BS EN 62258-2-2011 Semiconductor die products Exchange data formats《半导体压模制品 交换数据格式 》.pdf

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor die productsPart 2: Exchange data formatsBS EN 62258-2:2011National forewordThis British Standard is the UK implementation of EN 62258-2:2011. It is identical to IE

2、C 62258-2:2011. It supersedes BS EN 62258-2:2005 which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport

3、to include all the necessary provisions of a contract. Users are responsible for its correct application. BSI 2011ISBN 978 0 580 61892 5 ICS 31.080.99Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standa

4、rds Policy and Strategy Committee on 31 July 2011.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62258-2:2011EUROPEAN STANDARD EN 62258-2 NORME EUROPENNE EUROPISCHE NORM July 2011 CENELEC European Committee for Electrotechnical Standardization Comit Europen de No

5、rmalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62258-2:2011 E ICS 31.080.99 Supersedes EN 6

6、2258-2:2005English version Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011) Produits de puces de semiconducteurs - Partie 2: Formats dchange de donnes (CEI 62258-2:2011) Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate (IEC 62258-2:2011) This European Standar

7、d was approved by CENELEC on 2011-06-29. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning

8、 such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its o

9、wn language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ire

10、land, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 62258-2:2011EN 62258-2:2011 - 2 - Foreword The text of document 47/2085/FDIS, future edition 2 of IEC 62258-2, prepared

11、by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62258-2 on 2011-06-29. This European Standard supersedes EN 62258-2:2005. With respect to EN 62258-2:2005, the following parameters have been updated for EN 62258-2:2011: Subclause P

12、arameter name8.2.9 DEVICE_PICTURE_FILE 8.2.10 DEVICE_DATA_FILE 8.4.6 TERMINAL_GROUP 8.4.7 PERMUTABLE 8.5.1 TERMINAL_MATERIAL (was DIE_TERMINAL_MATERIAL) 8.5.2 TERMINAL_MATERIAL_STRUCTURE 8.6.2 MAX_TEMP_TIME 8.7.6 SIMULATOR_simulator_TERM_GROUP 8.8.3 ASSEMBLY 8.9.2 WAFER_THICKNESS 8.9.3 WAFER_THICKNE

13、SS_TOLERANCE 8.9.9 WAFER_INK 8.10.4 BUMP_SHAPE 8.10.5 BUMP_SIZE 8.10.6 BUMP_SPECIFICATION_DRAWING 8.10.7 BUMP_ATTACHMENT_METHOD 8.11.4 MPD_MSL_LEVEL 8.11.5 MPD_PACKAGE_DRAWING 8.12.1 QUALITY 8.12.2 TEST 8.13.1 TEXT 8.14.1 PARSE This standard shall be read in conjunction with EN 62258-1. Attention is

14、 drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates were fixed: latest date by which the EN has to be implemented at national level b

15、y publication of an identical national standard or by endorsement (dop) 2012-03-29 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2014-06-29 Annex ZA has been added by CENELEC. _ BS EN 62258-2:2011- 3 - EN 62258-2:2011 Endorsement notice The text of th

16、e International Standard IEC 62258-2:2011 was approved by CENELEC as a European Standard without any modification. _ BS EN 62258-2:2011EN 62258-2:2011 - 4 - Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced

17、 documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifi

18、cations, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 61360-4 2005 Standard data element types with associated classification scheme for electric components -Part 4: IEC reference collection of standard data element types and component classes EN 61360-4 + co

19、rr. December 2005 2005 IEC 62258-1 - Semiconductor die products - Part 1: Procurement and use EN 62258-1 - ISO 6093 1985 Information processing - Representation of numerical values in character strings for information interchange - - ISO 8601 2004 Data elements and interchange formats - Information

20、interchange - Representation of dates and times - - ISO 10303-21 2002 Industrial automation systems and integration - Product data representation and exchange - Part 21: Implementation methods: Clear text encoding of the exchange structure - - IPC/JEDEC J-STD-033B 2007 Handling, Packing, Shipping an

21、d Use of Moisture/Reflow Sensitive Surface Mount Devices - - BS EN 62258-2:2011 2 62258-2 IEC:2011 CONTENTS INTRODUCTION . 7 1 Scope and object 8 2 Normative references 8 3 Terms and definitions . 9 4 Requirements . 9 5 Device Data eXchange format (DDX) file goals and usage. 9 6 DDX file format and

22、file format rules . 9 6.1 Data validity . 10 6.2 Character set . 10 6.3 SYNTAX RULES 10 7 DDX file content 11 7.1 DDX file content rules 11 7.1.1 Block structure . 11 7.1.2 Parameter types 11 7.1.3 Data types . 11 7.1.4 Forward references 12 7.1.5 Units 12 7.1.6 Co-ordinate data 12 7.1.7 Reserved wo

