BS EN 62496-2-2-2011 Optical circuit boards Measurements Dimensions of optical circuit boards《光学电路板 测量 光学电路板尺寸规格》.pdf

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationOptical circuit boardsPart 2-2: Measurements Dimensions of optical circuit boardsBS EN 62496-2-2:2011National forewordThis British Standard is the UK implementation of EN 62496-2

2、-2:2011. It is identical to IEC 62496-2-2:2011.The UK participation in its preparation was entrusted to Technical Committee GEL/86, Fibre optics.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the nece

3、ssary provisions of a contract. Users are responsible for its correct application. BSI 2011ISBN 978 0 580 69815 6 ICS 33.180.01Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy

4、 Committee on 30 June 2011.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62496-2-2:2011EUROPEAN STANDARD EN 62496-2-2 NORME EUROPENNE EUROPISCHE NORM March 2011 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electr

5、otechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62496-2-2:2011 E ICS 33.180.01 English version Optical circuit

6、 boards - Part 2-2: Measurements - Dimensions of optical circuit boards (IEC 62496-2-2:2011) Cartes circuits optiques - Partie 2-2: Mesures - Dimensions des cartes circuits optiques (CEI 62496-2-2:2011) Optische Leiterplatten - Teil 2-2: Messungen - Abmessungen optischer Leiterplatten (IEC 62496-2-2

7、:2011) This European Standard was approved by CENELEC on 2011-03-03. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliogra

8、phical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of

9、 a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, G

10、reece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 62496-2-2:2011EN 62496-2-2:2011 - 2 - Foreword The text of document 86/378/FDIS, future edit

11、ion 1 of IEC 62496-2-2, prepared by IEC TC 86, Fibre optics, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62496-2-2 on 2011-03-03. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical na

12、tional standard or by endorsement (dop) 2011-12-03 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2014-03-03 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 62496-2-2:2011 was approved by CENELEC as a

13、 European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60793-2 NOTE Harmonized as EN 60793-2. IEC 62496 series NOTE Harmonized in EN 62496 series. _ BS EN 62496-2-2:2011- 3 - EN 62496-2-2:2011 Anne

14、x ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest editi

15、on of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068-1 - Environmental testing - Part 1: General and guidance EN

16、60068-1 - IEC 60793-1-45 (mod) - Optical fibres - Part 1-45: Measurement methods and test procedures - Mode field diameter EN 60793-1-45 - IEC 61189-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for

17、interconnection structures EN 61189-2 - IEC 62496-2-1 - Optical circuit boards - Basic test and measurement procedures - Part 2-1: Measurements - Optical attenuation and isolation FprEN 62496-2-1 - IEC 62496-4 - Optical circuit boards - Part 4: Interface standards - General and guidance FprEN 62496-

18、4 - ISO 10360-2 - Geometrical product specifications (GPS) - Acceptance and reverification tests for coordinate measuring machines (CMM) - Part 2: CMMs used for measuring linear dimensions EN ISO 10360-2 - BS EN 62496-2-2:2011 2 62496-2-2 IEC:2011 CONTENTS 1 Scope . . 6 2 Normative references . 6 3

19、Terms and definitions . 6 4 Measurement condition 7 5 Objects to be measured and their procedures . 7 6 Measurement procedures for dimensions . 7 6.1 Core shape 7 6.1.1 Measuring equipment 7 6.1.2 Procedure 9 6.2 Coordinates of I/O ports . 9 6.2.1 Measurement procedure for end face I/O type OCB . 9

20、6.2.2 Measurement procedure for surface I/O port type OCB . 11 6.3 Outer shape of optical circuit board . 14 6.3.1 Method 1 (reference) Use of observation system 14 6.3.2 Method 2 (alternative) Use of dimensional drawing . . 15 6.4 Misalignment angle of I/O ports 16 6.4.1 Observation of cross sectio

