BS EN 62739-2-2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing《使用熔融无铅焊料合.pdf

1、Test method for erosion of wave soldering equipment using molten lead-free solder alloyPart 2: Erosion test method for metal materials with surface processingBS EN 62739-2:2016BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is t

2、he UK implementation of EN 62739-2:2016. It isidentical to IEC 62739-2:2016.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This public

3、ation does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 88996 7ICS 31.190; 31.240Compliance with a British Standard cannot confer immun

4、ity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 October 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62739-2:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62

5、739-2 October 2016 ICS 31.190; 31.240 English Version Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (IEC 62739-2:2016) Mthode dessai de lrosion de lquipement de brasage la vague utilis

6、ant un alliage braser sans plomb fondu - Partie 2: Mthode dessai drosion de matriaux mtalliques avec traitement de surface (IEC 62739-2:2016) Verfahren zur Erosionsprfung fr Wellenltausrstungen bei Verwendung von geschmolzener, bleifreier Lotlegierung - Teil 2: Erosionsprfverfahren fr metallische We

7、rkstoffe mit Oberflchenbehandlung (IEC 62739-2:2016) This European Standard was approved by CENELEC on 2016-08-17. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without

8、any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other

9、language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,

10、 the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the U

11、nited Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any form and by any mean

12、s reserved worldwide for CENELEC Members. Ref. No. EN 62739-2:2016 E BS EN 62739-2:2016EN 62739-2:2016 European foreword The text of document 91/1365/FDIS, future edition 1 of IEC 62739-2, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and appr

13、oved by CENELEC as EN 62739-2:2016. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2017-05-17 latest date by which the national standards conflicting with the document h

14、ave to be withdrawn (dow) 2019-08-17 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International

15、Standard IEC 62739-2:2016 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60194:2015 NOTE Harmonized as EN 60194:2016. IEC 62739-1:2013 NOTE Harmonized as EN 6273

16、9-1:2013. BS EN 62739-2:2016EN 62739-2:2016 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. Fo

17、r dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-

18、to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-f

19、luxed solid solders for electronic soldering applications EN 61190-1-3 - BS EN 62739-2:2016 2 IEC 62739-2:2016 IEC 2016 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references. 5 3 Terms and definitions 5 4 Test 6 4.1 General . 6 4.2 Test equipment . 6 4.2.1 Test equipment description 6 4.2.2 Configu

20、ration example of test equipment 6 4.3 Specimen 7 4.4 Test conditions 8 4.5 Test methods 9 4.5.1 Method A Without bending . 9 4.5.2 Method B Accelerated in bended state . 10 4.5.3 Dross removal procedure . 11 5 Erosion depth measurement 11 5.1 General . 11 5.2 Preparation of the specimen 11 5.3 Meas

21、urement equipment . 12 5.4 Measurement procedure 12 6 Items to be recorded in test report . 13 Annex A (normative) Specifications of test equipment and measurement equipment . 14 A.1 Overview. 14 A.2 Characteristics of the test equipment . 14 A.2.1 General . 14 A.2.2 Pot unit 14 A.2.3 Rotation unit

22、14 A.2.4 Control unit 14 A.2.5 Ventilation . 15 A.3 Accuracy of the measurement equipment . 15 A.3.1 General . 15 A.3.2 Measurement accuracy 15 Bibliography . 16 Figure 1 Configuration example of test equipment 7 Figure 2 Shape of the specimen . 8 Figure 3 Example of a specimen attachment state with

23、out bending . 10 Figure 4 Example of a specimen attachment state with 2 mm bending . 11 Figure 5 Example of measurement equipment configuration for the focal depth method using an optical microscope 12 Table 1 Test conditions 9 BS EN 62739-2:2016IEC 62739-2:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHN

24、ICAL COMMISSION _ TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY Part 2: Erosion test method for metal materials with surface processing FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

25、 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards,

26、 Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparator

27、y work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organization

28、s. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of reco

29、mmendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by a

30、ny end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional pu

31、blication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by inde

32、pendent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any

33、 personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normativ

34、e references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsib

35、le for identifying any or all such patent rights. International Standard IEC 62739-2 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1365/FDIS 91/1379/RVD Full information on the

36、 voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 62739-2:2016 4 IEC 62739-2:2016 IEC 2016 A list of all parts in the IEC 62739 series, published unde

37、r the general title Test method for erosion of wave soldering equipment using molten lead-free solder alloy, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webst

38、ore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN 62739-2:2016IEC 62739-2:2016 IEC 2016 5 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY

39、Part 2: Erosion test method for metal materials with surface processing 1 Scope This part of IEC 62739 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components

40、 which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its

41、application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxe

42、d and non-fluxed solid solders for electronic soldering applications 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1 erosion phenomenon where a base material is dissolved and made thinner by coming into contact with molten solder SOURCE: IEC

43、62739-1:2013, 3.1 3.2 lead-free solder alloy that does not contain more than 0,1 % lead (Pb) by weight and used for joining components to substrates or for coating surfaces SOURCE: IEC 60194:2015, 75.1904 3.3 dross oxide and other contaminants that form on the surface of molten solder SOURCE: IEC 60

44、194:2015, 75.0410 BS EN 62739-2:2016 6 IEC 62739-2:2016 IEC 2016 4 Test 4.1 General The specimen is mounted to the rotation block of the test equipment which is driven by the motor (may include gear unit) then immersed into molten lead-free solder and rotated to simulate solder flow in the wave sold

45、ering equipment. The erosion depth is measured after the block is rotated for a designated period of time. 4.2 Test equipment 4.2.1 Test equipment description Test equipment shall include equipment that realises the test conditions specified in 4.4. Component materials of the test equipment which co

46、me in contact with molten solder shall be erosion resistant or processed to be erosion resistant. Details of the specifications of the equipment are given in Annex A. 4.2.2 Configuration example of test equipment An example of the configuration of the test equipment is shown in Figure 1. The test eq

47、uipment consists of a pot unit, rotation unit, and control unit: a) the pot unit consists of a heater to melt the lead-free solder alloy and a pot in which a specimen can rotate. b) the rotation unit consists of a motor which rotates the specimen and a rotation block to which the specimen is attache

48、d. c) the control unit has functions to control the heater, using a temperature sensor, control mechanism and motor rotation. Since dross spreads during the test, it is preferable for the test equipment to have a ventilatory function with an exhaust air duct. Other test equipment can be used if its

49、configuration and functions meet the above requirements. BS EN 62739-2:2016IEC 62739-2:2016 IEC 2016 7 Figure 1 Configuration example of test equipment 4.3 Specimen A specimen of the following material and shape is used. a) The surface processing of the specimen shall be the same as that of the solder bath and its components which come into contact with the molten solder. b) The shape of specimen and the indication of the surface processing designation shall