BS PD CLC TR 62258-3-2007 Semiconductor die nproducts — nPart 3 Recommendations for good npractice in handling packing and nstorage《半导体压模产品 第3部分 搬运、包装和储存的良好规范建议》.pdf

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2、ractice in handling, packing and storageICS 31.080.99Semiconductor die products Part 3: Recommendations for good PUBLISHED DOCUMENTPD CLC/TR 62258-3:2007PD CLC/TR 62258-3:2007Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56, Uncontrolled Copy, (c) BSIThis Published Document wa

3、s published under the authority of the Standards Policy and Strategy Committee on 7 December 2005 BSI 2008ISBN 978 0 580 60750 9Amendments/corrigenda issued since publicationDate Comments30 May 2008 This corrigendum renumbers PD IEC/TR 62258-3:2005 as PD CLC/TR 62258-3:2007contract. Users are respon

4、sible for its correct application.National forewordThis Published Document is the UK implementation of CLC/TR 62258-3:2007. It is identical to IEC/TR 62258-3:2005. It supersedes PD IEC/TR 62258-3:2005 and PD ES 59008-4-2:2001, which are withdrawn.The UK participation in its preparation was entrusted

5、 to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a TECHNICAL REPORT CLC/TR 62258-3 RAPPORT TECHNIQUE TECHNISCHER BERICHT Februa

6、ry 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means r

7、eserved worldwide for CENELEC members. Ref. No. CLC/TR 62258-3:2007 E ICS 31.080.99 Supersedes ES 59008-4-2:2000English version Semiconductor die products Part 3: Recommendations for good practice in handling, packing and storage (IEC/TR 62258-3:2005) Halbleiter-Chip-Erzeugnisse Teil 3: Empfehlungen

8、 fr die Praxis bei Handhabung, Verpackung und Lagerung (IEC/TR 62258-3:2005) This Technical Report was approved by CENELEC on 2006-12-12. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany

9、, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56, Uncontrolled Copy, (c)

10、 BSIForeword The text of the Technical Report IEC/TR 62258-3:2005, prepared by IEC TC 47, Semiconductor devices, was submitted to vote and was approved by CENELEC as CLC/TR 62258-3 on 2006-12-12. This Technical Report supersedes ES 59008-4-2:2000. Annex ZA has been added by CENELEC. _ Endorsement no

11、tice The text of the Technical Report IEC/TR 62258-3:2005 was approved by CENELEC as a Technical Report without any modification. _ 2 CLC/TR 62258-3:2007Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56, Uncontrolled Copy, (c) BSICONTENTS INTRODUCTION.5 1 Scope and object6 2 No

12、rmative references .6 3 Terms and definitions .7 4 Handling Good practice7 4.1 General .7 4.2 Working environmental controls .7 4.3 General handling precautions 7 4.4 Cleanroom good practice .7 5 Process handling issues .11 5.1 Wafer sawing.11 5.2 Die sorting.12 6 Die and wafer transport and storage

13、 media .15 6.1 Wafer carriers and cassettes15 6.2 In-process carriers and transport systems 16 6.3 Packing for shipment of unsawn wafers16 6.4 Packing for shipment of sawn wafers .17 6.5 Packing for shipment of single wafers 20 6.6 Packing for shipment of die using trays 20 6.7 Packing for shipment

14、of die using tape-and-reel .24 6.8 Secondary packing for shipment 26 7 Storage good practice.27 7.1 Die and wafer storage27 7.2 Short-term storage environment and conditions27 7.3 Storage time limitations .27 7.4 Sawn wafer on wafer frame or ring.28 7.5 Die products in the production area28 7.6 Die

15、in tape-and-reel.28 7.7 Dry-packed die products 28 8 Traceability good practice.28 8.1 General .28 8.2 Wafer traceability 28 8.3 Die products traceability 28 8.4 Wafer and die back side marking .29 9 Guidelines for long-term storage (die banking) of bare die and wafers .29 9.1 General .29 9.2 Prepar

