BS EN ISO 9455-5-2014 Soft soldering fluxes Test methods Copper mirror test《软钎焊剂 试验方法 铜镜试验》.pdf

1、BSI Standards PublicationBS EN ISO 9455-5:2014Soft soldering fluxes Test methodsPart 5: Copper mirror testBS EN ISO 9455-5:2014 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN ISO 9455-5:2014. It supersedes BS EN 29455-5:1993 which is withdrawn.The UK participat

2、ion in its preparation was entrusted to Technical Committee NFE/27/4, Solders and soldering fluxes.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are resp

3、onsible for its correct application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 80540 0ICS 25.160.50Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standa

4、rds Policy and Strategy Committee on 31 July 2014.Amendments/corrigenda issued since publicationDate T e x t a f f e c t e dEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN ISO 9455-5 July 2014 ICS 25.160.50 Supersedes EN 29455-5:1993English Version Soft soldering fluxes - Test methods - Part 5:

5、 Copper mirror test (ISO 9455-5:2014) Flux de brasage tendre - Mthodes dessai - Partie 5: Essai au miroir de cuivre (ISO 9455-5:2014) Flussmittel zum Weichlten - Prfverfahren - Teil 5: Kupferspiegeltest (ISO 9455-5:2014) This European Standard was approved by CEN on 28 May 2014. CEN members are boun

6、d to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CE

7、N-CENELEC Management Centre or to any CEN member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN member into its own language and notified to the CEN-CENELEC Management Centre h

8、as the same status as the official versions. CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, L

9、uxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. EUROPEAN COMMITTEE FOR STANDARDIZATION COMIT EUROPEN DE NORMALISATION EUROPISCHES KOMITEE FR NORMUNG CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Br

10、ussels 2014 CEN All rights of exploitation in any form and by any means reserved worldwide for CEN national Members. Ref. No. EN ISO 9455-5:2014 EBS EN ISO 9455-5:2014EN ISO 9455-5:2014 (E) 3 Foreword This document (EN ISO 9455-5:2014) has been prepared by Technical Committee ISO/TC 44 “Welding and

11、allied processes“ in collaboration with Technical Committee CEN/TC 121 “Welding and allied processes” the secretariat of which is held by DIN. This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by Janua

12、ry 2015, and conflicting national standards shall be withdrawn at the latest by January 2015. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and/or CENELEC shall not be held responsible for identifying any or all such patent

13、rights. This document supersedes EN 29455-5:1993. According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland,

14、Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. Endorsement notice The text of ISO 94

15、55-5:2014 has been approved by CEN as EN ISO 9455-5:2014 without any modification. BS EN ISO 9455-5:2014ISO 9455-5:2014(E) ISO 2014 All rights reserved iiiContents PageForeword iv1 Scope . 12 Normative references 13 Principle 14 Reagents 15 Apparatus . 26 Procedure. 26.1 Preparation of the flux test

16、 solution . 26.2 Preparation of copper mirrors for test . 36.3 Determination . 37 Assessment and expression of results . 38 Test report . 3BS EN ISO 9455-5:2014ISO 9455-5:2014(E)ForewordISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (I

17、SO member bodies). The work of preparing International Standards is normally carried out through ISO technical committees. Each member body interested in a subject for which a technical committee has been established has the right to be represented on that committee. International organizations, gov

18、ernmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization. The procedures used to develop this document and those intended for its further maint

19、enance are described in the ISO/IEC Directives, Part 1. In particular the different approval criteria needed for the different types of ISO documents should be noted. This document was drafted in accordance with the editorial rules of the ISO/IEC Directives, Part 2 (see www.iso.org/directives).Atten

20、tion is drawn to the possibility that some of the elements of this document may be the subject of patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of any patent rights identified during the development of the document will be in the Introduction

21、 and/or on the ISO list of patent declarations received (see www.iso.org/patents). Any trade name used in this document is information given for the convenience of users and does not constitute an endorsement. For an explanation on the meaning of ISO specific terms and expressions related to conform