21、n . 16 6.5 Mirror angle 19 6.5.1 Method 1 (reference) Use of observation system 19 6.5.2 Method 2 (alternative) Use of confocal microscope . . 20 6.6 Hole . . 21 6.6.1 Method 1 (reference) Use of observation system 21 6.6.2 Method 2 (alternative) Use of laser scanning . . 22 Annex A (informative) Pa

22、ttern pitch 24 Bibliography . 27 Figure 1 Example of measuring equipment capable of observing core shape . 8 Figure 2 Example of sample set-up for observation of core shape (end face I/O type OCB or a sliced sample) 8 Figure 3 Example of sample set-up using a halogen lamp house with light-guide fibr

23、e for observation of core shape (surface I/O type OCB) . 9 Figure 4 Example of optical position adjustment system for end face I/O type OCB 10 Figure 5 Example of optical position adjustment system for surface I/O type OCB 13 Figure 6 Example of verification with a dimensional drawing for a fibre fl

24、exible OCB . 16 Figure 7 Misalignment angle of I/O ports in end face I/O type OCB 17 Figure 8 Misalignment angle of I/O ports in surface I/O type OCB 17 Figure 9 Parameters for misalignment angle in end face I/O type OCB . 18 Figure 10 Parameters for misalignment angle in surface I/O type OCB . 18 F

25、igure 11 Schematic diagram of the mirror angle measurement using a confocal microscope . . 21 Figure 12 Example of the profile at a mirror portion using a confocal microscope . . 21 Figure A.1 Pattern pitch and objects of measurement (an example of single layer) . 24 Figure A.2 Pattern pitch and obj

26、ects of measurement (an example of multi-layer) . 25 BS EN 62496-2-2:201162496-2-2 IEC:2011 3 Table 1 Objects to be measured and their methods . 7 BS EN 62496-2-2:2011 6 62496-2-2 IEC:2011 OPTICAL CIRCUIT BOARDS Part 2-2: Measurements Dimensions of optical circuit boards 1 Scope This part of IEC 624

27、96 specifies the measurement procedures for dimensions related to interface information of optical circuit boards (OCB), defined in IEC 62496-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition ci

28、ted applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60793-1-45, Optical fibres Part 1-45: Measurement methods and test procedures Mode field diameter IEC 61189-2, Te

29、st methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures IEC 62496-2-1, Optical circuit boards Part 2-1: Measurements Optical attenuation and isolation1IEC 62496-4, Optical circuit boards

30、 Part 4: Interface standards General and guidance ISO 10360-2, Geometrical product specifications (GPS) Acceptance and reverification tests for coordinate measuring machines (CMM) Part 2: CMMs used for measuring linear dimensions 3 Terms and definitions For the purposes of this document, the followi

31、ng terms and definitions apply. 3.1 optical position adjusting system consists of a light source, fibre position adjustment stage, OCB holder, input/output fibre and a power meter. The optimum fibre launch position, at which the optical output power is maximised, is determined through alignment of t

32、he input/output fibres to the OCB and monitoring the output power from the OCB 3.2 dimensional drawing illustration, including dashed lines, which defines classified OCB or OCB body shape accuracy using the origin point or alignment mark as the standard point _ 1To be published. BS EN 62496-2-2:2011

33、62496-2-2 IEC:2011 7 4 Measurement condition All the measurements are made under the conditions specified in IEC 60068-1, unless otherwise specified. Measurements may be made under different conditions to the standard conditions if the standard conditions are difficult to achieve, as long as the act

34、ual measurement condition does not give rise to any doubt as to the result of the measurement. 5 Objects to be measured and their procedures Objects to be measured as dimensions of OCB are stated in IEC 62496-4. The objects and their methods are summarized in Table 1. This standard specifies mainly

35、mechanical procedures using observation systems for dimensions of OCBs. Table 1 Objects to be measured and their methodsMethod 1 (reference) Method 2 (alternative) Observation system Optical position adjustment Dimensional drawing Confocal microscope Laser scanning Core shape O Coordinates of I/O po

