BS EN 62137-1-2-2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Shear strength test《表面安装技术 表面安装焊接接缝的环境和耐久性试验方法 剪切强度试验》.pdf

1、 g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58endurance test methods for surface mount solder joint Part 1-2: Shear strength testThe European Sta

2、ndard EN 62137-1-2:2007 has the status of a British StandardICS 31.190Surface mounting technology Environmental and BRITISH STANDARDBS EN 62137-1-2:2007BS EN 62137-1-2:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 October 2007 BSI 20

3、07ISBN 978 0 580 55357 8Amendments issued since publicationAmd. No. Date Commentscontract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from legal obligations.National forewordThis British Standard is the UK implementation of EN 62137-1-

4、2:2007. It is identical to IEC 62137-1-2:2007.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to in

5、clude all the necessary provisions of a EUROPEAN STANDARD EN 62137-1-2 NORME EUROPENNE EUROPISCHE NORM August 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue

6、 de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62137-1-2:2007 E ICS 31.190 English version Surface mounting technology - Environmental and endurance test methods for surface mount solder jo

7、int - Part 1-2: Shear strength test (IEC 62137-1-2:2007) Technique du montage en surface - Mthodes dessai denvironnement et dendurance des joints de soudure pour montage en surface - Partie 1-2: Essai de rsistance au cisaillement (CEI 62137-1-2:2007) Oberflchenmontage-Technik - Verfahren zur Prfung

8、auf Umgebungseinflsse und zur Prfung der Haltbarkeit von Oberflchen-Ltverbindungen - Teil 1-2: Scherfestigkeitsprfung (IEC 62137-1-2:2007) This European Standard was approved by CENELEC on 2007-08-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the c

9、onditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists i

10、n three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrote

11、chnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland

12、 and the United Kingdom. Foreword The text of document 91/683/FDIS, future edition 1 of IEC 62137-1-2, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62137-1-2 on 2007-08-01. The following dates were fixed: lat

13、est date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-05-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-08-01 Annex ZA has been added by CENELEC. _ Endorse

14、ment notice The text of the International Standard IEC 62137-1-2:2007 was approved by CENELEC as a European Standard without any modification. _ 2 EN 62137-1-2:2007CONTENTS 1 Scope.4 2 Normative references .4 3 Terms and definitions .4 4 General remarks.5 5 Test equipment and materials.6 5.1 Shear t

15、est equipment 6 5.2 Pushing tool 6 5.3 Optical microscope6 5.4 Scanning electron microscope (SEM) 6 5.5 Reflow soldering oven .6 5.6 Test substrate .6 5.7 Solder alloy .7 5.8 Solder paste7 6 Mounting method7 7 Test conditions .8 7.1 Test: Rapid change of temperature8 7.2 Shear strength test8 8 Test

16、procedure .8 8.1 Test sequence.8 8.2 Pre-conditioning 9 8.3 Initial shear strength9 8.4 Rapid change of temperature 9 8.5 Recovery.9 8.6 Intermediate / final shear strength .9 9 Items to be included in the test report.9 10 Items to be given in the product specification .10 Annex A (normative) Shear

17、strength test Details.14 Bibliography16 Figure 1 Area under evaluation in the shear strength test 5 Figure 2 Typical reflow soldering profile.8 Figure 3 Test procedure.9 Figure 4 Failure modes in shear strength test (5-faced electrodes) 11 Figure 5 Failure modes in shear strength test (two electrode

18、s type).12 Figure 6 Failure modes in shear strength test (switches)13 Figure A.1 Fixing of substrate for shear strength test .15 Figure A.2 Position of pushing tool (leadless components).15 3 EN 62137-1-2:2007Annex ZA (normative) Normative references to international publications with their correspo

19、nding European publications17 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-2: Shear strength test 1 Scope The test method described in this part of IEC 62137 is applicable to leadless surface mounting components and surface mounting conne

20、ctors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is

21、applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition

22、cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60068-2-14, Environmental testing Part 2-14: Test N: Change of temperature IEC 60194, Printed board design, man

23、ufacture and assembly Terms and definitions IEC 61188-5-2, Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting compon

24、ents (SMDs) IEC 61188-5-5, Printed boards and printed board assemblies Design and use Part 5-5: Sectional requirements - Attachment (land/joint) considerations Components with gull-wing leads on four sides1IEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Rei

25、nforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly IEC

26、 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 1In p

27、reparation. 4 EN 62137-1-2:2007NOTE Key terms used in this standard are taken mostly from IEC 60068-1 and IEC 60194. 3.1 shear strength maximum force applied parallel to the substrate and perpendicular to the specimen lateral surface to break the joint of SMD mounted on a board 3.2 displacement rate

28、 speed of the pushing tool, which is used to break the joint 3.3 shear height distance between the bottom surface of the pushing tool and the surface of the substrate 4 General remarks The mechanical properties of the joint between a terminal to a land on a printed wiring board using lead-free solde

29、r are not the same for the joint using tin-lead solder due to the difference in composing elements of the solders. Thus it becomes important to test the mechanical properties of solder joints, using different solder alloys, and after temperature cycling stresses have been applied. In this test metho

30、d, the test specimens are mounted on a substrate by reflow soldering. The durability of the solder joint is evaluated by exposing the electronic components to a rapid change of temperature and applying a shear stress to the solder joint. NOTE 1 The exposure temperatures in this test may exceed the r

