BS ISO 16525-9-2014 Adhesives Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics《胶粘剂 各向同性导电胶粘剂的试验方法 高速信号传输.pdf

1、BSI Standards PublicationBS ISO 16525-9:2014Adhesives Test methods for isotropic electrically conductive adhesivesPart 9: Determination of high-speed signal-transmission characteristicsBS ISO 16525-9:2014 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of ISO 16525-9:

2、2014. The UK participation in its preparation was entrusted to TechnicalCommittee PRI/52, Adhesives.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are res

3、ponsible for its correct application. The British Standards Institution 2014. Published by BSI Standards Limited 2014ISBN 978 0 580 76961 0ICS 83.180Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standar

4、ds Policy and Strategy Committee on 30 June 2014.Amendments/corrigenda issued since publicationDate Text affectedBS ISO 16525-9:2014 ISO 2014Adhesives Test methods for isotropic electrically conductive adhesives Part 9: Determination of high-speed signal-transmission characteristicsAdhsifs Mthodes d

5、essai pour adhsifs conductivit lectrique isotrope Partie 9: Dtermination des proprits de transmission de signal haute vitesseINTERNATIONAL STANDARDISO16525-9First edition2014-05-15Reference numberISO 16525-9:2014(E)BS ISO 16525-9:2014ISO 16525-9:2014(E)ii ISO 2014 All rights reservedCOPYRIGHT PROTEC

6、TED DOCUMENT ISO 2014All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting on the internet or an intranet, without prior written permission. Permis

7、sion can be requested from either ISO at the address below or ISOs member body in the country of the requester.ISO copyright officeCase postale 56 CH-1211 Geneva 20Tel. + 41 22 749 01 11Fax + 41 22 749 09 47E-mail copyrightiso.orgWeb www.iso.orgPublished in SwitzerlandBS ISO 16525-9:2014ISO 16525-9:

8、2014(E) ISO 2014 All rights reserved iiiContents PageForeword iv1 Scope . 12 Normative references 13 Terms and definitions . 24 Principle 25 Apparatus and test circuit board . 36 Preparation of test circuit board . 77 Set-up 88 Tests . 98.1 Test procedure . 98.2 Judgement 109 Test report 11Annex A (

9、normative) Sample structure used for the examination 12Annex B (normative) Test procedure 25Annex C (normative) Test equipment and example of implementation of the test 27Annex D (normative) Application procedure for isotropic electrically conductive adhesive Example .34Annex E (normative) Applicati

10、on of isotropic electrically conductive adhesive Measurement example 36Bibliography .45BS ISO 16525-9:2014ISO 16525-9:2014(E)ForewordISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (ISO member bodies). The work of preparing Internationa

11、l Standards is normally carried out through ISO technical committees. Each member body interested in a subject for which a technical committee has been established has the right to be represented on that committee. International organizations, governmental and non-governmental, in liaison with ISO,

12、also take part in the work. ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.The procedures used to develop this document and those intended for its further maintenance are described in the ISO/IEC Directives, Part 1

13、. In particular the different approval criteria needed for the different types of ISO documents should be noted. This document was drafted in accordance with the editorial rules of the ISO/IEC Directives, Part 2. www.iso.org/directivesAttention is drawn to the possibility that some of the elements o

14、f this document may be the subject of patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of any patent rights identified during the development of the document will be in the Introduction and/or on the ISO list of patent declarations received. www

15、.iso.org/patentsAny trade name used in this document is information given for the convenience of users and does not constitute an endorsement.TThe committee responsible for this document is ISO/TC 61, Plastics, Subcommittee SC 11, Products.ISO 16525 consists of the following parts, under the general

16、 title Adhesives Test methods for isotropic electrically conductive adhesives: Part 1: General test methods Part 2: Determination of electric characteristics for use in electronic assemblies Part 3: Determination of heat-transfer properties Part 4: Determination of shear strength and electrical resi

