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本文(BS PD IEC TR 61967-1-1-2015 Integrated circuits Measurement of electromagnetic emissions General conditions and definitions Near-field scan data exchange format《集成电路 电磁辐射管理 第1-1部分 .pdf)为本站会员(postpastor181)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

BS PD IEC TR 61967-1-1-2015 Integrated circuits Measurement of electromagnetic emissions General conditions and definitions Near-field scan data exchange format《集成电路 电磁辐射管理 第1-1部分 .pdf

1、BSI Standards PublicationIntegrated circuits Measurement of electromagnetic emissionsPart 1-1: General conditions and definitions Near-field scan data exchange formatPD IEC/TR 61967-1-1:2015National forewordThis Published Document is the UK implementation of IEC/TR 61967-1-1:2015. It supersedes PD I

2、EC/TR 61967-1-1:2010 which iswithdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary pr

3、ovisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2015.Published by BSI Standards Limited 2015ISBN 978 0 580 86204 5ICS 31.200Compliance with a British Standard cannot confer immunity fromlegal obligations.This Published Document was publishe

4、d under the authority of theStandards Policy and Strategy Committee on 30 September 2015.Amendments/corrigenda issued since publicationDate Text affectedPUBLISHED DOCUMENTPD IEC/TR 61967-1-1:2015IEC TR 61967-1-1 Edition 2.0 2015-08 TECHNICAL REPORTIntegrated circuits Measurement of electromagnetic e

5、missions Part 1-1: General conditions and definitions Near-field scan data exchange formatINTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.200 ISBN 978-2-8322-2880-7 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an au

6、thorized distributor. colourinsidePD IEC/TR 61967-1-1:2015 2 IEC TR 61967-1-1:2015 IEC 2015 CONTENTS FOREW ORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms, definitions and abbreviations . 8 3.1 Terms and definitions 8 3.2 Abbreviations 9 4 General syntax rules and guidelines 9 4.

7、1 General . 9 4.2 X ML requirements . 9 4.2.1 General . 9 4.2.2 X ML declaration . 9 4.2.3 X ML elements 9 4.2.4 Root element . 10 4.2.5 Comments . 10 4.2.6 Line terminations . 10 4.2.7 Element hierarchy 10 4.3 K eyword requirements 11 4.3.1 General . 11 4.3.2 K eyword characters . 11 4.3.3 K eyword

8、 syntax . 11 4.3.4 Root element keywords . 12 4.4 File structure . 12 4.4.1 General . 12 4.4.2 File names . 12 4.4.3 File paths 12 4.4.4 Single X ML file 12 4.4.5 Multiple X ML files 12 4.4.6 Separate data files 13 4.4.7 Additional files . 13 4.4.8 File compression . 13 4.5 Values 14 4.5.1 General .

9、 14 4.5.2 Numerical value syntax 15 4.5.3 Numerical value with units syntax 15 4.5.4 Text string . 15 4.5.5 Valid units . 15 4.6 Coordinate systems 16 4.6.1 General . 16 4.6.2 Cartesian coordinate system 16 4.6.3 Cylindrical coordinate system 17 4.6.4 Spherical coordinate system 18 4.6.5 Coordinate

10、offsets . 19 4.6.6 Image coordinates . 20 4.7 Field type and orientation 21 4.8 Data syntax . 24 PD IEC/TR 61967-1-1:2015IEC TR 61967-1-1:2015 IEC 2015 3 4.8.1 General . 24 4.8.2 Data arrangement 24 4.8.3 Data with coordinate information 25 4.8.4 Data without coordinate information . 25 4.8.5 Data f

11、ormat . 26 4.8.6 Data notation . 26 4.9 Probe factor 28 4.10 Images 30 4.10.1 General . 30 4.10.2 Image file types . 30 4.10.3 Image file name and path 30 4.11 3D objects 30 4.11.1 General . 30 4.11.2 3D object file types 30 4.11.3 3D object file name and path . 30 4.11.4 3D map object file name and

12、 path 30 Annex A (informative) Example files . 31 A.1 Minimum default file 31 A.1.1 Example file . 31 A.1.2 Default value description . 31 A.2 File with magnitude and angle data . 32 A.2.1 Example file . 32 A.2.2 Default value description . 32 A.3 File with field azimuth and zenith orientation . 33

13、A.3.1 Example file . 33 A.3.2 Default value description . 33 A.4 File with optimised field azimuth orientation 34 A.4.1 Example file . 34 A.4.2 Default value description . 34 A.5 File with piece-wise linear time domain data in a separate binary file 35 A.5.1 Example file . 35 A.5.2 Default value des

14、cription . 35 A.6 File without coordinate information 35 A.6.1 Example file . 35 A.6.2 Default value description . 36 A.7 File for immunity scan with multiple criteria . 36 A.7.1 Example file . 36 A.7.2 Default value description . 37 A.8 File for emission scan with probe factor 38 A.8.1 Example file

15、 . 38 A.8.2 Default value description . 38 A.9 File for immunity scan with probe factor 39 A.9.1 Example file . 39 A.9.2 Default value description . 39 A.10 File with image and 3D image . 40 A.10.1 Example file . 40 A.10.2 Default value description . 40 A.11 File with plane rotation 41 A.12 Emission

16、 scan in several X ML files . 42 PD IEC/TR 61967-1-1:2015 4 IEC TR 61967-1-1:2015 IEC 2015 Annex B (normative) Valid keywords 44 B.1 General . 44 B.2 File header keywords 44 B.3 Global keywords . 44 B.4 Component section keywords 44 B.5 Setup section keywords 45 B.6 Probe section keywords 46 B.7 Dat

