ImageVerifierCode 换一换
格式:PDF , 页数:24 ,大小:569.48KB ,
资源ID:589120      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-589120.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(BS QC 760100-1997 Harmonized system of quality assessment for electronic components - Semiconductor devices - Integrated circuits - Sectional specification for film integrated circb.pdf)为本站会员(刘芸)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

BS QC 760100-1997 Harmonized system of quality assessment for electronic components - Semiconductor devices - Integrated circuits - Sectional specification for film integrated circb.pdf

1、BRITISH STANDARD BS QC 760100:1997 IEC 60748-21: 1997 Harmonized system of quality assessment for electronic components Semiconductor devices Integratedcircuits Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedu

2、res ICS 31.200BSQC760100:1997 This British Standard, having been prepared under the directionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comes intoeffect on 15 August 1997 BSI 09-1999 ISBN 0 580 28003 9 National foreword This British Standard rep

3、roduces verbatim IEC60748-21:1997 and implements it as the UK national standard. It supersedes BS QC760100:1991 which is withdrawn. This standard is a harmonized specification within the IEC system of quality assessment for electronic components (IECQ). The UK participation in its preparation was en

4、trusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals f

5、or change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. The British Standard which implements the IECQ Rules of Procedur

6、e is BS9000 General Requirements for a system for electronic components of assessed quality Part 3:1996 Specification for the national implementation of the IECQ system. From 1 January 1997, all IEC publications have the number60000 added to the old number. For instance, IEC27-1 has been renumbered

7、as IEC600027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the B

8、SI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsi

9、ble for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the IEC title page, page ii, pages1 to16 and a back cover. This standard has

10、 been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSQC760100:1997 BSI 09-1999 i Contents Page National foreword Inside front cover Text of IEC

11、 60748-21 1ii blankBSQC760100:1997 ii BSI 09-1999 Contents Page 1 Scope and object 1 2 General, preferred characteristics, ratings and severities for environmental tests 1 2.1 Normative references 1 2.2 Preferred ratings and characteristics 1 2.3 Information to be given in a detail specification 1 3

12、 Qualification approval procedures 2 3.1 Structural similarity 2 3.2 Qualification approval 3 3.3 Assessment levels 6 3.4 Resubmission of rejected lots (for lot-by-lot inspection) 9 3.5 Manufacturing stages in a factory of an approved manufacturer in a non-IEC member country 9 4 Test and measurement

13、 procedures 9 5 Tables of method B 10 Table 1 Test schedule for qualification approval for method A 4 Table 2 Assessment levels and acceptance criteria for qualification approval for method A 6 Table 3 Assessment levels and acceptance criteria for quality conformance inspection for method A 7 Table

14、4 Screening 9 Table 5 Test schedule for qualification approval for method B 10 Table 6 Assessment levels and acceptance criteria for qualification approval for method B 12 Table 7 Assessment levels and acceptance criteria for qualify conformance inspection for method B 13BSQC760100:1997 BSI 09-1999

15、1 1 Scope and object This sectional specification applies to film integrated circuits and hybrid film integrated circuits, manufactured as catalogue circuits or as custom-built circuits whose quality is assessed on the basis of qualification approval. The object of this specification is to present p

16、referred values for ratings and characteristics, to select from the generic specification the appropriate tests and measuring methods and to give general performance requirements to be used in detail specifications for film integrated circuits and hybrid film integrated circuits derived from this sp

17、ecification. The concept of preferred values is directly applicable to catalogue circuits but does not necessarily apply to custom-built circuits. Test severities and requirements prescribed in detail specifications referring to this sectional specification are of equal or higher performance level,

18、because lower performance levels are not permitted. Associated with this specification are one or more blank detail specifications, each referenced by an IECnumber. A blank detail specification which has been completed as specified in2.3 of this specification forms a detail specification. Such detai

19、l specifications are used for the granting of qualification approval of film integrated circuits and hybrid film integrated circuits and quality conformance inspection in accordance with the IECQ system. NOTEFor test procedures two alternatives are available: method A or method B. However, it is not

20、 permitted to change the methods between tests of method A, respectively B. In general, method A is more suitable for passive-component based film integrated circuits, whereas method B is more applicable to semiconductor integrated circuit technology based film integrated circuits. 2 General, prefer

21、red characteristics, ratings and severities for environmental tests 2.1 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC60748. At the time of publication, the editions indicated were valid. All

22、normative documents are subject to revision, and parties to agreements based on this part of IEC60748 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and ISO maintain registers of currently valid Internatio

23、nal Standards. IEC 60063:1963, Preferred number series for resistors and capacitors. IEC 60748-20:1988, Semiconductor devices Integrated circuits Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits. IEC 60748-20-1:1994, Semiconductor devices Integrated cir

24、cuits Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits Section 1: Requirements for internal visual examination. 2.2 Preferred ratings and characteristics Preferred values of voltages and currents are given in IEC60747-1; for resistors and capacitors, pr

25、eferred values are given in IEC60063; for custom-built circuits, any values and tolerances may be chosen. 2.3 Information to be given in a detail specification Detail specifications shall be derived from the relevant blank detail specifications. Detail specifications shall not specify severities inf

26、erior to those of the generic or sectional specification. When more severe requirements are included, they shall be listed in the detail specification and indicated in the test schedules, for example by an asterisk. NOTEThe information given on dimensions, characteristics and ratings may, for conven

27、ience, be presented in tabular form. The following information shall be given in each detail specification and the values quoted shall preferably be selected from those given in the appropriate clause of this sectional specification. Each detail specification shall prescribe all the tests and measur

