1、BSI Standards PublicationIntegrated circuits Measurement of electromagnetic emissionsPart 3: Measurement of radiated emissions Surface scan methodPD IEC/TS 61967-3:2014National forewordThis Published Document is the UK implementation of IEC/TS 61967-3:2014.It supersedes DD IEC/TS 61967-3:2005 which
2、is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Use
3、rs are responsible for its correct application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 78113 1ICS 31.200 Compliance with a British Standard cannot confer immunity fromlegal obligations.This Published Document was published under the authority of
4、theStandards Policy and Strategy Committee on 30 September 2014.Amendments/corrigenda issued since publicationDate Text affectedPUBLISHED DOCUMENTPD IEC/TS 61967-3:2014IEC TS 61967-3 Edition 2.0 2014-08 TECHNICAL SPECIFICATION SPECIFICATION TECHNIQUE Integrated circuits Measurement of electromagneti
5、c emissions Part 3: Measurement of radiated emissions Surface scan method Circuits intgrs Mesure des missions lectromagntiques Partie 3: Mesure des missions rayonnes Mthode de balayage en surface INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE W ICS 31.200 PRICE
6、CODE CODE PRIX ISBN 978-2-8322-1809-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous av
7、ez obtenu cette publication via un distributeur agr. colourinsidePD IEC/TS 61967-3:2014CONTENTS FOREWORD. 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms, definitions and abbreviations 8 3.1 Terms and definitions 8 3.2 Abbreviations 9 4 General . 9 5 Test conditions 10 5.1 General . 10
8、 5.2 Supply voltage 10 5.3 Frequency range . 10 6 Test equipment 10 6.1 General . 10 6.2 Shielding . 10 6.3 RF measuring instrument 10 6.4 Preamplifier 10 6.5 Cables 11 6.6 Near-field probe 11 6.6.1 General . 11 6.6.2 Magnetic (H) field probe . 11 6.6.3 Electric (E) field probe 11 6.6.4 Combined ele
9、ctric and magnetic (E/H) field probe . 11 6.6.5 Probe-positioning and data acquisition system 11 7 Test setup . 12 7.1 General . 12 7.2 Test configuration . 12 7.3 Test circuit board 14 7.4 Probe-positioning system software setup . 14 7.5 DUT software 14 8 Test procedure 14 8.1 General . 14 8.2 Ambi
10、ent conditions 14 8.3 Operational check . 14 8.4 Test technique 15 9 Test report 16 9.1 General . 16 9.2 Measurement conditions 16 9.3 Probe design and calibration . 16 9.4 Measurement data 16 9.5 Post-processing 17 9.6 Data exchange 17 Annex A (normative) Calibration of near-field probes 18 A.1 Gen
11、eral . 18 A.2 Test equipment . 20 A.2.1 General . 20 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 A.2.2 PCB with microstrip line . 20 A.3 Calibration setup . 21 A.4 Calibration procedure 22 Annex B (informative) Discrete electric and magnetic field probes 25 B.1 General . 25 B.2 Probe electri
12、cal description . 25 B.3 Probe physical description . 26 B.3.1 General . 26 B.3.2 Electric field probe . 26 B.3.3 Magnetic field probe . 26 Annex C (informative) Combined electric and magnetic field probe example 28 C.1 General . 28 C.2 Probe electrical description . 28 C.3 Probe physical descriptio
13、n . 29 C.4 Measurement and data acquisition system . 29 Annex D (informative) Coordinate systems . 31 D.1 General . 31 D.2 Cartesian coordinate system . 31 D.3 Cylindrical coordinate system 32 D.4 Spherical coordinate system 33 D.5 Coordinate system conversion . 33 Bibliography . 34 Figure 1 Example
14、 of probe-positioning system 12 Figure 2 One-input RF measurement setup 13 Figure 3 Two-input RF measurement setup with reference probe 13 Figure 4 Two-input RF measurement setup with reference signal 13 Figure 5 Examples of data overlaid on an image of the DUT (Contour chart) . 16 Figure A.1 Typica
15、l probe factor against frequency 20 Figure A.2 Microstrip line for calibration (transverse cross-section) . 21 Figure A.3 Microstrip line for calibration (longitudinal cross-section) 21 Figure A.4 Probe calibration setup 22 Figure A.5 Scan direction across Microstrip line 22 Figure A.6 Typical plot
16、of measured signal level and simulated field strength (HX) 24 Figure A.7 Typical plot of measured signal level and simulated field strength (Hz) . 24 Figure B.1 Electric and magnetic field probe schematics . 25 Figure B.2 Example of electric field probe construction (EZ) . 26 Figure B.3 Example of m
17、agnetic field probe construction (HXor HY) . 27 Figure C 1 Electromagnetic field probe schematic . 28 Figure C.2 Electromagnetic field probe construction . 29 Figure C.3 Measurement and data acquisition system overview 30 Figure C.4 Measurement and data acquisition system detail . 30 Figure D.1 Righ
18、t-hand Cartesian coordinate system (preferred) 31 Figure D.2 Left-hand Cartesian coordinate system 32 Figure D.3 Cylindrical coordinate system 32 Figure D.4 Spherical coordinate system . 33 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 Table A.1 Probe factor linear units . 19 Table A.2 Probe f
19、actor logarithmic units . 19 Table A.3 Dimensions for 50 microstrip . 21 Table D.1 Coordinate system conversion 33 PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS Part 3: Measurement of radia
