BS EN 62878-1-1-2015 Device embedded substrate Generic specification Test methods《装置嵌入基体 总规格 试验方法》.pdf

1、BSI Standards PublicationDevice embedded substratePart 1-1: Generic specification Test methodsBS EN 62878-1-1:2015National forewordThis British Standard is the UK implementation of EN 62878-1-1:2015. It isidentical to IEC 62878-1-1:2015.The UK participation in its preparation was entrusted to Techni

2、calCommittee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British

3、 Standards Institution 2015.Published by BSI Standards Limited 2015ISBN 978 0 580 82122 6ICS 31.180; 31.190Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 July

4、2015.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 62878-1-1:2015EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 62878-1-1 July 2015 ICS 31.180; 31.190 English Version Device embedded substrate - Part 1-1: Generic specification - Test methods (IEC 62878-1

5、-1:2015) Substrat avec appareil(s) intgr(s) - Partie 1-1: Spcification gnrique - Mthodes dessai (IEC 62878-1-1:2015) Trgermaterial mit eingebetteten Bauteilen - Teil 1-1: Fachgrundspezifikation - Prfverfahren (IEC 62878-1-1:2015) This European Standard was approved by CENELEC on 2015-06-24. CENELEC

6、members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on appli

7、cation to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CEN

8、ELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Ic

9、eland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Euro

10、pisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 62878-1-1:2015 E BS EN 62878-1-1:2015EN 62878-1-1:2015 2 European for

11、eword The text of document 91/1248/FDIS, future edition 1 of IEC 62878-1-1, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 62878-1-1:2015. The following dates are fixed: latest date by which the document has to be

12、implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-03-24 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2018-06-24 Attention is drawn to the possibility that some of the elements of this do

13、cument may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 62878-1-1:2015 was approved by CENELEC as a European Standard without any modification. In the off

14、icial version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-1 NOTE Harmonized as EN 60068-1. IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6. IEC 60068-2-14 NOTE Harmonized as EN 60068-2-14. IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 60068-2-2

15、1 NOTE Harmonized as EN 60068-2-21. IEC 60068-2-30 NOTE Harmonized as EN 60068-2-30. IEC 60068-2-38 NOTE Harmonized as EN 60068-2-38. IEC 60068-2-53 NOTE Harmonized as EN 60068-2-53. IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58. IEC 60068-2-64 NOTE Harmonized as EN 60068-2-64. IEC 60068-2-66 NOTE

16、 Harmonized as EN 60068-2-66. IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78. IEC 60068-2-80 NOTE Harmonized as EN 60068-2-80. IEC 61189-1 NOTE Harmonized as EN 61189-1. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61189-11 NOTE Harmonized as EN 61189-11. IEC 61190-1-2 NOTE Harmonized as EN 61190

17、-1-2. IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3. IEC 62137-1-2 NOTE Harmonized as EN 62137-1-2. IEC 62137-1-3 NOTE Harmonized as EN 62137-1-3. IEC 62421 NOTE Harmonized as EN 62421. ISO 291 NOTE Harmonized as EN ISO 291. BS EN 62878-1-1:2015EN 62878-1-1:2015 3 ISO 2409 NOTE Harmonized as EN ISO

18、2409. ISO 3611 NOTE Harmonized as EN ISO 3611. ISO 4957 NOTE Harmonized as EN ISO 4957. ISO 9445-1 NOTE Harmonized as EN ISO 9445-1. ISO 9453 NOTE Harmonized as EN ISO 9453. ISO 9455 Series NOTE Harmonized as EN ISO 9455 Series. ISO 15184 NOTE Harmonized as EN ISO 15184. BS EN 62878-1-1:2015EN 62878

19、-1-1:2015 4 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the editi

20、on cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest

21、versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 60068-2-1 - Environmental testing - Part 2-1: Tests - Test A: Cold EN 60068-2-1 - IEC 60068-2-2 - Environmental testing - Part 2-2: Tests - Test B: Dry heat EN 60068-2-2 -

22、IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) EN 61189-3 - IE

23、C/TS 62878-2-4 2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) - - BS EN 62878-1-1:2015 2 IEC 62878-1-1:2015 IEC 2015 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references 7 3 Terms, definitions and abbreviations . 7 3.1 Terms and definitions 7 3.2 Abbreviations 7

24、4 Test methods . 8 4.1 General . 8 4.2 Visual inspection and micro-sectioning 8 4.2.1 General . 8 4.2.2 Visual inspection . 8 4.2.3 Micro-sectioning 8 4.2.4 Lack of conductor and residue of conductor . 10 4.2.5 Land dimension and land width (annular ring) 10 4.3 Electrical tests 13 4.3.1 Conductor r

