BS QC 760201-1997 Harmonized system of quality assessment for electronic components - Semiconductor devices - Integrated circuits - Blank detail specification for film integrated ch.pdf

1、BRITISH STANDARD BS QC 760201:1997 IEC 60748-22-1: 1997 Harmonized system of quality assessment for electronic components Semiconductor devices Integrated circuits Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proc

2、edures ICS 31.200BSQC760201:1997 This British Standard, having been prepared under the directionof the ElectrotechnicalSector Board,was published undertheauthorityof the StandardsBoardand comesintoeffect on 15August1997 BSI 09-1999 ISBN 0 580 28006 3 Amendments issued since publication Amd. No. Date

3、 CommentsBSQC760201:1997 BSI 09-1999 i Contents Page National foreword ii Text of CEI IEC 60748-22-1 1BSQC760201:1997 ii BSI 09-1999 National foreword This British Standard reproduces verbatim IEC60748-22-1:1997 and implements it as the UK national standard. It supersedes BSQC760201:1992 which is wi

4、thdrawn. This standard is a harmonized specification within the IEC system of quality assessment for electronic components (IECQ). The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which

5、 has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them

6、in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. The standard is to be used in conjunction with BSQC760000 and BSQC760200. The British Standard which implements the IECQ Rules of Procedure is BS9000 General Requirements for a system for

7、 electronic components of assessed quality Part3:1996 Specification for the national implementation of the IECQsystem. From 1 January 1997, all IEC publications have the number60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the chan

8、ge over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “I

9、nternational Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance wit

10、h a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the CEI IEC title page, page ii, pages1 to12 and aback cover. This standard has been updated (see copyright date) and may hav

11、e had amendments incorporated. This will be indicated in the amendment table on the inside front cover.BSQC760201:1997 ii BSI 09-1999 Contents Page Introduction 1 1 Characteristics and conditions of use 4 2 Recommended methods of mounting 4 3 Marking 4 4 Ordering information 4 5 Certified records of

12、 released lots 4 6 Additional information 4 7 Additional or increased severities or requirements to those specified in the generic and/or sectional specification 5 8 Inspection requirements (see Table 2 and Table 3 or Table 4 and Table 5) 5 9 Supplement Tables of method B 9 Table 1 Where a range of

13、circuits 3 Table 2 Method A Groups A and B Lot-by-lot 6 Table 3a Method A Group C Periodic tests 7 Table 3b Method A Group D Periodic tests 8 Table 4a Method B Group A Lot-by-lot 9 Table 4b Method B Group B Lot-by-lot 10 Table 5a Method B Group C Periodic tests 11 Table 5b Method B Group D Periodic

14、tests 12BSQC760201:1997 BSI 09-1999 1 Introduction The IEC Quality Assessment System for Electronic Components is operated in accordance with the statutes of the IEC and under the authority of the IEC. The object of this system is to define quality assessment procedures in such a manner that electro

15、nic components released by one participating country as conforming with the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing. In the preparation of detail specifications, the content of3.6 of the generic spec

16、ification and2.3 and3.3 of the sectional specification is taken into account. The blank detail specification is one of a series of blank detail specifications for semiconductor devices and is used with the following publications: IEC 60748-20/QC 760000:1988, Semiconductor devices Integrated circuits

17、 Part20: Generic specification for film integrated circuits and hybrid film integrated circuits. IEC 60748-20-1/QC 763000:1994, Semiconductor devices Integrated circuits Part20: Generic specification for film integrated circuits and hybrid film integrated circuits Section1: Requirements for internal

18、 visual examination. IEC 60748-22/QC 760200:1997, Semiconductor devices Integrated circuits Part22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures. a) For catalogue circuits, the detail specifications are pu

19、blished, and their format and minimum content shall conform withTable 2Table4. b) For custom circuits, the detail specifications are not published, and their format and content are optional. However, the customers requirements in relation to form, fit and function are to be verified, either by the r

