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本文(CEPT T CD 01-14 E-1986 Specification of Equipment Practice for Data Transmission Equipment《数据传输设备设备实践规范》.pdf)为本站会员(progressking105)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

CEPT T CD 01-14 E-1986 Specification of Equipment Practice for Data Transmission Equipment《数据传输设备设备实践规范》.pdf

1、CEPT T/CD*OL-L4*E b 23264L4 00034LL 2 (3 TCD01-14E Page 1 Recommendation TICD 01-14 (Odense 1986) SPECIFICATION OF EQUIPMENT PRACTICE FOR DATA TRANSMISSION EQUIPMENT Recommendation proposed by Working Group T/WG 10 “Data communications” (CD) Text of the Recommendation adopted by the “Telecommimicati

2、ois Commission: “The Conference of European Post and Telecommunications Administrations, considering that WG.CD. has studied under the auspice of Question CD 1 the harmonization of Data Transmission Equipment, recommends that the attached specification of equipment pratice for Data Transmission Equi

3、pment as contained in Annex 1 to this Recommendation should be taken into account by all CEPT Admininstrations when the implementation of a relevant piece of equipment is being planned by Administrations.” Administrations are free to stipulate additional requirements, and also which of the optional

4、requirements, if any, are to be provided. Note 1: It should be noted that this Recommendation may be revised from time to time. Edition of November 15, 1986 CEPT.T/CD*OL-L4*E 86 232b4L4 0003432 4 6 1 . 1.1 1.2. 1.2.1. 1.2.2. 1.3. 2 . 2.1. 2.2. 2.2.1. O 2.2.2. 2.3. 2.4. 2.5. 2.6. 2.7. 3 . 3.1. 3.2. 3

5、.3. 3.3.1 3.3.2. 3.3.3. 3.4. 4.1. 4.1.1. 4.1.2. 4.1.3. 4.2. 4.2.1. 4.2.2. 4.3. 4.4. 5 . T/CD O1 -14 E Annex 1. Page 1 Annex 1 . Index Page SCOPE . 2 Specification Objectives 2 Card Sizes and their Applications 3 Cardsizes 3 Applications . 3 System Elements . 3 MECHANICAL SPECIFICATION . 4 PCB sizes

6、and dimensions . 4 Connectors 4 Position of the connector on the PCB . 4 Pin allocatioii . 11 Cover and front panel dimensions 18 Slot dimensions 18 Subrack dimensions 18 PCB-Coding . 27 Fixing of plug-in units . 27 ELECTRICAL SPECIFICATIONS . 27 Interchange circuits for DCEs plugged into DTE . 27 I

7、nterchange circuits for units plugged into a sub-rack 28 Power Supply Circuits 28 Power Supply Requirements for Type I cards 28 Power Supply Requirements for Type II cards . 29 Power Supply Requirements for Type III cards 29 Line circuits . 29 OTHER PHYSICAL SPECIFICATIONS 29 Environmental specifica

8、tions 29 Climatic Environment . 29 Electromagnetic Compatibility 30 Local Environment . 30 Mechanical Reliability . 30 Bump 30 Vibration 30 Material specifications . 30 Safety Requirements 30 OPERATIONAL SPECIFICATIONS (For further study.) . . 30 Edition of November 15. 1986 CEPT T/CD*O3-14*E b 2326

9、434 0003433 b T/CD O1 -1 4 E Annex 1, Page 2 1. SCOPE 1.1. Specification Objectives This specification describes a cost and space saving equipment practice for data transmission equipment taking into account the current progress in DCE and DTE technology. It specifies the mechanical require- ments f

10、or plug-in data transmission equipment and the mechanical, functional and electrical characteristics of the interface between such equipment and associated equipment in which the plug-in equipment is intended to be used - in subracks, - in telephone sets, - in stand alone housings, - in DTEs. The me

11、chanical requirements of the specification are based on existing IEC standards for connectors, printed circuit boards (PCBs) and subracks. For the electrical and functional part of the Interface reference is made to the relevant standards of CCITT and ISO. As an alternative to the CCITT Recommendati