22、ity assessment, as well as information about ISOs adherence to the WTO principles in the Technical Barriers to Trade (TBT) see the following URL: Foreword - Supplementary information The committee responsible for this document is ISO/TC 44, Welding and allied processes, Subcommittee SC 12, Soldering

23、 materials.This second edition cancels and replaces the first edition (ISO 9455-5:1992), which has been technically revised.Requests for official interpretations of any aspect of this International Standard should be directed to the Secretariat of ISO/TC 44/SC 12 via your national standards body. A

24、complete listing of these bodies can be found at www.iso.org.ISO 9455 consists of the following parts, under the general title Soft soldering fluxes Test methods : Part 1: Determination of non-volatile matter, gravimetric method Part 2: Determination of non-volatile matter, ebulliometric method Part

25、 3: Determination of acid value, potentiometric and visual titration methods Part 5: Copper mirror test Part 6: Determination and detection of halide (excluding fluoride) content Part 8: Determination of zinc content Part 9: Determination of ammonia content Part 10: Flux efficacy test, solder spread

26、 method Part 11: Solubility of flux residues Part 13: Determination of flux spattering Part 14: Assessment of tackiness of flux residues Part 15: Copper corrosion testiv ISO 2014 All rights reservedBS EN ISO 9455-5:2014ISO 9455-5:2014(E) Part 16: Flux efficacy tests, wetting balance method Part 17:

27、Surface insulation resistance comb test and electrochemical migration test of flux residues ISO 2014 All rights reserved vBS EN ISO 9455-5:2014BS EN ISO 9455-5:2014Soft soldering fluxes Test methods Part 5: Copper mirror test1 ScopeThis part of ISO 9455 specifies a qualitative method for assessing t

28、he aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454-1.2 Normative referencesThe following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only th

29、e edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.ISO 9454-1, Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packagingISO 9455-1, Soft soldering fluxes Test methods Part 1: De

30、termination of non-volatile matter, gravimetric methodISO 9455-2, Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method3 PrincipleFor flux samples in the form of a solid or paste, and for flux-cored solder, a flux test solution containing 25 % (m/m) of

31、 solids is prepared. For liquid flux samples, the liquid is used full strength as the flux test solution. The flux test solution is then evaluated in terms of its attack on a copper film previously vacuum deposited onto a glass plate (copper mirror). A rosin reference solution, which should not caus

32、e removal of the copper film, is used as a control. The object of the test is to determine the flux reactivity due to the presence of free halide activators.NOTE The presence of amines in the flux can cause misleading results in that the flux appears to pass the test, when in fact it has a highly re

33、active composition.4 ReagentsUse only reagents of recognized analytical grade and only distilled, or deionized, water.4.1 Acetone.4.2 Propan-2-ol.4.3 Degreasing agent, such as a suitable neutral organic solvent such as acetone or petroleum ether.4.4 Rosin reference solution, 25 % (m/m), prepared by

34、dissolving 25 g of W-W grade colophony in 75 g of propan-2-ol (see 4.2).4.5 Ethylenediaminetetraacetic acid (EDTA), 0,1 % (m/m) solution.INTERNATIONAL STANDARD ISO 9455-5:2014(E) ISO 2014 All rights reserved 1BS EN ISO 9455-5:2014ISO 9455-5:2014(E)5 ApparatusUsual laboratory apparatus and, in partic

35、ular, the following.5.1 Temperature/humidity oven, capable of maintaining a temperature of 25 C and a relative humidity of (50 5) %.5.2 Copper mirrors. Thoroughly clean a number of glass test plates, approximately 25 mm 50 mm or bigger (e.g. 50 mm 75 mm) in size, degrease them, if necessary, using t

36、he degreasing agent (see 4.3) and dry them.Deposit copper, by vacuum deposition, onto one surface of the dry test plates to a thickness of approximately 50 nm. The transmittance of the plate to normal incident monochromatic light at a wavelength of 500 nm shall be between 5 % and 15 %.Copper mirror