23、rds . 12 7.2 DDX DEVICE block syntax . 13 7.3 DDX data syntax 14 8 Definitions of DEVICE block parameters . 14 8.1 BLOCK DATA 15 8.1.1 DEVICE_NAME Parameter 15 8.1.2 DEVICE_FORM Parameter 16 8.1.3 BLOCK_VERSION Parameter 16 8.1.4 BLOCK_CREATION_DATE Parameter . 16 8.1.5 VERSION Parameter . 16 8.2 DE

24、VICE DATA . 16 8.2.1 DIE_NAME Parameter . 16 8.2.2 DIE_PACKAGED_PART_NAME Parameter 16 8.2.3 DIE_MASK_REVISION Parameter . 17 8.2.4 MANUFACTURER Parameter 17 8.2.5 DATA_SOURCE Parameter . 17 8.2.6 DATA_VERSION Parameter 17 8.2.7 FUNCTION Parameter . 17 8.2.8 IC_TECHNOLOGY Parameter 18 8.2.9 DEVICE_P

25、ICTURE_FILE Parameter 18 8.2.10 DEVICE_DATA_FILE Parameter 18 8.3 GEOMETRIC DATA . 19 8.3.1 GEOMETRIC_UNITS Parameter 19 8.3.2 GEOMETRIC_VIEW Parameter . 19 8.3.3 GEOMETRIC_ORIGIN Parameter 19 8.3.4 SIZE Parameter . 20 8.3.5 SIZE_TOLERANCE Parameter. 20 BS EN 62258-2:201162258-2 IEC:2011 3 8.3.6 THI

26、CKNESS Parameter . 21 8.3.7 THICKNESS_TOLERANCE Parameter . 21 8.3.8 FIDUCIAL_TYPE Parameter 21 8.3.9 FIDUCIAL Parameter . 23 8.4 TERMINAL DATA 24 8.4.1 TERMINAL_COUNT Parameter 24 8.4.2 TERMINAL_TYPE_COUNT Parameter . 24 8.4.3 CONNECTION_COUNT Parameter 24 8.4.4 TERMINAL_TYPE Parameter . 25 8.4.5 T

27、ERMINAL Parameter . 26 8.4.6 TERMINAL_GROUP Parameter . 29 8.4.7 PERMUTABLE Parameter 31 8.5 MATERIAL DATA 32 8.5.1 TERMINAL_MATERIAL Parameter . 32 8.5.2 TERMINAL_MATERIAL_STRUCTURE Parameter 32 8.5.3 DIE_SEMICONDUCTOR_MATERIAL Parameter 32 8.5.4 DIE_SUBSTRATE_MATERIAL Parameter 33 8.5.5 DIE_SUBSTR

28、ATE_CONNECTION Parameter 33 8.5.6 DIE_PASSIVATION_MATERIAL Parameter 33 8.5.7 DIE_BACK_DETAIL Parameter 34 8.6 ELECTRICAL AND THERMAL RATING DATA 34 8.6.1 MAX_TEMP Parameter 34 8.6.2 MAX_TEMP_TIME Parameter 34 8.6.3 POWER_RANGE Parameter 34 8.6.4 TEMPERATURE_RANGE Parameter . 34 8.7 SIMULATION DATA

29、. 35 8.7.1 Simulator MODEL FILE Parameter . 35 8.7.2 Simulator MODEL FILE DATE Parameter . 35 8.7.3 Simulator NAME Parameter . 35 8.7.4 Simulator VERSION Parameter 35 8.7.5 Simulator COMPLIANCE Parameter . 36 8.7.6 Simulator TERM_GROUP Parameter . 36 8.8 HANDLING, PACKING, STORAGE and ASSEMBLY DATA

30、. 36 8.8.1 DELIVERY_FORM Parameter 36 8.8.2 PACKING_CODE Parameter 36 8.8.3 ASSEMBLY Parameters . 36 8.9 WAFER SPECIFIC DATA 37 8.9.1 WAFER_SIZE Parameter . 37 8.9.2 WAFER_THICKNESS Parameter . 37 8.9.3 WAFER_THICKNESS_TOLERANCE Parameter . 37 8.9.4 WAFER_DIE_STEP_SIZE Parameter . 38 8.9.5 WAFER_GRO

31、SS_DIE_COUNT Parameter . 38 8.9.6 WAFER_INDEX Parameter 38 8.9.7 WAFER_RETICULE_STEP_SIZE Parameter 38 8.9.8 WAFER_RETICULE_GROSS_DIE_COUNT Parameter 39 8.9.9 WAFER_INK Parameters . 39 8.10 BUMP TERMINATION SPECIFIC DATA . 39 8.10.1 BUMP_MATERIAL Parameter 39 BS EN 62258-2:2011 4 62258-2 IEC:2011 8.

