BS IEC 60748-23-3-2002 Semiconductor devices Integrated circuits Hybrid integrated circuits and film structures Manufacturing line certification Manufacturers- self-audit checklist.pdf

1、BRITISH STANDARD BS IEC 60748-23-3: 2002 Semiconductor devices Integrated circuits Part 23-3: Hybrid integrated circuits and film structures Manufacturing line certification Manufacturers self-audit checklist and report ICS 31.200 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LA

2、WBS IEC 60748-23-3:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 18 June 2002 BSI 18 June 2002 ISBN 0 580 39834 X National foreword

3、 This British Standard reproduces verbatim IEC 60748-23-3:2002 and implements it as the UK national standard. The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibili

4、ty to: A list of organizations represented on this subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27 has been renumbered as IEC 60027-1. For a period of time during the change over f

5、rom one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standa

6、rds Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. A publication does not purport to include all the necessary provisions of a contract. Users of this publication are responsible for their correct application. Compliance with

7、a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related internatio

8、nal and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the IEC title page, pages 2 to 85 and a back cover The BSI copyright date displayed in this document indicates when the document was last issued. Amendments iss

9、ued since publication Amd. No. Date CommentsINTERNATIONAL STANDARD IEC 60748-23-3 QC 165000-3 First edition 2002-05 Semiconductor devices Integrated circuits Part 23-3: Hybrid integrated circuits and film structures Manufacturing line certification Manufacturers self-audit checklist and report Dispo

10、sitifs semiconducteurs Circuits intgrs Partie 23-3: Circuits intgrs hybrides et structures par films Certification de la ligne de fabrication Liste de contrle et rapport dvaluation interne pour fabricants Reference number IEC 60748-23-3:2002(E) 2 607-8423-3 CEI:0220(E) CONTENTS FOREWORD.4 INTRODUCTI

11、ON.5 1 Scope.6 2 Document information.6 2.1 General .6 2.2 Normative references 6 3 Definitions 7 4 General requirements.7 4.1 Self-audit checklist and report for thick and thin film hybrid integrated circuit manufacturers8 4.2 Description of report/company structure 9 4.3 Approval information .10 4

12、.4 Summary of testing .12 4.5 Analytical methods 14 4.6 Control of procurement sources and incoming material15 4.7 Control of procurement sources and incoming material, continued 16 4.8 Environmental control and static handling .17 4.9 Change notification requirements 17 4.10 Hybrid design 18 5 Thic

13、k film processing20 5.1 Artwork and screen fabrication 20 5.2 Substrates.21 5.3 Substrate saw or scribe and break and substrate hole drilling .22 5.4 Thick film pastes and printing23 5.5 Drying and firing28 5.6 Resistor trimming 29 5.7 Inspection and test of processing 30 5.8 Rework31 6 Thin film pr

14、ocessing .32 6.1 Artwork and mask fabrication 32 6.2 Substrates.33 6.3 Substrate saw or scribe and break and substrate hole drilling .35 6.4 Thin film processing materials and pattern forming35 6.5 Drying and stabilization .37 6.6 Resistor trimming 38 6.7 Rework39 7 Hybrid assembly.40 7.1 Solder ass

15、embly41 7.2 Chip and wire assembly.49 BSIEC60748233:2002 BSI18June2002 2067-8423-3 CEI:0220(E) 3 8 Test and dispatch.61 8.1 Electrical tests.62 8.2 Burn-in 63 8.3 Endurance.65 8.4 Dry heat (stabilization bake)66 8.5 Change of temperature67 8.6 Damp heat testing .68 8.7 Particle impact noise detectio

16、n69 8.8 Fine leak test.70 8.9 Gross leak test 71 8.10 Resistance to soldering heat .72 8.11 Termination robustness .73 8.12 Acceleration 74 8.13 Vibration74 8.14 Shock75 8.15 Dimensions .76 8.16 Bond-pull testing .77 8.17 Salt mist78 8.18 Flammability79 8.19 Solderability 79 8.20 Resistance to solve

17、nts 81 8.21 Internal visual inspection.82 8.22 External visual inspection83 8.23 Radiographic inspection 84 8.24 Acceptance to dispatch .85 BSIEC60748233:2002 BSI18June2002 3 4 607-8423-3 CEI:0220(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS Part 23-3: Hyb

18、rid integrated circuits and film structures Manufacturing line certification Manufacturers self-audit checklist and report FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National

19、 Committees). The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical co

20、mmittees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organizat

21、ion for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical

22、 committee has representation from all interested National Committees. 3) The documents produced have the form of recommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees i

23、n that sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regi

24、onal standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of

25、 this International Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60748-23-3 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor device

26、s. The text of this standard is based on the European standard EN 165000-3 and the following documents: FDIS Report on voting 47A/640/FDIS 47A/651/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. IEC 60748-23-3 sh

27、ould be read in conjunction with Parts 23-1, 23-2 and 23-4. The QC number that appears on the front cover of this publication is the specification number in the IEC Quality Assessment System for Electronic Components (IECQ). The committee has decided that the contents of this publication will remain

28、 unchanged until 2006. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. BSIEC60748233:2002 BSI18June2002 4067-8423-3 CEI:0220(E) 5 INTRODUCTION This set of specifications prescribes a set of procedures to be used by users and manufacturers for