37、test plates complying with these requirements are available commercially1)and can be used instead.Store the copper mirrors under dry nitrogen until use.5.3 Soxhlet extraction apparatus.6 Procedure6.1 Preparation of the flux test solution6.1.1 Liquid flux samplesUse liquid flux samples at full streng

38、th as the flux test solution.6.1.2 Solid flux samples6.1.2.1 Prepare by dissolution with propan-2-ol (see 4.2, but see also 6.1.2.2), a flux test solution containing 25 % by mass of the solid flux sample.6.1.2.2 If it is found that the flux is not soluble in propan-2-ol, then use another suitable wa

39、ter miscible solvent and give details of this solvent in the test report see Clause 8, item f).6.1.3 Flux-cored solder6.1.3.1 Cut a length of the flux-cored solder with a mass of approximately 150 g and seal the ends by crimping. Wipe the surface clean with a cloth moistened with acetone (see 4.1).

40、Place the sample in a beaker, add sufficient water to cover the sample, and boil for 5 min to 6 min. Remove the sample, rinse it with acetone (see 4.1), and allow to dry.While protecting the solder surface from contamination, cut the sample into short lengths (maximum 19 mm) using a razor blade so a

41、s not to crimp the cut ends. Place the cut segments into the extraction tube of a clean Soxhlet extraction apparatus (see 5.3) and extract the flux with propan-2-ol (see 4.2, but see also 6.1.2.2) until the return condensate is clear.1) Copper mirror test plates suitable for this test method may be

42、obtained from Evaporated Metal Films Corporation, Ithaca, New York, USA. This information is given for the convenience of users of this document and does not constitute an endorsement by ISO of the product named.2 ISO 2014 All rights reservedBS EN ISO 9455-5:2014ISO 9455-5:2014(E)6.1.3.2 Determine t

43、he non-volatile matter content of the extract using the method in ISO 9455-1 or ISO 9455-2, and adjust the content by evaporation or by dilution with propan-2-ol (see 4.2, but see also 6.1.2.2) to 25 % by mass to produce the flux test solution.6.2 Preparation of copper mirrors for testSelect two cop

44、per mirrors (see 5.2) free from visible defects. Immediately before carrying out the test in 6.3, immerse the copper mirrors in the EDTA (see 4.5) for not more than 5 s, to remove any copper oxide. Rinse immediately in running water, then in acetone (see 4.1) and dry using warm air.6.3 Determination

45、Place the two freshly cleaned copper mirrors (see 6.2) onto a clean horizontal surface, mirror side up. Place one drop (maximum 0,05 ml) of the flux test solution (see 6.1) on one of the mirrors and, at a distance of approximately 35 mm, one drop (maximum 0,05 ml) of the rosin reference solution (se

46、e 4.4). During this operation do not allow the dropper to touch the copper mirror.Repeat the procedure with the second copper mirror.Place the two mirrors in a horizontal position in the temperature/humidity oven (see 5.1) and condition the mirrors at 25 C 2 C and (50 5) % relative humidity for 24 h

47、. Remove the mirrors from the oven and wash off the flux residues using propan-2-ol (see 4.2), or using the solvent used in 6.1. Dry the mirrors using a stream of warm air.Examine the copper mirrors against a white background.NOTE The presence of free halide activators in the flux test solution resu

48、lts in partial or complete removal of the copper film at the location of the drop, the copper mirror becoming progressively more transparent as the flux reactivity increases. The presence of amines in the flux can cause misleading results.7 Assessment and expression of resultsThe flux shall have pas

49、sed the test if there is no removal of the film on either copper mirror by the flux test solution. Removal is defined as the complete penetration of the copper film over the whole or part of the area, which causes the white background to be visible.However, if the rosin reference solution (see 4.4) has failed the test, then repeat the determination using freshly prepared copper mirrors (see 6.2).8 Test reportThe test report shall include the following information:a) the identification of the test sample;b) the tes