BS IEC 60748-23-1-2002 Semiconductor devices - Integrated circuits - Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification《半导体器件.pdf

1、BRITISH STANDARD BS IEC 60748-23-1: 2002 Semiconductor devices Integrated circuits Part 23-1: Hybrid integrated circuits and film structures Manufacturing line certification Generic specification ICS 31.200 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS IEC 60748-23-1:2002

2、This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 07 June 2002 BSI 07 June 2002 ISBN 0 580 39787 4 National foreword This British Standard r

3、eproduces verbatim IEC 60748-23-1:2002 and implements it as the UK national standard. The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: A list of organiz

4、ations represented on this subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system

5、 to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspond

6、ence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of

7、itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments a

8、nd promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the IEC title page, pages 2 to 85 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No.

9、 Date CommentsINTERNATIONAL STANDARD IEC 60748-23-1 QC 165000-1 First edition 2002-05 Semiconductor devices Integrated circuits Part 23-1: Hybrid integrated circuits and film structures Manufacturing line certification Generic specification Dispositifs semiconducteurs Circuits intgrs Partie 23-1: Ci

10、rcuits intgrs hybrides et structures par films Certification de la ligne de fabrication Spcification gnrique Reference number IEC 60748-23-1:2002(E) 2 607-8423-1 CEI :0220(E) CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references .6 3 Definitions 8 4 Standard and preferred values .10 5

11、Marking 10 5.1 Circuit .10 5.2 Despatch primary pack11 6 Quality assessment procedures11 6.1 General .11 6.2 Procedures for manufacturing line certification 14 6.3 Description of capability 14 6.4 Qualifying components 15 6.5 Procedures following the granting of manufacturing line certification .19

12、6.6 Release for delivery.20 7 Test and measurement procedures.22 7.1 General .22 7.2 Standard conditions for testing 22 7.3 Visual inspections and package dimensions 25 7.4 Electrical measurement procedures.25 7.5 Environmental test procedures 27 Annex A (normative) Product assessment level schedule

13、s (PALS).59 Annex B (informative) Customer information Application of these specifications with particular reference to produce assessment level schedules (PALS).73 Bibliography85 Figure 1 Definition of axes for mechanical and other tests .24 Figure 2 Pulling force for bond strength test.53 Figure 3

14、 Apparatus requirements for the added component bond strength destructive test .58 Table 1 Severities for damp heat, steady-state, Method 229 Table 2 Severities for damp heat, steady-state, Method 331 Table 3 Preferred conditions for shock.34 Table 4 Parameters for sealing test Method 1 .38 Table 5

15、Preheat times 42 Table 6 Minimum pulling force .52 BSIEC60748231:2002 BSI07June2002 2067-8423-1 CEI:0220(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS Part 23-1: Hybrid integrated circuits and film structures Manufacturing line certification Generic speci

16、fication FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-operation on all questions concerning standardi

17、zation in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work

18、. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

19、 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. 3) The documents produced have the form of

20、recommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC Int

21、ernational Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its a

22、pproval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. The IEC shall not be held responsible for identi

23、fying any or all such patent rights. International Standard IEC 60748-23-1 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the European standard EN 165000-1 and the following documents: FDIS Repor

24、t on voting 47A/638/FDIS 47A/649/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 3. IEC 60748-23-1 should be read in conjunction w

25、ith Parts 23-2, 23-3 and 23-4. Annex A forms an integral part of this standard. Annex B if for information only. The QC number that appears on the front cover of this publication is the specification number in the IEC Quality Assessment System for Electronic Components (IECQ). BSIEC60748231:2002 BSI

26、07June2002 3 4 607-8423-1 CEI :0220(E) The committee has decided that the contents of this publication will remain unchanged until 2006. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. BSIEC60748231:2002 BSI07June2002 4067-8423-1 CEI:0220(E) 5

27、 INTRODUCTION This set of specifications prescribes a set of procedures to be used by users and manufacturers for the production and delivery of high-quality, special requirement hybrid integrated circuits and film structures with a specified level of quality and reliability. This set of specificati

28、ons prescribes reference criteria for the establishment, control, maintenance and development of a certified manufacturing line and represents a manufacturing line certification methodology. The targeted level of quality and reliability is to be achieved by using best design and manufacturing practi

29、ces. Examples of quality and reliability best practices for elimination of potential failure mechanisms and achievement of a targeted quality and reliability level include: material characterization for derivation of process design rules, in-process control, continuous improvement, etc. Assessment (

30、estimation) of the targeted quality and reliability level may be accomplished by: a) using data obtained from the material characterization, design and process control and improvement activities; or b) through the use of product assessment level schedule (PALS) tests. Part 23-2 of this set of specif

31、ications provides guidance to users of hybrids in terms of the visual inspection standards to be expected. Part 23-3 of this set of specifications provides a framework for use as an assessment/audit tool to assist the suppliers, customers or an independent organization to carry out an assessment of

32、a certified manufacturing line of a hybrid manufacturing company. Part 23-4 of this set of specifications provides a blank detail specification, which provides guidance to users of hybrids for procurement purposes. Part 23-5 of this set of specifications provides a means of quality assessment on the

