BS PD IEC TS 62647-3-2014 Process management for avionics Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free .pdf

1、BSI Standards PublicationProcess management for avionics Aerospace and defence electronic systems containing lead-free solderPart 3: Performance testing for systems containing lead-free solder and finishesPD IEC/TS 62647-3:2014Copyright British Standards Institution Provided by IHS under license wit

2、h BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-National forewordThis Published Document is the UK implementation of IEC/TS 62647-3:2014.It supersedes DD IEC/PAS 62647-3:2011 which is withdrawn.The UK participation in its preparation was e

3、ntrusted to TechnicalCommittee GEL/107, Process management for avionics.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct appli

4、cation. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 83707 4ICS 03.100.50; 31.020; 49.060Compliance with a British Standard cannot confer immunity fromlegal obligations.This Published Document was published under the authority of theStandards Policy an

5、d Strategy Committee on 31 March 2014.Amendments/corrigenda issued since publicationDate Text affectedPUBLISHED DOCUMENTPD IEC/TS 62647-3:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted witho

6、ut license from IHS-,-,-IEC TS 62647-3 Edition 1.0 2014-02 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 3: Performance testing for systems containing lead-free solder and finishes INTERNATIONAL ELECTROTECHNICAL COMM

7、ISSION X ICS 03.100.50; 31.020; 49.060 PRICE CODE ISBN 978-2-8322-1456-5 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colourinsidePD IEC/TS 62647-3:2014Copyright British Standards Instituti

8、on Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,- 2 IEC TS 62647-3:2014 IEC 2014 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 8 2 Normative references 9 3 Terms, definitions and abbreviations . 9 3.1 Te

9、rms and definitions 9 3.2 Abbreviations 10 4 Assumption . 11 5 Default test methods 11 5.1 General . 11 5.2 Test vehicles 11 5.2.1 Test vehicle type . 11 5.2.2 Sample size . 12 5.3 Pre-conditioning by thermal aging method 12 5.3.1 General . 12 5.3.2 Thermal aging acceleration model . 12 5.3.3 Defaul

10、t test parameters . 13 5.4 Default temperature cycle test method 13 5.4.1 Test parameters 13 5.4.2 Test duration . 13 5.4.3 Failure determination and analysis 13 5.4.4 Acceleration model 14 5.5 Vibration test 15 5.6 Mechanical shock . 16 5.7 Combined environments . 16 6 Protocol to design and conduc

11、t performance tests . 16 6.1 General . 16 6.2 Test vehicles 17 6.3 Temperature cycle test protocol 17 6.3.1 General . 17 6.3.2 Measure the recovery time 17 6.3.3 Determine the high-temperature dwell times and temperatures 18 6.3.4 Select other test parameters as appropriate for the application 19 6.

12、3.5 Conduct tests 19 6.3.6 Determine the temperature versus cycles-to-failure relationship 19 6.3.7 Estimate the cycles-to-failure . 20 6.4 Vibration test 20 6.4.1 General . 20 6.5 Mechanical shock . 21 6.6 Combined environments test protocol . 21 6.6.1 General . 21 6.6.2 Combined environment relati

13、on . 23 6.6.3 Additional insight: NASA-DoD lead-free project . 23 6.6.4 Additional insight: concept of life cycle in accordance with MIL-STD-810G . 24 6.7 Failure determination and analysis 24 PD IEC/TS 62647-3:2014Copyright British Standards Institution Provided by IHS under license with BSI - Unco

14、ntrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-IEC TS 62647-3:2014 IEC 2014 3 7 Final remarks 24 Annex A (informative) Test sample size . 25 Annex B (informative) Material properties of lead-free solder materials 27 Annex C (informative) NASA-DoD lea

15、d-free electronics project test information . 31 C.1 General . 31 C.2 Vibration test 31 C.2.1 General . 31 C.2.2 Vibration test description . 31 C.2.3 Vibration test rationale . 33 C.2.4 Vibration of major or unique equipment . 34 C.2.5 Vibration data recording and calculations 35 C.3 Mechanical sho

16、ck . 35 C.3.1 Mechanical shock description 35 C.3.2 Mechanical shock rationale 36 C.3.3 Mechanical shock of major or unique equipment 37 C.3.4 Data recording and calculations . 38 C.4 Combined environment test 38 C.4.1 General . 38 C.4.2 Combined environment test description . 39 C.4.3 Combined envi