31、ated temperature range of the specific electronic component. NOTE 2 This test is not a test to measure the strength of the electronic components. The test method to evaluate the robustness of the joint to a board is described in IEC 60068-2-21. The area of a joint to be evaluated is illustrated in F

32、igure 1. This shear strength test is applicable to most leadless surface mounting devices, except multi-leadless components (QFN, LGA etc.) and gull-wing lead components to which a pull strength test is applicable. Figure 1 Area under evaluation in the shear strength test Substrate Plated layers Sub

33、strate land SMD component Solder Evaluation area Intermetallic compound layers IEC 1260/07 5 EN 62137-1-2:20075 Test equipment and materials 5.1 Shear test equipment Unless otherwise specified, equipment with the following features shall be used for the shear test. The shear type strength test equip

34、ment shall have a mechanism to fasten a substrate with electronic component mounted on it. The equipment shall be capable of applying a shear force to the solder joint of the terminal of an electronic component, which is higher than the mechanical strength of the joint, so that it can break off the

35、joint. The equipment shall be capable of measuring the shear force. Preferably the distance between the tool used to apply the shear force and the substrate surface should be precisely controlled. 5.2 Pushing tool Unless otherwise specified, the pushing tool shall have the following properties: the

36、side of the pushing tool to apply a force to the side of a specimen shall be flat; the height of the tool shall be higher than the height of the specimen and the width of the jig shall be equal or larger than the width of a specimen to which a shear force is applied (see Figure A.2). 5.3 Optical mic

37、roscope The microscope shall be able to observe an object with a magnification approximately of 50X to 250X. It shall also be equipped with a lamp that can give an illumination level of approximately 2 000 lx to the object. 5.4 Scanning electron microscope (SEM) The scanning electron microscope shal

38、l be able to generate a focused electron beam probe of 3 nm to 10 nm using an electric lens system and can scan over a specimen held in a vacuum chamber. The SEM shall detect secondary electrons or reflected electrons and display an enlarged image of the detected signal on a CRT or another display d

39、evice. 5.5 Reflow soldering oven The reflow soldering oven shall be able to realize the temperature profile given in Figure 2. 5.6 Test substrate Unless otherwise prescribed by the relevant specification, the test shall be conducted on a specimen (device) mounted by its normal means on the following

40、 substrate. a) Material: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade (IEC 61249-2-7), with foil bonded to one side and a nominal thickness of the sheet, including the metal foil, of 1,6 mm with a tolerance of 0,20 mm. The copper foil shall have a thickness of 0,035

41、mm 0,010 mm. b) Size: The size of the substrate depends on the size and shape of a surface mount device soldered on the substrate. The substrate shall be able to be fastened to the shearing test equipment. c) Land geometry: The shape and size of a land shall comply with IEC 61188-5-2 or the land geo

42、metry recommended by the respective component supplier. Since IEC 61188-5-5 provides for three different land pattern geometries, and different suppliers provide different recommendations, the relationship between the component gull-wing foot print and the land pattern used in the testing shall be r

43、ecorded in accordance with the following: land protrusion at the lead toe: minimum; 6 EN 62137-1-2:2007 land protrusion at the lead heel: minimum; land protrusion at the lead side: minimum. d) Surface protection: The solderable areas of the substrate (lands) shall be protected against oxidization by

44、 suitable means, e.g. by an organic surface protection layer (OSP). This protective layer shall not adversely have an effect on the solderability of the lands under the soldering conditions of the reflow soldering equipment described in Clause 6. 5.7 Solder alloy Unless otherwise specified, the sold

45、er alloy shall consist of a ternary composition of Sn, Ag and Cu with the Ag content ranking from 3,0 % to 4,0 % by weight and the Cu content ranking from 0,5 % to 1,0 % by weight with Sn for balance, e.g. SnAg3.0Cu0.5. The solder alloy shall be in accordance with IEC 61190-1-3. 5.8 Solder paste Unl

46、ess otherwise specified, the solder paste used in this test shall comply with IEC 61190-1-2. The solder alloy specified in 5.7 shall be used for the solder paste. 6 Mounting method for reflow soldering The following steps shall be taken:a) Apply the solder paste specified in 5.8 to the lands of a te

47、st substrate as specified in 5.6, using a metal mask with openings of the same size, shape and configuration as the lands on the substrate, made of stainless steel with a thickness of 100 m to 150 m. b) Mount the test specimen on the test substrate with solder paste applied. c) Use the reflow-solder

48、ing equipment specified in 5.5 to solder the terminals under the conditions given below. A typical temperature profile of reflow soldering is given in Figure 2, as proposed in IEC 61760-1. The temperature is measured at the land. 7 EN 62137-1-2:2007300 250 200 150 100 50 0 0 30 60 90 120 150 180 210

49、 240 270 300 330 360 220 C235 C245 C250 C180 C150 C TypicalRamp up rate 220 C SnAgCu Reflow Preheating Continous line: typical process (terminal temperaure) Dotted line: process limits. Bottom process limit (terminal temperature). Upper process limit (top surface tmperature)Temperature CTime s IEC 1176/07 Figure 2 Typical reflow soldering profile 7 Test conditions 7.1 Test: Rapid change of temperature Un