17、stance using rigid-to-rigid bonded assemblies Part 5: Determination of shear fatigue Part 6: Determination of pendulum-type shear impact Part 7: Environmental test methods Part 8: Electrochemical migration test methods Part 9: Determination of high-speed signal-transmission characteristicsiv ISO 201

18、4 All rights reservedBS ISO 16525-9:2014INTERNATIONAL STANDARD ISO 16525-9:2014(E)Adhesives Test methods for isotropic electrically conductive adhesives Part 9: Determination of high-speed signal-transmission characteristicsSAFETY STATEMENT Persons using this part of ISO 16525 should be familiar wit

19、h normal laboratory practice. This part of ISO 16525 does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user to establish appropriate safety and health practices and to ensure compliance with any regulatory conditions.IMPORTANT Ce

20、rtain procedures specified in this part of ISO 16525 might involve the use or generation of substances, or the generation of waste, that could constitute a local environmental hazard. Reference should be made to appropriate documentation on safe handling and disposal after use.1 ScopeThis part of IS

21、O 16525 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investi

22、gates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on the printed circuit board.2 Normative referencesThe following documents, in whole or in part, are normatively referenced in this document and are indispensable to its application. For date

23、d references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.ISO 472, Plastics VocabularyIEC 60194, Printed board design, manufacture and assembly Terms and definitionsIEC 61190-1-2, Attachment materials for el

24、ectronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assemblyIEC 61192-1, Workmanship requirements for soldered electronic assemblies Part 1 GeneralIEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinfo

25、rced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-cladIEC 61249-2-8, Materials for printed boards and other interconnecting structures Part 2-8: Reinforced base materials clad and unclad Modified brominated epoxide woven

26、 fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-cladIEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) ISO 2014 All rights reserved 1BS ISO 16525-9:2014ISO 16525-9:2014(E)3 Terms

27、 and definitionsFor the purposes of this document, the terms and definitions given in ISO 472 and IEC 60194 and the following apply.3.1characteristic of high-speed signal transmissioncharacteristic of the deflection of an output signal, which is measured according to eye pattern3.2eye patterneye of

28、the trapezoidal clock wave pattern used to check the transmission characteristics of digital signals3.3characteristic impedance of transmission linespecific impedance of the transmission line with its cross-sectional profile, which meets the signal transmission direction3.4scattering parametertransm

29、ission energy at output port (port 2) and reflection energy at input port (port 1) under the electromagnetic energy of the sine wave at a certain frequency input form port 13.5ball grid array packageBGA packagearray of electrodes formed on the reverse side of, and connected to, the printed circuit u

30、sing ball-like bumps of solder4 PrincipleThere are two methods to investigate high-speed signal-transmission characteristics. In one method, a signal-transmission pattern is printed on a circuit board using an isotropic electrically conductive adhesive and then, the high-speed signal-transmission ch

31、aracteristics of the heat-hardened transmission pattern with an isotropic electrically conductive adhesive is measured. In the other method, the terminals and electrodes of SMDs are bonded to the land grid patterns of the printed circuit board using an isotropic electrically conductive adhesive. For

32、 reference, a lead-free solder is also used, and the high-speed signal transmission characteristics of the bonded portions is measured. The dimensions of the line and bonded portions with an isotropic electrically conductive adhesive are shorter than that of the copper line that is commonly used in

33、circuit boards and SMDs. Therefore, the influence of the copper line on measurement is unavoidable, and it is difficult to extract the characteristics of the isotropic electrically conductive adhesive.Therefore quantitative test methods need to be specified for showing the high-speed signal characte

34、ristics of wiring and bonded portions without the influence of copper lines.NOTE These test methods are not intended for the high-speed signal properties of SMDs or printed circuit boards. Printed and bonded portions to be investigated are illustrated in Figure 1 (the X-Y plane) and Figure 2 (the Z-

35、direction). Conditions of the isotropic electrically conductive adhesive in Figures 1 and 2 are intended to be according to the procedures (surface treatments, printing and curing) recommended by adhesive manufacturers.2 ISO 2014 All rights reservedBS ISO 16525-9:2014ISO 16525-9:2014(E)CPPLRLICAPCBd

