-2. The solder specified in 5.6 shall be used for the solder

46、 paste. 6 Mounting method The test specimen shall be mounted to the substrate by one of the methods given in 6.1 and 6.2. 6.1 Flow soldering The following steps shall be taken: a) The test specimen shall be fixed to the substrate specified in 5.5 by an adhesive. b) A flux as specified in 5.7 shall b

47、e supplied by means of foam or by spraying. c) Unless otherwise specified, a flow-soldering equipment specified in 5.1 shall be used to solder the leads under the conditions given below. The temperature is measured at the land immersed to molten solder. d) Preheating temperature is 100 C to 120 C. T

48、he soldering temperature (temperature of the solder bath) is (250 5) C for 3 s to 5 s. A typical soldering profile is given in Figure 3. EN 62137-1-1:2007 8 Temperature C300 250 Solder contact time A + B =3 s to 5 s 200 Preheating temperature: 100 C to 120 C 150 100 50 Preheating time 30 s to 90 s S

49、older bath temperature: 250 C 5 C Temperature measured at a land immersed into solder 0 0 20 40 60 80 100 120 140 160 Time s IEC 1175/07 Figure 3 Example of a flow soldering profile (actual measurement for double-wave soldering) 6.2 Reflow soldering The following steps shall be taken: a) Apply the solder paste specified in 5.8 to the lands of a test substrate as specified in 5.5, using a metal mask with openings of the sam