32、10.2 BUMP_HEIGHT Parameter 40 8.10.3 BUMP_HEIGHT_TOLERANCE Parameter 40 8.10.4 BUMP_SHAPE Parameter 40 8.10.5 BUMP_SIZE Parameter . 40 8.10.6 BUMP_SPECIFICATION_DRAWING Parameter . 41 8.10.7 BUMP_ATTACHMENT_METHOD Parameter . 41 8.11 MINIMALLY PACKAGED DEVICE (MPD) SPECIFIC DATA . 41 8.11.1 MPD_PACK

33、AGE_MATERIAL Parameter 41 8.11.2 MPD_PACKAGE_STYLE Parameter 41 8.11.3 MPD_CONNECTION_TYPE Parameter 42 8.11.4 MPD_MSL_LEVEL Parameter 42 8.11.5 MPD_PACKAGE_DRAWING Parameter . 42 8.12 QUALITY, RELIABILITY and TEST DATA 42 8.12.1 QUALITY Parameters 42 8.12.2 TEST Parameters 43 8.13 OTHER DATA 43 8.1

34、3.1 TEXT Parameters 43 8.14 CONTROL DATA . 43 8.14.1 PARSE Parameters . 43 Annex A (informative) An example of a DDX DEVICE block 47 Annex B (informative) Groups and Permutation 49 Annex C (informative) A Typical CAD view from the DDX file block example given in Annex A 52 Annex D (informative) Prop

35、erties for Simulation 53 Annex E (informative) TERMINAL and TERMINAL_TYPE graphical usage for CAD/CAM systems 55 Annex F (informative) Cross-reference with IEC 61360-4 58 Annex G (informative) Notes on VERSION and NAME parameters 61 Annex H (informative) Notes on WAFER parameters 62 Annex I (informa

36、tive) Additional notes 64 Annex J (informative) DDX Version history . 65 Annex K (informative) Parse Control . 68 Figure 1 Relationship between geometric centre and geometric origin . 20 Figure C.1 CAD representation of DDX example from Annex A . 52 Figure E.1 Highlighting the MX and MY orientation

37、properties . 56 Figure E.2 Highlighting the angular rotational orientation properties 57 Figure H.1 Illustrating the WAFER parameters 63 Table 1 Terminal shape types . 25 Table 2 Terminal shape co-ordinates 26 Table 3 Terminal IO types 28 Table 4 Substrate Connection Parameters 33 Table F.1 Paramete

38、r List 58 Table J.1 Parameter Change History List 65 BS EN 62258-2:201162258-2 IEC:2011 7 INTRODUCTION This International Standard is based on the work carried out in the ESPRIT 4thFramework project GOODDIE which resulted in publication of the ES 59008 series of European specifications. Organisation

39、s that helped prepare this document include the ESPRIT ENCAST and ENCASIT projects, the Die Products Consortium, JEITA, JEDEC and ZVEI. The structure of this International Standard as currently conceived is as follows: Under main title: IEC 62258: Semiconductor die products Part 1: Procurement and u

40、se Part 2: Exchange data formats Part 3: Recommendations for good practice in handling, packing and storage (Technical report) Part 4: Questionnaire for die users and suppliers (Technical report) Part 5: Requirements for information concerning electrical simulation Part 6: Requirements for informati

41、on concerning thermal simulation Part 7: XML schema for data exchange (Technical report) Part 8: EXPRESS model schema for data exchange (Technical report) Further parts may be added as required. BS EN 62258-2:2011 8 62258-2 IEC:2011 SEMICONDUCTOR DIE PRODUCTS Part 2: Exchange data formats 1 Scope an

42、d object This Part of IEC 62258 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX)

43、 format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been

44、 kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to: wafers, singulated bare die, die and wafers with attached connection structures, minimally or partia

45、lly encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edit

46、ion of the referenced document (including any amendments) applies. IEC 62258-1, Semiconductor die products Part 1: Procurement and use IEC 61360-4:2005, Standard data element types with associated classification scheme for electric components Part 4: IEC reference collection of standard data element

47、 types, component classes303-21 ISO 8601:2004, Data elements and interchange formats Information interchange Representation of dates and times ISO 6093:1985, Information processing Representation of numerical values in character strings for information interchange IPC/JEDEC J-STD-033B:2007, Handling

48、, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices ISO 10303-21:2002, Industrial automation systems and integration Product data representation and exchange Part 21: Implementation methods: Clear text encoding of the exchange structure BS EN 62258-2:201162258-2 IEC:2011 9

49、 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 62258-1 apply. 4 Requirements Specific reference for parameter variables is made to the IEC 61360 data element type (DET) codes, which are defined in Part 4 of IEC 61360. 5 Device Data eXchange format (DDX) file goals and usage 5.1 To facilitate the transferral of data by electronic media from the device vendor to the end-user for use within a CAD or CAE system, a d