36、KeyICA isotropic electrically conductive adhesive PL plating layerCP copper pattern RL reactive layerPCB printed circuit boardsd direction of signalsFigure 1 Illustration of circuit to be investigated (X-Y plane)CPPLRLmSMDPCBICAKeyICA isotropic electrically conductive adhesive PL plating layerCP cop

37、per pattern RL reactive layerPCB printed circuit boards SMD surface mounted devicem measurement areaFigure 2 Illustration of bonded portions under investigation (Z-direction)5 Apparatus and test circuit board5.1 Apparatus for measuring digital signals, capable of measuring signal integrity using the

38、 eye patterns of the output signal, which is generated when clock-synchronizing random digital signals. It consists of two devices described in 5.1.1 and 5.1.2. For measurement, a standard circuit board should be screwed directly to each device using a coaxial cable. A typical eye pattern of the out

39、put signal is shown in Figure 3. ISO 2014 All rights reserved 3BS ISO 16525-9:2014ISO 16525-9:2014(E)Figure 3 A typical eye pattern5.1.1 Random pulse generator, capable of generating digital random pulses, and which is connected to the input port of a standard circuit board. A random pulse generator

40、 with an output capacity from 0,05 Gbps to 12 Gbps is recommended.5.1.2 Oscilloscope, used to measure the eye patterns of random waveforms generated through the output terminal of a test circuit board. It is connected to the output terminal of a test circuit board using a coaxial cable. An oscillosc

41、ope with a band up to 18 GHz is recommended.5.1.2 Coaxial cable and a subminiature type A (SMA) connector, and an SMA connector with a band up to 20 GHz.5.2 Apparatus for characteristic impedance measurement, consisting of a transmission line, used to measure the high-frequency characteristic. The t

42、ransmission line shows characteristic impedance, and therefore the test circuit board is designed so that it can match the internal impedance of a measuring apparatus. A general value of the internal characteristic impedance of a test apparatus is 50 . The apparatus is used to check whether or not t

43、he test standard circuit boar adapts to such internal impedance.5.2.1 TDR-mode oscilloscopes, of high frequency, and equipped with the time domain reflection (TDR) mode for measurement. Firstly, match the y-axis with impedance and examine a reflection state of the step wave pattern. Then, examine th

44、e output value and profile to judge whether or not the characteristic impedance of the standard test circuit board has been matched with the designed one. Figure 4 shows an example of typical measurement. Apparatus with the rise time of step waveform 30 ps or shorter is recommended.Figure 4 Example

45、of typical profile of the characteristic impedance measured in the TDR mode4 ISO 2014 All rights reservedBS ISO 16525-9:2014ISO 16525-9:2014(E)5.3 Apparatus for measuring frequency characteristic. A digital signal is a composite wave that consists of sine waves, and in signal transmission it is esse

46、ntial not to change the ratio of such composite waves. Therefore after measuring the characteristic of wide-ranging frequencies of sine waves, the maximum level of the measured wave should be confirmed.5.3.1 Network analyser, capable of measuring the scattering parameter, starting with calibration o

47、f the copper line pattern (on the test circuit board described in 5.4), whose line is identical in length to that of the standard test circuit board. By subtracting the measured value of the copper line pattern from that of the standard pattern, the characteristic of the line can be cancelled. This

48、means that only the characteristic of the printed or bonded portion can be extracted. Connect the test circuit board to the network analyser using a coaxial cable. Figure 5 shows an example of typical measurement of S21 and S11. Apparatus with a measurement range from 50 MHz to 40 GHz is recommended

49、. The range of measurement is usually from 100 MHz to 30 GHz (or 20 GHz depending on the relevant purpose).a) Before subtractionb) After subtractionKeyX frequency (GHz)Y signal (dB)Figure 5 Example of typical measurement of the scattering parameter5.4 Test circuit boards, with the following specifications.a) Material of substrateGlass fabric-based epoxy resin copper-clad laminate with a double-sided (the X-Y plane), three-layer conductor (the Z-direction) substrate, as specified in IEC 61249