20、ted emissions Surface scan method FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions
21、 concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”)
22、. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collabora
23、tes closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on th
24、e relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure tha
25、t the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the m
26、aximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodi
27、es provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to
28、IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
29、expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9)
30、Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptiona
31、l circumstances, a technical committee may propose the publication of a technical specification when the required support cannot be obtained for the publication of an International Standard, despite repeated efforts, or the subject is still under technical development or where, for any other reason,
32、 there is the future but no immediate possibility of an agreement on an International Standard. Technical specifications are subject to review within three years of publication to decide whether they can be transformed into International Standards. IEC 61967-3, which is a technical specification, ha
33、s been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 This second edition cancels and replaces the first edition published in 2005. This edition constitutes a technical revision. This editio
34、n includes the following significant technical changes with respect to the previous edition: a) Removal of: 9.4 Data analysis; Annex D Analysing the data from near-field surface scanning. b) Addition of: Introduction 9.4 Measurement data 9.5 Post-processing 9.6 Data exchange Annex D Coordinate syste
35、ms c) Expansion of: 8.4 Test technique Annex A Calibration of near-field probes The text of this technical specification is based on the following documents: Enquiry draft Report on voting 47A/925/DTS 47A/937/RVC Full information on the voting for the approval of this technical specification can be
36、found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61967 series, published under the general title Integrated circuits Measurement of electromagnetic emissions, can be found o
37、n the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an Int
38、ernational standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore pr
39、int this document using a colour printer. PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 INTRODUCTION Techniques for scanning near-fields radiated by integrated circuits and their surrounding environment can identify the areas of radiation, which may cause interference to nearby devices. The ab
40、ility to associate magnetic or electric field strengths with a particular location on a device can provide valuable information for improvement of an IC both in terms of functionality and EMC performance. Near-field scan techniques have considerably evolved over recent years. The improved sensitivit
41、y, bandwidth and spatial resolution of the probes offer analysis of integrated circuits operating into the gigahertz range. The ability to measure radiation both in the frequency and time domain allows not only analysis of fields generated by an IC, but also fields generated by externally applied di
42、sturbances propagating through the device. Post-processing can considerably enhance the resolution of a near-field scan measurement and the measured data can be shown in various ways, per users choice. PD IEC/TS 61967-3:2014 IEC TS 61967-3:2014 IEC 2014 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGN
43、ETIC EMISSIONS Part 3: Measurement of radiated emissions Surface scan method 1 Scope This part of IEC 61967 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diag
44、nostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC
45、but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is d
46、etermined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be ca
47、rried out in the frequency domain or in the time domain. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the lates
48、t edition of the referenced document (including any amendments) applies. IEC 60050(all parts), International Electrotechnical Vocabulary (available at ) IEC 61967-1, Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 1: General conditions and definitions 3 Terms, def
49、initions and abbreviations 3.1 Terms and definitions For the purpose of this document, the terms and definitions given in IEC 61967-1, IEC 60050-131 and IEC 60050-161, as well as the following apply. 3.1.1 altitude distance between the tip of the near-field probe and the reference plane of the scan (e.g. the PCB, the upper surface of the package) Note 1 to entry: The term “altitude” refers to the vertical directi
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