25、esistance . 13 4.3.2 Through hole and build-up via . 14 4.3.3 Withstanding current of embedded device connection 15 4.3.4 Withstanding voltage in embedded boards . 17 4.3.5 Insulation resistance 19 4.3.6 Conduction and insulation of circuit . 20 4.4 Mechanical tests . 20 4.4.1 Pulling strength of co

26、nductor . 20 4.4.2 Pulling strength of un-plated through hole 21 4.4.3 Pulling strength of plated through hole . 22 4.4.4 Pulling strength of pad of land pattern . 22 4.4.5 Adhesivity of plated foil 23 4.4.6 Adhesivity of solder resist and symbol mark. 24 4.4.7 Hardness of painted film (solder resis

27、t and symbol mark) 28 4.5 Environmental tests 29 4.5.1 General . 29 4.5.2 Vapour phase thermal shock . 30 4.5.3 High temperature immersion tests . 30 4.5.4 Resistance to humidity . 31 4.6 Mechanical environmental test Resistance to migration . 34 4.6.1 General . 34 4.6.2 Equipment . 34 4.6.3 Specime

28、n 35 4.6.4 Test condition 35 5 Shipping inspection . 36 5.1 General . 36 5.2 Electrical test 37 5.2.1 General . 37 5.2.2 Test of conductor pattern not connected to an embedded component 38 5.2.3 Test on the pattern having a passive component and a conductor pattern . 40 BS EN 62878-1-1:2015IEC 62878

29、-1-1:2015 IEC 2015 3 5.2.4 Test of a circuit having both active component(s) and a conductor pattern . 43 5.2.5 Test of a circuit having connections of both individual passive component(s) and conductor pattern 46 5.2.6 Test of a circuit having an embedded component which cannot be checked from the

30、surface and a conductor pattern . 47 5.3 Internal transparent test 47 5.4 Visual test . 47 Annex A (informative) Related test methods 49 Bibliography 52 Figure 1 Measuring items of the micro-sectioned through hole structure 9 Figure 2 Measuring items of the micro-sectioned device embedded board with

31、 build-up structure 9 Figure 3 Measurement of land dimension . 11 Figure 4 Build-up land measurement 12 Figure 5 Conductor resistance measurement . 14 Figure 6 Relationship between current, conductor width and thickness and temperature rise . 17 Figure 7 Adhesivity of plated film . 24 Figure 8 Singl

32、e cutting tool 25 Figure 9 Cutter knife 25 Figure 10 Multiple blade cutter . 26 Figure 11 Equal-distance spacer with guide . 26 Figure 12 Cutting using a single cutting tool or a cutting knife 27 Figure 13 Cross-cut test . 28 Figure 14 Coated film hardness test . 29 Figure 15 Temperature and humidit

33、y cycles . 33 Figure 16 Device embedded board for shipping inspection . 36 Figure 17 Typical circuit construction of device embedded board . 37 Figure 18 Examples of evaluation levels of electrical test . 39 Figure 19 Circuit construction not connected to embedded component 39 Figure 20 Circuit cons

34、truction which is capable of independent check 40 Figure 21 Circuit construction for parallel connection of passive components . 42 Figure 22 Circuit construction for series connection of passive components . 43 Figure 23 Circuit construction of embedded diode 44 Figure 24 Circuit construction of tr

35、ansistor circuit . 44 Figure 25 Circuit construction of a conductor pattern with embedded IC and LSI . 45 Figure 26 Circuit construction composed of a passive component and an active component 46 Figure 27 Circuit construction of embedded components having no connection terminal on the surface . 47

36、Table 1 Test items, characteristics and observations of micro-sectioned specimens . 9 Table 2 Test method for coplanarity around the land pattern 12 Table 3 Characteristics and test methods for conductor resistance 15 BS EN 62878-1-1:2015 4 IEC 62878-1-1:2015 IEC 2015 Table 4 Withstanding current an

37、d test methods 16 Table 5 Withstanding voltage and test methods . 18 Table 6 Criteria and test methods for insulation resistance 20 Table 7 Characteristics and test method of pulling strength of conductor . 21 Table 8 Dimensions of land, hole and conductor 22 Table 9 Characteristics and test methods

38、 of pulling strength of plated through hole . 22 Table 10 Specification and test method of pad pulling strength of land pattern . 23 Table 11 High and low temperature characteristics and tests . 30 Table 12 Thermal shock characteristics and test methods 30 Table 13 Thermal shock (high temperature im

39、mersion test) . 31 Table 14 Measuring environment . 31 Table 15 Thermal shock (high temperature immersion tests) 31 Table 16 Resistance to humidity characteristics and test methods . 34 Table 17 Resistance to migration characteristics and test methods 35 Table 18 Applicable items of shipping inspect

40、ion . 37 Table A.1 Related test methods . 49 BS EN 62878-1-1:2015IEC 62878-1-1:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DEVICE EMBEDDED SUBSTRATE Part 1-1: Generic specification Test methods FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organizatio

41、n for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC pu

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