29、the production and delivery of high-quality, special requirement hybrid integrated circuits and film structures with a specified level of quality and reliability. This set of specifications prescribes reference criteria for the establishment, control, maintenance and development of a certified manuf

30、acturing line and represents a manufacturing line certification methodology. The targeted level of quality and reliability is to be achieved by using best design and manufacturing practices. Examples of quality and reliability best practices for elimination of potential failure mechanisms and achiev

31、ement of a targeted quality and reliability level include: material characterization for derivation of process design rules, in-process control, continuous improvement, etc. Assessment (estimation) of the targeted quality and reliability level may be accomplished by: a) using data obtained from the

32、material characterization, design and process control and improvement activities; or b) through the use of product assessment level schedule (PALS) tests. Part 23-1 of this set of specifications provides general information. Part 23-2 of this set of specifications provides guidance to users of hybri

33、ds in terms of the visual inspection standards to be expected. Part 23-4 of this set of specifications provides a blank detail specification, which provides guidance to users of hybrids for procurement purposes. Part 23-5 of this set of specifications provides a means of quality assessment on the ba

34、sis of qualification approval. BSIEC60748233:2002 BSI18June2002 5 6 607-8423-3 CEI:0220(E) SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS Part 23-3: Hybrid integrated circuits and film structures Manufacturing line certification Manufacturers self-audit checklist and report 1 Scope This part of IEC 60748

35、 applies to a high quality approval system for hybrid integrated circuits and film structures. This checklist is intended for the use of a hybrid microcircuit manufacturers internal assessment team. It will provide the hybrid manufacturer and the National Supervising Inspectorate (NSI) with ongoing

36、information on process control demonstrating compliance with IEC 60748-23-1. It is not intended to include quality system requirements. 2 Document information 2.1 General The checklist and subsequent report is for submission to the NSI in support of an application for approval to IEC 60748-23-1, or

37、as a demonstration of continuing compliance at intervals not exceeding 1 year. Each item in clauses 3 to 7 shall be completed or marked “not applicable”; items which invoke mandatory process or inspection requirements are shown in bold italics. It should be noted that it is not the requirement or th

38、e intention that each item has to be answered with an affirmative, excepting mandatory requirements. The objective of the report is for the manufacturer to demonstrate that all manufacturing processes are under control by whatever means this is achieved. Where supporting evidence is included, for ex

39、ample engineering reports, statistical process control (SPC) data, etc., it should be appended to the report. The manufacturer may use his own style of typeface to reproduce this document and produce his report. The NSI may subsequently validate any part of the submission as a process assessment. 2.

40、2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050 (all parts), Int

41、ernational Electrotechnical Vocabulary IEC 60068-2-20:1979, Basic environmental testing procedures Part 2: Tests Test T: Soldering BSIEC60748233:2002 BSI18June2002 6067-8423-3 CEI:0220(E) 7 IEC 60695-2-2:1991, Fire hazard testing Part 2: Test methods Section 2: Needle-flame test Amendment 1 (1994) I

42、EC 60748-1, Semiconductor devices Integrated circuits Part 1: General IEC 60748-23-1:2002, Semiconductor devices Integrated circuits Part 23-1: Hybrid integrated circuits and film structures Manufacturing line certification Generic specification IEC 60748-23-2:2002, Semiconductor devices Integrated

43、circuits Part 23-2: Hybrid integrated circuits and film structures Manufacturing line certification Internal visual inspection and special tests IEC 60748-23-4:2002, Semiconductor devices Integrated circuits Part 23-4: Hybrid integrated circuits and film structures Manufacturing line certification B

44、lank detail specification IEC 61340-5-1:1998, Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements IECQ 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 3: Approval procedures 3 Definitions Fo

45、r the purpose of this part of IEC 60748, the definitions given in IEC 60050, IEC 60748-1, IEC 60748-23-1 and IEC 60748-23-2 shall apply. 4 General requirements The following subclauses contain: 4.1 Self-audit checklist and report for thick and thin film hybrid integrated circuit manufacturers 4.2 De

46、scription of report/company structure 4.3 Approval information 4.4 Summary of testing 4.5 Analytical methods 4.6 Control of procurement sources and incoming material 4.7 4.8 Control of procurement sources and incoming material, continued Environmental control and static handling 4.9 Change notificat

47、ion requirements 4.10 Hybrid design BSIEC60748233:2002 BSI18June2002 7 8 607-8423-3 CEI:0220(E) 4.1 Self-audit checklist and report for thick and thin film hybrid integrated circuit manufacturers Report No: Date: Previous report No: Date: Approval: application/periodic review/extension/major change

48、* Company name: Address: Postcode: Telephone: Telex: Facsimile: Company declaration The information contained herein is a true and accurate record of appraisals carried out between / / and / / . Report compiled by: Signed: Date: / / Report approved by: Signed: Date: / / NSI counter-signature The inf

49、ormation supplied in this report fully supports the application/periodic review/extension/major change *as detailed. The following items of this report have been subject to subsequent evaluation by the NSI: For NSI: Signed: Date: / / *Delete as appropriate. BSIEC60748233:2002 BSI18June2002 8067-8423-3 CEI:0220(E) 9 4.2 Description of report/company st