36、rt O O Outer shape of OCB O O Misalignment angles of I/O O Mirror O O Hole O O 6 Measurement procedures for dimensions 6.1 Core shape 6.1.1 Measuring equipment 6.1.1.1 General The measuring equipment consists of observation, shape measuring and data processing systems. The measurement system shall g

37、ive reproducible results. An example of a total measuring system is illustrated in Figure 1. Structural parameters for circlar core shape are obtained by near field pattern observation of cross section specified in IEC 60793-1-45. 6.1.1.2 Observation system The observation system detects a core shap

38、e by an optical microscope with resolution of less than 1 % of designated dimension. It is necessary to select appropriate lighting, magnification, detection system and fibre positioning system to obtain sufficient measurement accuracy, but x10 to x80 for the object lens and x10 for the eyepiece see

39、m appropriate. A camera is also used for the observation of large core shape. An example of sample set-up for the observation is illustrated in Figures 2 and 3. A light is launched in the vicinity of one of I/O ports. The output light from the sample is detected from the other one by the observation

40、 system. A movable stage or the observation system can have the measuring function. The movable stage should be controllable in x, y and z axes and vertical and horizontal rotations, independently. BS EN 62496-2-2:2011 8 62496-2-2 IEC:2011 6.1.1.3 Data processing system The data processing system ha

41、s the capability of analyzing image information taken from the observation system and calculates structural parameters of core shape. Observation systemOCBMovable stage with scaleData processing systemObservation system Data processing sytem Movable stage with scale OCB IEC 001/11 Figure 1 Example o

42、f measuring equipment capable of observing core shape Figure 2 Example of sample set-up for observation of core shape (end face I/O type OCB or a sliced sample) Light sourceObservation by microscope Exposure Light-guide (optional) End face tyoe OCBor Sliced OCBMovable stageIEC 002/11BS EN 62496-2-2:

43、201162496-2-2 IEC:2011 9 Figure 3 Example of sample set-up using a halogen lamp house with light-guide fibre for observation of core shape (surface I/O type OCB) 6.1.2 Procedure a) Preparation When the core shape which is not an I/O port is measured, an OCB is cut with a blade to a smooth surface at

44、 a right angle to the core pattern. The OCB is set-up to observe I/O ports or a sliced surface, as illustrated in Figures 2 and 3. The magnification of an optical microscope is calibrated before measurement. b) Measurement Adjust the focus of the optical microscope at the position where the core sha

45、pe can be observed by moving the movable stage or the optical microscope. The core shape is determined by processing of image information coming from the observation system. It is possible to confirm the distance to the object under measurement if the optical microscope has a distance measuring capa

46、bility. The six structural parameters for a square core shape are obtained by data analysis of the core shape according to definitions of their parameters in IEC 62496-4. 6.2 Coordinates of I/O ports 6.2.1 Measurement procedure for end face I/O type OCB 6.2.1.1 Method 1 (reference) Use of observatio

47、n system 6.2.1.1.1 Measuring equipment The measuring equipment stated in 6.1.1 shall be used. 6.2.1.1.2 Procedure One example of measurement procedure is described below. a) Preparation The sample is fastened to the movable stage using a jig to attain flatness and to prevent it from moving while mea

48、suring. b) Measurement Light sourceObservation by microscope ExposureWaveguide layerElectric circuit layerMirror MirrorLight-guide (optional) Movable stageSurface I/O type OCB Output light from OCB IEC 003/11BS EN 62496-2-2:2011 10 62496-2-2 IEC:2011 Align the direction of the coordinate axis and th

49、at of the movement of the movable stage to obtain horizontal reference. Move the microscope to the coordinate origin to define its coordinate to origin point. The origin point should be selected to the centre of the origin point structure for an external coordinate system, and to the core centre when the origin is specified by a coordinate of a specific core centre for internal coordinate system. Then m