17、ronment test rationale . 39 C.4.4 Data recording and calculations . 40 Bibliography 41 Figure 1 Notional method for determining the recovery time for a given solder alloy, or combination of alloys 18 Figure 2 Notional method for determining the relationship between high temperature dwell time, thd,

18、and recovery time, tr19 Figure 3 Cycles-to-failure Notional method for determining the relationship between cycles-to-failure 20 Figure C.1 Vibration spectrum 32 Figure C.2 Vibration test fixture . 34 Figure C.3 Vibration table showing Y-axis 35 Figure C.4 Mechanical shock response spectrum . 36 Fig

19、ure C.5 Mechanical shock test set-up 38 Table B.1 Test and acceleration model parameters 28 Table C.1 Vibration profile . 32 Table C.2 Vibration test methodology 34 Table C.3 Mechanical shock test methodology Test procedure . 37 Table C.4 Combined environments test methodology . 39 PD IEC/TS 62647-3

20、2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,- 4 IEC TS 62647-3:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PROCESS MANAGEMENT FOR AVIONICS AEROS

21、PACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER Part 3: Performance testing for systems containing lead-free solder and finishes FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical co

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31、ation. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all suc

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33、 despite repeated efforts, or the subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International Standard. Technical specifications are subject to review within three years of publication to decide wh

34、ether they can be transformed into International Standards. PD IEC/TS 62647-3:2014Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-IEC TS 62647-3:2014 IEC 2014 5 IEC/T

35、S 62647-3, which is a technical specification, has been prepared by IEC technical committee 107: Process management for avionics. The text of this technical specification is based on the following documents: IEC/PAS 62647-3 and GEIA-STD-0005-3. This technical specification cancels and replaces IEC/P

36、AS 62647-3, published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Terms and definition subclause changed in Clause 3. b) Coherence with IEC/TS 62647-1, IEC/TS 62647-21 and IEC/TS 62

37、647-22 definitions. c) Introduction of “g-force” definition. d) Reference to IEC 62647 documents when already published. e) Harmonization of preconditioning data at Table B.1 level with regard to 5.3.3. The text of this technical specification is based on the following documents: Enquiry draft Repor

38、t on voting 107/213/DTS 107/233/RVC Full information on the voting for the approval of this technical specification can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the I

39、EC 62647 series, published under the general title Process management for avionics Aerospace and defence electronic systems containing lead-free solder, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date ind

40、icated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may b

41、e issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. PD IEC/TS 62647-3:20

42、14Copyright British Standards Institution Provided by IHS under license with BSI - Uncontrolled Copy Not for ResaleNo reproduction or networking permitted without license from IHS-,-,- 6 IEC TS 62647-3:2014 IEC 2014 INTRODUCTION The implementation of lead-free (Pb-free) interconnection technology in

43、to electronics has resulted in a variety of reactions by designers, manufacturers, and users. While the prime motivation for lead-free (Pb-free) technology was to address the social concern of improving the environment by limiting the amount of toxic and dangerous substances used in products, the ra

44、mifications of this initiative have provided a state of uncertainty regarding the performance in this context, defined as operation and reliability, i.e. the expected life cycle of a product of aerospace and defence systems. For over fifty years, tin-lead solder was the benchmark for electronics ass

45、embly and generations of research baselined its performance under a variety of operating conditions including the harsh settings of aerospace and defence equipment. However, with the integration of lead-free (Pb-free) technology, aerospace and defence companies are faced with questions as to whether

46、 these new materials will provide, as a minimum, the same degree of confidence during the life cycle of critical systems and products. In evaluating performance, two approaches are used: analysis/modelling and test. This document addresses the latter, providing guidance and direction in the developm

47、ent and execution of performance tests for lead-free (Pb-free) electronic interconnections. The user of this document needs to be aware of the following: This document does not give answers as to how to perform a specific test. Products and systems applications vary immensely, so designers need to u

48、nderstand use conditions and the entire life cycle. Once this is understood, then this document can be used to give designers an understanding of how to develop a suitable test, e.g., ascertain the type of platform in which a product will be used, comprehending all the environmental effects on the platform, and learning why material characterization is key to deciding upon test parameters, etc. Sound engineering knowledge and judgment will be required for the successful use of this document. The global transition to lead-free (Pb-free) electronics has a significant impact