28、ements required for lot-by-lot inspection and periodic testing. This shall, as a minimum, include the relevant tests given in this specification with methods and severities.BSQC760100:1997 2 BSI 09-1999 2.3.1 Outline drawing and dimensions There shall be an illustration of the circuit as an aid to e

29、asy recognition and for comparison of the circuit with others. Dimensions and their associated tolerances, which affect interchange ability and mounting, shall be prescribed in the detail specifications. All dimensions shall be stated in millimetres. Normally, numerical values shall be given for len

30、gth, width and height of the body, and the termination spacing or, for cylindrical types, the body diameter and length and diameter of the terminations. When necessary, for example when in a detail specification more than one package is covered, the dimensions and their associated tolerances shall b

31、e placed in a table below the drawing. When the configuration is other than that described above, the detail specification shall state such dimensional information so as to adequately describe the circuit. 2.3.2 Mounting The detail specification shall prescribe the method of mounting to be applied f

32、or normal use and for the application of the vibration, and the bump or shock tests. The design of the circuit may be such that special mounting fixtures are required in its use. In this case, the detail specification shall prescribe the mounting fixtures and they shall be used in the application of

33、 the vibration, and bump or shock tests. 2.3.3 Severities for environmental tests The detail specification shall prescribe the appropriate method of testing and the appropriate severities selected from section4 of the generic specification. 2.3.4 Marking The detail specification shall prescribe the

34、content of the marking on the circuit and on the primary package. Deviations from2.6 of the generic specification shall be specifically stated. 2.3.5 Ordering information The detail specification shall prescribe that the following information is required when ordering circuits: a) circuit type (for

35、example, hybrid thick film integrated circuit); b) number and issue of the detail specification with style reference and assessment level (if appropriate); c) function of the circuit (if appropriate); d) basic functional characteristics with tolerance (if appropriate). 2.3.6 Additional information (

36、not for inspection purposes) The detail specification may include information which is not normally required to be verified by the inspection procedure, such as circuit diagrams, curves, drawings and notes needed for clarification. 3 Qualification approval procedures See3.5 of the generic specificat

37、ion with the following details 3.1 Structural similarity For the purpose of assessment testing, structural similarity can be used if the testing of one representative type of circuit gives at least the same quality for the rest of the types which are grouped together. The chief inspector shall decla

38、re, to the satisfaction of the NSI, the method of operating the structural similarity plan within the manufacturing facilities and shall agree to the representative type(s) from each structurally similar group. For the qualification approval procedure, two or more circuits can be considered structur

39、ally similar, and thus the required numbers of specimens for a test shall be selected from the combined production, when they have the same function type, use the same design rules, materials, processes and methods (for example, a range of T-cell thick-film attenuators using the same line of inks; o

40、r thin-film D/A convertors using the same film material and same added components from the same supplier). For visual examination the only requirements are: marking, dimensions, sealing, solderability, robustness of terminations, and identical envelopes. Empty packages and/or electrical rejects may

41、be used.BSQC760100:1997 BSI 09-1999 3 3.2 Qualification approval The procedures for qualification approval testing are given in3.5 of the generic specification. The procedure for qualification approval on the basis of the fixed sample size schedule is given inTable 1 orTable 5. The schedules to be u

42、sed for qualification approval testing on the basis of lot-by-lot and periodic testing are given inTable 2 andTable 3, orTable 6 andTable 7. The tables for qualification approval (fixed sample size schedule) and quality conformance inspection (lot-by-lot and periodic tests) collectively prescribe th

43、e minimum test programme on completed circuits. The manufacturer may select which assessment level K, L or M he wishes to adopt, but may release products only as follows: A manufacturer may change the assessment level of his approval by completing the relevant tests. Subject to NSI agreement, he may

44、 downgrade without further periodic testing until current test interval dates expire. Any additional tests required for specific applications shall be prescribed in the detail specification. The post-test electrical limits for the relevant environmental tests shall be prescribed in the detail specif

45、ication. 3.2.1 Qualification approval (fixed sample size procedure) 3.2.1.1 Sampling The sample shall be representative of the range of circuits for which approval is sought, The size of the sample and the criterion of acceptability depend on the assessment level which is claimed and detailed inTabl

46、e 2 orTable 6. When additional groups are introduced into the test schedule, the number of circuits required for group “0” shall be increased by the same number as that required for the additional groups. 3.2.1.2 Tests The complete series of tests specified inTable 1 orTable 5 is required for the ap

47、proval of circuits covered by one detail specification. The tests in each group shall be carried out in the given order. The whole sample shall be subjected to the tests of group “0” and then divided for the other groups. Circuits found defective during the tests of group “0” shall not be used for t

48、he other groups. “One defective” is counted when a circuit has not satisfied the whole or a part of the tests of a group. The approval is granted when the number of defectives does not exceed the specified number of permissible defectives for each group or subgroup and the total number of permissibl

49、e defectives. Assessment level Release assessment levels K K, L or M L L or M M MBSQC760100:1997 4 BSI 09-1999 Table 1 Test schedule for qualification approval for method A Sample sizes and acceptance criteria are detailed for each assessment level in Table 2. Subclause numbers refer to section 4 of the generic specification. Subclause numbers, tests and test sequences D or ND Test conditions Performance requirements Group 0 8) Subgroup 01 ND 4.3.1 Precap visual examination Subgroup 02a ND 4.3.2 External visual and marking examination Subgrou

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1