16、ing for storage.29 9.3 Damage to die products during long-term storage.30 9.4 Long-term storage environment30 9.5 Recommended inert atmosphere purity 31 9.6 Chemical contamination.31 9.7 Electrical effects32 3 CLC/TR 62258-3:2007Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56

17、, Uncontrolled Copy, (c) BSI9.8 Protection from radiation32 9.9 Periodic qualification of stored die products .32 10 Good practice for automated handling during assembly .33 10.1 Removal of die from shipping media.33 10.2 Equipment out of service .33 Annex A (informative) Planning checklist34 Annex

18、B (informative) Material specifications40 Bibliography .43 Figure 1 Bevel cut for bare die and flip-chip products11 Figure 2 Die eject needle .14 Figure 3 Wafer jar structure17 Figure 4 Film frame18 Figure 5 Grip ring.19 Figure 6 Single waffle pack 21 Figure 7 Stacked waffle packs22 Figure 8 Vacuum-

19、release trays.23 Figure 9 Corner relief in the cavity of a chip tray.24 Figure 10 Tape-and-reel packing structure .26 Figure 11 Packaging material for shipment .26 Table 1 Example die eject marks14 Table A.1 Planning checklist 34 4 Annex ZA (normative) Normative references to international publicati

20、ons with their corresponding European publications 44 CLC/TR 62258-3:2007Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56, Uncontrolled Copy, (c) BSIINTRODUCTION Organizations that helped prepare this technical report included the ESPRIT GOOD-DIE project, DPC, and JEITA. 5 CLC

21、/TR 62258-3:2007Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56, Uncontrolled Copy, (c) BSISEMICONDUCTOR DIE PRODUCTS Part 3: Recommendations for good practice in handling, packing and storage 1 Scope and object This technical report has been developed to facilitate the produ

22、ction, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers with attached connection structures, and minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products.

23、 Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first

24、 time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the

25、edition cited applies. For undated references the lasted edition of the referenced document (including any amendments) applies. IEC 60050 (all parts), International Electrotechnical Vocabulary IEC 60286-3, Packaging of components for automatic handling Part 3: Packaging of surface mount components o

26、n continuous tapes IEC 61340-5-1:1998, Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements IEC 61340-5-2:1999, Electrostatics Part 5-2: Protection of electronic devices from electrostatic phenomena User guide IEC 62258-1, Semiconductor die prod

27、ucts Part 1: Requirements for procurement and use 1ISO 14644-1, Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness 1Under consideration. 6 CLC/TR 62258-3:2007Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56, Uncontrolled Copy, (c) BSI3

28、Terms and definitions For the purposes of this document, relevant terms which are defined in IEC 60050, together with additional terms and acronyms as given is IEC 62258-1, shall apply. 4 Handling Good practice 4.1 General Contact with the exposed active surface of die products should be avoided. Wh

29、en contact is absolutely necessary, only properly designed tools and materials should be used. The working environment, including tools, materials and containers for handling and transport of die products should provide for ESD protection (refer to IEC 61340-5-1 and IEC 61340-5-2). It should also be

30、 realised that die products are sensitive to certain chemicals. 4.2 Working environmental controls The following are the typical recommended working environmental conditions for most semiconductor technologies. Characterisation of the particular technology used should be conducted to determine any s

31、pecific environmental needs. This working environment should not be used for storage of semiconductor die. a) Temperature: 17 C 28 C b) Humidity 40 % nominal 2010+% c) Particle count: ISO 14644-1, Class 8 or better 4.3 General handling precautions The selection of appropriate tools is critical to su

32、ccessful handling of bare die and wafers. There is a range of specialized tools available for correct handling of die and wafers. If any tooling or equipment is found to damage die products, its use should be suspended immediately. Die products should never be allowed to come into contact with each

33、other, or to be stacked on top of each other without the use of suitable separators. Die products should never be placed with the active side touching a hard surface. The die surface may also be damaged if it touches a soft surface that has embedded hard particles, such as silicon debris. When handl

34、ing wafers it is recommended that physical contact should be made only with the outer periphery and/or the back side of the wafer. 4.4 Cleanroom good practice Containers of bare die or wafers should only be opened in a work area with a controlled environment, known as a cleanroom. This applies to an