20、outine tests in maintenance of capability approval, or as specified in the detail specification, or by both in combination. c) For CQCs, the detail specifications are not published; their format and content are to be conform withTable 2Table4. When a circuit is sold uncompleted for completion by ano

21、ther party, the completed product does not qualify for release under the IEC system unless all processes are carried out by one or more approved manufacturers.BSQC760201:1997 2 BSI 09-1999 Required information Numbers shown in brackets on this page and the following pages correspond to the following

22、 items of required information, which should be entered in the spaces provided on the next page of this specification. Identification of the detail specification 1 The IEC or National Standards Organization under whose authority the detail specification is issued. 2 The IECQ number of the detail spe

23、cification, data of issue, and any further information required by the national system. 3 The IEC or national number and issue number of the generic and sectional specifications. 4 The national number of the detail specification, if different from IECQ number. Identification of film integrated circu

24、its and hybrid film integrated circuits 5 A short description of the technique and the type or function of the circuit. 6 Information on typical construction (where applicable). 7 An outline drawing with main dimensions which are of importance for interchangeability and/or reference to the national

25、or international documents for outlines. Alternatively, this drawing may be given in an annex to the detail specification. 8 Assessment level, and for circuits, the suffix “N”, if “non-qualified” added components are used. 9 Reference data on the most important properties, to allow comparison betwee

26、n the various circuit types when a range of types is concerned. NOTEFor test procedures two alternatives are available: method A or method B. However, it is not permitted to change the methods between tests. In general, method A is more suitable for passive component based film integrated circuits,

27、whereas method B is more applicable to semiconductor integrated circuit technology based film integrated circuits. The clauses given in square brackets on the next page of this standard, which forms the front page of the detail specification, are intended for guidance to the specification writer, an

28、d shall not be included in the detail specification. When confusion may arise as to whether the paragraph is only instructions to the writer or not, the paragraph shall be enclosed in brackets.BSQC760201:1997 BSI 09-1999 3 Table 1 Name (address) of responsible NAI (and possibly of body from which sp

29、ecification is available). 1 Number of IECQ detail specification, plus issue number and/or date. 2 QC 760101. ELECTRONIC COMPONENT OF National number of detail specification. 4 ASSESSED QUALITY 3 IN ACCORDANCE WITH: This box need not to be used if national number repeats IECQ number. Generic specifi

30、cations IEC 60748-20/QC 760000 and IEC 60748-20-1/QC 763000 Sectional specification: IEC 60748-22/QC 760200 and national references if different. DETAIL SPECIFICATION FOR: FILM INTEGRATED CIRCUITS AND HYBRID FILM INTEGRATED CIRCUITS 5 Type number(s) of the relevant device(s). Ordering information: S

31、ee clause 4 of this standard. Mechanical description 7 Short description 6 Outline reference: IEC 60191-2 . mandatory, if available and/or national if there is no IEC outline. Semidonductor material: Si Encapsulation: cavity or non-cavity. Outline drawing: (see Table 1) may be transferred to, or giv

32、en with, more details in clause 6 of this standard. Terminal identification: drawing showing pin assignments, including graphical symbols. Categories of assessed quality 8 Marking: letters and figures The detail specification shall prescribe the information to be marked on the device, if any. See 2.

33、6 of the generic specification and/or clause 3 of this standard. From 3.4 of the generic specification. Reference data 9 Information about manufacturers who have components qualified according to this detail specification is available in the current qualified products list. NOTE 1The non-dimensioned

34、 details do not affect the performance of the circuit. NOTE 2The terminations are (not) suitable for soldering. NOTE 3The terminations are (not) suitable for printed wiring applications. Where a range of circuits has the same basic function, and is made in the same technology envelope, this table wi

35、ll be used to detail the difference in characteristics.BSQC760201:1997 4 BSI 09-1999 1 Characteristics and conditions of use The detail specification shall give all the information needed to adequately describe: 1.1 The performance and design of the circuit a) Schematic circuit diagram b) Resistor a