33、 basis of qualification approval. BSIEC60748231:2002 BSI07June2002 5 6 607-8423-1 CEI :0220(E) SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS Part 23-1: Hybrid integrated circuits and film structures Manufacturing line certification Generic specification 1 Scope This set of specifications applies to high

34、 quality hybrid integrated circuits (with films) incorporating special customer quality and reliability requirements. Hybrid integrated circuits may be fully or partly completed. Partly completed devices are those that may be supplied to customers for further processing. 2 Normative references The f

35、ollowing referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60027 (all parts), Letter symbols to be used in el

36、ectrical technology IEC 60050 (all parts), International Electrotechnical Vocabulary IEC 60068-1:1988, Environmental testing Part 1: General and guidance Amendment 1 (1992) IEC 60068-2-1:1990, Environmental testing Part 2: Tests Tests A: Cold Amendment 1 (1993) Amendment 2 (1994) IEC 60068-2-2:1974,

37、 Basic environmental test procedures Part 2: Tests Tests B: Dry heat Amendment 1 (1993) Amendment 2 (1994) IEC 60068-2-3:1984 (incorporating amendment 1: 1984), Basic environmental test procedures Part 2: Tests Test Ca: Damp heat, steady state Amendment 1 (1984) IEC 60068-2-6:1995, Environmental tes

38、ting Part 2: Tests Test Fc: Vibration (sinusoidal) IEC 60068-2-7:1983, Basic environmental testing procedures Part 2: Tests Test Ga and guidance: Acceleration, steady state Amendment 1 (1986) IEC 60068-2-11:1981, Basic environmental testing procedures Part 2: Tests Test Ka: Salt mist IEC 60068-2-14:

39、1984, Basic environmental testing procedures Part 2: Tests Test N: Change of temperature Amendment 1 (1986) IEC 60068-2-17:1994, Basic environmental testing procedures Part 2: Tests Test Q: Sealing BSIEC60748231:2002 BSI07June2002 6067-8423-1 CEI:0220(E) 7 IEC 60068-2-20:1979, Basic environmental te

40、sting procedures Part 2: Tests Test T: Soldering Amendment 2 (1987) IEC 60068-2-21:1999, Environmental testing Part 2-21: Tests Test U: Robustness of terminations and integral mounting devices IEC 60068-2-27:1987, Basic environmental testing procedures Part 2: Tests Test Ea and guidance: Shock IEC 6

41、0068-2-30:1980, Environmental testing Part 2: Tests Test Db: Damp heat, cyclic (12 + 12-hour cycle) Amendment 1 (1985) IEC 60068-2-44:1995, Environmental testing Part 2: Tests Guidance on Test T: Soldering IEC 60068-2-45:1980, Basic environmental testing procedures Part 2: Tests Test XA and guidance

42、: Immersion in cleaning solvents Amendment 1 (1993) IEC 60068-2-47:1999, Environmental testing Part 2-47: Tests Mounting of components, equipment and other articles for vibration, impact and similar dynamic tests IEC 60068-3 (all parts) Environmental testing procedures Part 3: Supporting documentati

43、on and guidance IEC 60068-3-4:2001, Environmental testing Part 3-4: Supporting documentation and guidance Damp heat tests IEC 60068-5 (all parts), Environmental testing Part 5: Guide to drafting of test methods IEC 60134:1961, Rating systems for electronic tubes and valves and analogous semiconducto

44、r devices IEC 60191-2:1996, Mechanical standardization of semiconductor devices IEC 60617 (all parts), Graphical symbols for diagrams IEC 60695-2-2:1991, Fire hazard testing Part 2: Test methods Section 2: Needle-flame test Amendment 1 (1994) IEC 60747-1:1983, Semiconductor devices Discrete devices

45、Part 1: General 1 Amendment 3 (1996) IEC 60748-1, Semiconductor devices Integrated circuits Part 1: General 2 IEC 60748-23-2:2002, Semiconductor devices Integrated circuits Part 23-2: Hybrid integrated circuits and film structures Manufacturing line certification Internal visual inspection and speci

46、al tests _ 1 Together with any other part of IEC 60747 or IEC 60748 relevant to the specific hybrid application, including terminology. 2 To be published. BSIEC60748231:2002 BSI07June2002 7 8 607-8423-1 CEI :0220(E) IEC 60748-23-3:2002, Semiconductor devices Integrated circuits Part 23-3: Hybrid int

47、egrated circuits and film structures Manufacturing line certification Manufacturers self- audit checklist and report IEC 60749:1996, Semiconductor devices Mechanical and climatic test methods 3 Amendment 1 (2000) Amendment 2 (2001) IEC 61340-5-1:1998, Electrostatics Part 5-1: Protection of electroni

48、c devices from electrostatic phenomena General requirements ISO 1000:1992, SI units and recommendations for use of their multiples and of certain other units Amendment 1 (1998) ISO 9000:2000, Quality management systems Fundamentals and vocabulary ISO 2859 (all parts), Sampling procedures for inspection by attributes IECQ 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 3: Approval procedures IECQ 001005:2000, Register of Firms, Products and Services approved under the IECQ System, including ISO 9000 3 Definitions For the purpose o