35、y process that exposes the die or wafer surface to the environment, for example quality checks, die sorting or assembly of products containing bare die. Personnel working in these areas need to be adequately trained to ensure that die products are not physically damaged nor contaminated when handled

36、 in the cleanroom. 7 CLC/TR 62258-3:2007Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56, Uncontrolled Copy, (c) BSI4.4.1 General ESD damage may be reduced through the use of grounded workstations, conductive wrist straps and/or shoe straps, conductive material totes, staticid

37、e chemicals, conductive floor waxes, tiles, mats, ionizers, conductive packing foams, and shielded bags. These items can also improve the efficiency of the environmental controls employed. Bare die or wafers in process should remain in a clean environment at all times. If wafers are to be transporte

38、d between cleanrooms, a suitable wafer carrier should be used and the container should remain closed during transportation. The container should be externally cleaned on re-entering the cleanroom. It is recommended that die or wafers should not be handled manually. Handling die or wafers with bare h

39、ands should be avoided since this will cause contamination from skin oil, skin flakes, and a variety of other contaminants from human and other sources. Even when using gloves, handling may cause contamination by transfer of plasticizer from the glove. However, it is acceptable to handle wafers with

40、 a gloved hand as long as the wafer is held on the edge and the active surface is not touched at all. All surfaces coming in contact with die products throughout the process should be clean and, when practicable, non-metallic. Any hard material in contact with the die products may cause scratches or

41、 chipping. These principles should be observed at all times, since if one die or wafer becomes contaminated, the contaminants may be transferred to other surfaces, process equipment and wafers. Care should be taken to avoid contaminating surfaces used for product handling. Working surfaces should no

42、t be used to hold non-clean items, such as equipment covers, internal parts or personal belongings. Wiping a surface clean may not adequately remove oils and residues. 4.4.2 Attire 4.4.2.1 Hats, hoods, nets, masks and shoes Head and facial hair should be completely enclosed at all times using approp

43、riate hoods or nets to avoid contamination from skin particles or hair. It is recommended that masks are worn at all times while in the production area with exposed wafers or die to prevent contamination by spittle. Masks should cover the mouth, and ideally, the nose and should be replaced daily or

44、more often if they become contaminated. Special ESD-safe cleanroom shoes should be worn within the cleanroom. These shoes should be kept inside the cleanroom or changing area and only be taken outside the area for cleaning or repair. Alternatively, overshoes may be used which should be discarded imm

45、ediately after use in suitable waste containers. Some overshoes are suitable for re-use after washing, however, they are not intended to be re-used without being cleaned. 4.4.2.2 Smocks and gowns Special smocks and gowns should be worn within the cleanroom, to cover normal clothing. They should be s

46、elected according to the cleanroom classification and should be made of material that is both anti-static and lint-free. 4.4.2.3 Gloves Gloves serve as the final barrier in preventing release of skin flakes, skin oils, and other hand-carried contaminants. Disposable vinyl gloves that are approved fo

47、r cleanrooms are appropriate for general use. 8 CLC/TR 62258-3:2007Licensed Copy: Wang Bin, ISO/EXCHANGE CHINA STANDARDS, 28/07/2008 07:56, Uncontrolled Copy, (c) BSICotton gloves or other gloves that shed lint or powder should not be worn in handling die products, even under vinyl gloves. Polyester

48、 or nylon gloves may be worn under vinyl gloves. Rubber gloves packed with powder should not to be used. Gloves should be replaced each time the cleanroom is entered, or more often if they become contaminated in any way, for example by ink or from touching the face. Gloves that have rips or tears sh

49、ould be replaced immediately. When gowning, gloves should always be put on last, after other items. Gloves should be worn over cuffs on sleeves and should be held at the wrists only at all times. No contact should be made with face, hair, or other potential sources of contamination by gloved hands; such contamination can be transferred to other items, including die products, process equipment and handling equipment. 4.4.2.4 Finger cots Finger cots are often used instead of gl