17、a section keywords 46 Annex C (normative) K eyword usage rules . 49 Bibliography 63 Figure 1 Multiple X ML files . 13 Figure 2 X ML files with data files . 14 Figure 3 Additional files . 14 Figure 4 Right-hand Cartesian coordinate system 17 Figure 5 Left-hand Cartesian coordinate system 17 Figure 6

18、Cylindrical coordinate system . 18 Figure 7 Spherical coordinate system 19 Figure 8 Offsets and image positioning (right-hand Cartesian) . 20 Figure 9 Offsets and image positioning (left-hand Cartesian) . 21 Figure 11 Field orientation Right-hand Cartesian coordinate system . 22 Figure 12 Field orie

19、ntation Left-hand Cartesian coordinate system . 22 Figure 13 Field orientation Cylindrical coordinate system 23 Figure 14 Field orientation Spherical coordinate system 23 Figure A 1 Example .obj file . 40 Figure A.2 Coordinates in DUT reference plane . 41 Figure A.3 Coordinates in the measurement re

20、ference plane . 42 Table 1 Valid logarithmic units . 16 Table 2 Relationship between azimuth, zenith angles and field component 24 Table 3 Permitted values for the keyword: Coordinates 25 Table 4 Order of measurement points when coordinates are not included 27 Table 5 Probe factor linear units 29 Ta

21、ble 6 Probe factor logarithmic units 29 Table A.1 Data matrix 36 Table A.2 Magnetic field strength for emission . 38 Table A.3 Magnetic field strength for immunity . 39 Table C.1 File header keywords . 49 Table C.2 Global keywords 50 Table C.3 Component section keywords 51 Table C.4 Setup section ke

22、ywords . 53 Table C.5 Probe section keywords . 56 Table C.6 Data section keywords . 58 PD IEC/TR 61967-1-1:2015IEC TR 61967-1-1:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ _ _ _ _ _ _ _ _ _ _ _ INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS Part 1-1: General conditions

23、and definitions Near-field scan data exchange format FOREW ORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operat

24、ion on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “

25、 IEC Publication(s)” ). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this prep

26、aration. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international cons

27、ensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. W hile all reasonable efforts

28、 are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

29、 transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Indepen

30、dent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No lia

31、bility shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (inc

32、luding legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application o

33、f this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International S

34、tandards. However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “ state of the art“ . IEC TR 61967-1-1, which is a technical report, has been prep

35、ared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2010. This edition constitutes a technical revision. This edition includes the following significant changes with respect to th

36、e previous edition: Addition of: PD IEC/TR 61967-1-1:2015 6 IEC TR 61967-1-1:2015 IEC 2015 4.11 3D objects; Binary data files; Piece-wise linear time domain and frequency domain data; Vectors permitting rotation and offset of measurement and DUT reference planes; Transducer gain and probe factor can

37、 be complex; New keywords: Object3d, Mapobj, Maxhold, Datafileformat, Vx, Vy, Vz, Target, Software, Data_ source. Updating of: 4.9 Probe factor and corresponding keywords. Modification of: K eywords: Average. The text of this technical report is based on the following documents: Enquiry draft Report

38、 on voting 47A/ 953/ DTR 47A/ 962/ RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/ IEC Directives, Part 2. A list of all parts of the IEC 6196

39、7 series, under the general title Integrated circuits Measurement of electromagnetic emissions, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “ http:/ / webstore.iec.c

40、h“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication i

41、ndicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. PD IEC/TR 61967-1-1:2015IEC TR 61967-1-1:2015 IEC 2015 7 INTRODUCTION Near-field scan measurements, as described for e

42、xample in IEC TS 61967-3 11or IEC TS 62132-9 2 , and simulations generate a large amount of data. Many different formats are used for storing the data, thereby rendering its exchange extremely difficult. The proposed format is intended to facilitate exchange of near-field scan data between industria

43、ls, academics, EDA tool vendors and end customers. It is based on the well-known X ML format, which is both machine and human readable. Its structure allows the files to be generated and processed on any operating system. In order to limit the file size, it is possible to store the information and d

44、ata in a single file or multiple files. Moreover, the ASCII-based X ML format allows the files to be compressed to a very high level with readily available compression software. The three conventional coordinate systems (Cartesian, cylindrical and spherical) are supported by the proposed exchange fo

45、rmat. Information on the device under test, the test set-up, the probe, etc., is also included in the files. Notes and links to external documents allow complex test environments to be well described. The version of the exchange format described in this technical report is 2.0. Future revisions will

46、 add items, such as new keywords and rules, considered to be “ enhancements“ to Version 1.0. Consequently, all future revisions will be considered supersets of Version 2.0, allowing backward compatibility. _ _ _ _ _ _ _ _ _ _ _ _ _ 1Figures in square brackets refer to the Bibliography. PD IEC/TR 619

47、67-1-1:2015 8 IEC TR 61967-1-1:2015 IEC 2015 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS Part 1-1: General conditions and definitions Near-field scan data exchange format 1 Scope This part of IEC 61967 provides guidance for exchanging data generated by near-field scan measurements.

48、The described exchange format could also be used for near-field scan data generated by simulation or computation software. It should be noted that, although it has been developed for near-field scan, its use is not restricted to this application. The exchange format can be applied to emission and im

49、munity near-field scan data in the frequency and time domains. The scope of this technical report includes neither the methods used for the measurements or simulations, nor the software and algorithms used for generating the exchange file or for processing or viewing the data contained therein. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and a

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