36、nd capacitor values, tolerances, matching, tracking, power dissipation, temperature coefficient of resistors and capacitors, where applicable c) Limitations on resistance of conductors, where applicable d) Test circuit or method and performance limits e) Added components (see3.6.2 of the generic spe

37、cification). 1.2 Limiting conditions of use Examples: Package dimensions Operating temperature range Storage temperature range Vibration, shock, bump, severities Climatic category Maximum voltage. NOTEAny significant interaction between the detail specified in1.1 and1.2 should be stated. 1.3 Deratin

38、g See 2.2 of the sectional specification. (Where applicable, the derating curve shall be included in the detail specification.) 2 Recommended methods of mounting In accordance with 2.3.2 of the sectional specification. 3 Marking The marking of the circuit and primary package shall be in accordance w

39、ith the requirements of 2.6 of the generic specification. NOTEThe details of the marking of the circuit and primary package are given in full in the detail specification. 4 Ordering information Orders for circuits covered by this specification shall contain the following information: a) film integra

40、ted circuits and hybrid film integrated circuits; b) number and issue of the detail specification with style reference and assessment level, if appropriate; c) function of the circuit, if appropriate; d) basic functional characteristics with tolerance, if appropriate. 5 Certified records of released

41、 lots 5.1 Catalogue circuits Certified records of released lots shall conform to3.7.3.1 of the generic specification. 5.2 Custom built circuits The detail specification shall define the requirements for certified records of released lots; customers are advised to refer to3.7.3.2 of the generic speci

42、fication. 6 Additional information The detail specification may include information (which is not normally required to be verified by the inspection procedure) such as circuit diagrams, curves, drawings and notes for the clarification of the detail specification.BSQC760201:1997 BSI 09-1999 5 7 Addit

43、ional or increased severities or requirements to those specified in the generic and/or sectional specification NOTEAdditions or increased requirements should be specified only when essential. 8 Inspection requirements (seeTable 2 and Table3 or Table4 and Table5) For capability approval, the procedur

44、e shall be in accordance with the sectional specification. For quality conformance inspection, the test schedule includes sampling, periodicity, severities, and requirements. In the following tables: Subclause numbers of tests and performance requirements refer to the generic specification. Inspecti

45、on levels (ILs) and AQLs, LTPDs, fixed sample size and periodicity, given in Table3 or Table7 of the sectional specification, are to be inserted in the detail specification. Screening, and groups A, B and subgroup C1 inspection are to be carried out on products to be released in accordance with this

46、 detail specification. Inspection on subgroups C2, C3, C4 and on group D are to be carried out on CQCs to meet severities and requirements given in the Capability manual. p = periodicity (in months) n = sample size c = acceptance criterion (permitted number of defectives) D = destructive ND = non-de

47、structive IL = inspection level IEC 60410 AQL = acceptable quality level LTPD = lot tolerance percentage defective. BSQC760201:1997 6 BSI 09-1999 Table 2 Method A Groups A and B Lot-by-lot Subclause numbers, tests and test sequences D or ND Test conditions Sample size and criterion of acceptability

48、Performance requirements Screening ND See Table 4 of sectional specification Required/Not required Group A Inspection IL AQL Inspection to be conducted on a sampling basis, lot-by-lot Subgroup A1 ND 4.3.2 External visual and marking examination Subgroup A2 ND 4.4.11 Major static and dynamic electric

49、al characteristics at room temperature a Subgroup A3 ND 4.4.11 Major static and dynamic electrical characteristics at extreme operating temperatures Group B Inspection Inspection to be conducted on a sampling basis, lot-by-lot Subgroup B1 D 4.5.10 Solderability bc Subgroup B2 ND 4.3.3 Dimensions a Not mandatory if 100 % screened. b Use of electrical rejects permitted. c This test is destructive except