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本文(BS EN 62739-3-2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3 Selection guidance of erosion test methods《使用熔融无铅焊料合金的波峰焊设备侵蚀试验方.pdf)为本站会员(orderah291)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

BS EN 62739-3-2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3 Selection guidance of erosion test methods《使用熔融无铅焊料合金的波峰焊设备侵蚀试验方.pdf

1、Test method for erosion of wave soldering equipment using molten lead- free solder alloyPart 3: Selection guidance of erosion test methodsBS EN 62739-3:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation

2、 of EN 62739-3:2017. It isidentical to IEC 62739-3:2017. The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purp

3、ort to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2017.Published by BSI Standards Limited 2017ISBN 978 0 580 93580 0IICS 31.190; 31.240Compliance with a British Standard cannot confer immunity fromlegal obli

4、gations.This Published Document was published under the authority of theStandards Policy and Strategy Committee on 30 April 2017.Amendments/corrigenda issued since publicationDate Text affectedPUBLISHED DOCUMENTBS EN 62739-3:2017EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62739-3 March 2017

5、 ICS 31.190; 31.240 English Version Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (IEC 62739-3:2017) Mthode dessai de lrosion de lquipement de brasage la vague utilisant un alliage braser sans plomb fondu

6、- Partie 3: Document dorientation pour le choix des mthodes dessai drosion (IEC 62739-3:2017) Verfahren zur Erosionsprfung fr Wellenltausrstungen bei Verwendung von geschmolzener, bleifreier Lotlegierung - Teil 3: Leitfaden fr die Auswahl von Verfahren zur Erosionsprfung (IEC 62739-3:2017) This Euro

7、pean Standard was approved by CENELEC on 2017-02-10. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical reference

8、s concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN

9、ELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugosla

10、v Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical

11、 Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN

12、62739-3:2017 E EN 62739-3:2017 2 European foreword The text of document 91/1368/CDV, future edition 1 of IEC 62739-3, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62739-3:2017. The following dates are fixed: late

13、st date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2017-11-10 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-02-10 Attention is drawn to the possibil

14、ity that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62739-3:2017 was approved by CENELEC as a European Standar

15、d without any modification. BS EN 62739-3:2017EN 62739-3:2017 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for i

16、ts application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD a

17、pplies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 60068-2-20 2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to sold

18、ering heat of devices with leads EN 60068-2-20 2008 IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 - IEC 62739-1 2013 Test method for e

19、rosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing EN 62739-1 2013 IEC 62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for

20、metal materials with surface processing EN 62739-2 - BS EN 62739-3:2017 2 IEC 62739-3:2017 IEC 2017 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 General remarks 7 5 Selection of the appropriate erosion test method . 8 5.1 Correlation between test methods and s

21、tresses induced in the field 8 5.2 Recommended test method by materials . 9 6 Common items for each test method 10 6.1 Specimen preparation . 10 6.2 Solder alloy . 10 6.3 Accelerated stress conditions 10 6.3.1 Test temperature . 10 6.3.2 Rotation speed 10 6.3.3 Bending stress to the specimen . 11 6.

22、4 Dross 11 6.4.1 Dross generation and removal interval . 11 6.4.2 Dross removal method . 11 6.4.3 Molten solder volume after dross removal 11 6.5 Erosion depth measurement method . 11 6.5.1 Post test treatment 11 6.5.2 Local erosion depth . 12 6.5.3 General (uniform) erosion depth 13 6.5.4 Evaluatio

23、n . 14 7 Overview of the test methods 14 7.1 Test methods 14 7.2 Metal material without surface processing . 14 7.2.1 General . 14 7.2.2 Rotation test at 350 C 15 7.3 Metal material with surface processing 16 7.3.1 Test method 16 7.3.2 Rotation test at 450 C 16 7.3.3 Rotation test at 450 C with 2 mm

24、 bending 17 Annex A (informative) Selection of test temperature, test duration and bending stress 18 A.1 Specimen without surface processing . 18 A.2 Specimen with surface processing 20 Annex B (informative) Maximum depth and other measurements . 23 B.1 General . 23 B.2 Maximum depth measurement 23

25、Annex C (informative) Erosion mechanism . 26 C.1 Specimen without surface processing . 26 C.2 Specimen with surface processing 26 C.3 Further guidance . 27 Annex D (informative) Thermal acceleration for erosion . 28 D.1 Specimen without surface processing . 28 D.2 Specimen with surface processing 28

26、 BS EN 62739-3:2017IEC 62739-3:2017 IEC 2017 3 D.3 Further guidance document 30 Bibliography 31 Figure 1 Schematic example of wave soldering equipment . 8 Figure 2 Example of dross removal tool . 11 Figure 3 Schematic general definition of erosion depth 12 Figure 4 Schematic definition of erosion de

27、pth by focal depth method 12 Figure 5 Examples of local erosion 13 Figure 6 Example of evaluation region . 13 Figure 7 Examples with non-erosion area 14 Figure 8 Examples without a non-erosion area and an example of a cross section . 14 Figure 9 Configuration example of test equipment 15 Figure 10 C

28、onfiguration example of test equipment for rotation test at 450 C with 2 mm bending 17 Figure A.1 Specimen configuration for preliminary test . 18 Figure A.2 Erosion depth against molten solder temperature . 19 Figure A.3 Erosion depth against rotation speed 19 Figure A.4 Erosion depth against immer

29、sion time . 20 Figure C.1 Erosion mechanism for material with nitriding . 27 Figure D.1 Tin (Sn) diffusion layer growth in the plasma nitriding layer for various stainless steel . 29 Table 1 Location of erosion in the field and examples of problems 8 Table 2 Correlation between test methods and stre

30、sses induced in the field 9 Table 3 Applicable test method depending on the materials . 9 Table 4 Test conditions for rotation test at 350 C 16 Table 5 Test conditions for rotation test at 350 C 16 Table A.1 Erosion test results for the materials of gas nitriding and nitrocarburizing . 21 Table A.2

31、Erosion test results for the materials of coating type surface processing . 22 Table B.1 Measurement methods, features and accuracy. 24 Table B.2 Example of measurement equipment 25 Table D.1 Plasma nitriding layer peeling off period (incubation period in Figure D.1) 29 Table D.2 Initial growth rate

32、 for tin (Sn) diffusion layer . 30 BS EN 62739-3:2017 4 IEC 62739-3:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY Part 3: Selection guidance of erosion test methods FOREWORD 1) The International Elect

33、rotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields.

34、To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC Nat

35、ional Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (

36、ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation

37、 from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot b

38、e held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. A

39、ny divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access

40、to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individ

41、ual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, th

42、is IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of th

43、is IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62739-3 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this International Standard is bas

44、ed on the following documents: The text of this standard is based on the following documents: CDV Report on voting 91/1368/CDV 91/1400/RVC Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document h

45、as been drafted in accordance with the ISO/IEC Directives, Part 2. BS EN 62739-3:2017IEC 62739-3:2017 IEC 2017 5 A list of all the parts in the IEC 62739 series, under the general title Test method for erosion of wave soldering equipment using molten lead-free solder alloy, can be found on the IEC w

46、ebsite. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revise

47、d edition, or amended. A bilingual version of this publication may be issued at a later date. BS EN 62739-3:2017 6 IEC 62739-3:2017 IEC 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY Part 3: Selection guidance of erosion test methods 1 Scope This part of

48、 IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten sold

49、er. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-20:2008, Environmental testing Part 2-20: Tests Test T: Test methods for solderability an

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