12、ons for electrical characteristics a new electrical characteristic for the interchange circuits is introduced which complies with integrated circuit technology. This specification shall ensure mechanical and electrical compatibility of plug-in data transmission equip- ment and its associated counter

13、parts. In particular, the following items are specified: - Size of PCBs, - Size of Plug-in Unit, - Type of connector, - Pin allocation, - Electrical characteristics of interchange circuits, - Electrical requirements for the power supply, - Environmental conditions. In this specification the applicat

14、ion of the equipment practice to plug-in equipment with V.- and X. -Series Interfaces (Modem and baseband equipment) is elaborated. The application of this specification in other transmission equipment (e.g. multiplexers) is also possible. In that case parts of this specification may not be relevant

15、 (e.g. pin ailocation of V.-Series interchange circuits) and the term DCE may be replaced by the term data transmission equipment where appropriate. Details will be given in the appropriate equipment specifications. _-_- e Edition of November 15, 1986 1.2. 1.2.1. Card Size DCE Width Note 1 Note 1 10

16、 HP (nominal) A B Type I 160 x 100 mm Type I A B Plug-in unit for (Note 2) 5 HP (nominal) 10 HP nominal) Type II 160 x 233.35 mm Type II Type III (Note 2) (Note 2) A B I TypeIII Note 2 I 5, 7 or 14 HP I DTEs Telephone sets Stand alone DCE Subracks TICD O1 -1 4 E Annex 1, Page 3 + + + + ? + + + + + +

17、 + + + + + + + - - One horizontal pitch (HB) = 5.08 mm. Note 1: The dimensions of the plug-in units should be according to that outlined in 2.3. The space allocated in DTEs for type I/A and B should be 5 or 10 HP and the dimension should be according to that outlined in 2.4. Card spacing in a subrac

18、k or DTE may be based on this width. Greater spacings to facilitate cooling, proper accommodation etc. are possible. Note 2: For some applications a larger card than specified herein as types I and II is needed. For the time beeing there is no harmonized version of such a card. Current proposals of

19、different cards are to be found in Figures 2.4 (T/CD 01-14), 2.5 (T/CD 01-14), and 2.6 (T/CD 01-14). Study is underway as matter of urgency to define a harmonized version. 1.2.2. Applications The following types of applications are envisaged subject to national regulations. Plug-in unit for - DTEs (

20、see Note I), - Telephone sets (see Note I), - Stand alone housing (see Note I), - Subracks. 1.3. System Elements Each plug-in unit consists of the following parts: - one printed circuit board (PCB), which will be supported by guide bars in a subrack or DTE. The - one PCB edge connector (female part)

21、, see Note. and at the discretion of the Administration: - covers for Type I/A and B (including isolating cover), - front panel, - one pair of fixing elements, - sealing possibility, - a coding device. unit may comprise other smaller PCBs not supported by guide bars, Edition of November 15, 1986 - -

22、 i CEPT T/CD*OL-L4*E 86 W 232bll14 0003415 T T/CD O1 -14 E Annex 1, Page 4 A subrack for plug-in units consists of the following parts: - slots for accommodation of the plug-in units, - one pair of guide bars per slot, - one connector (male part) per slot, and at the discretion of the Administration

23、: - one pair of hing elements per slot, - slots for accommodation of additional PCBs for distribution-, monitor- and maintenance purposes, - a slot for a plug-in power supply, - sealing possibility, - a coding device. A DTE or telephone set, which is designed for accommodation of a plug-in DCE, shou

24、ld be equipped with: - a slot with the dimensions outlined in 2.4., - a connector (male part) as outlined in 2.2., - one pair of guide bars as outlined in 2.4., - a method of fwng plug-in DCEs, e.g. a metric thread (M2.5) as outlined in Figure 2.9. (T/CD 01-14), and at the discretion of the Administ

25、ration: - a coding device. Note; Where national requirements do not allow the connection of the telephone line inside the DTE via the PCB edge connector, the telephone.line may be connected via the front panel of the plug-in, Additional connectors for Type II/A and B cards (eng. IS0 21 10) are optio

26、nal. 2. 2.1 2.2. 2.2.1 * - MECHANICAL, SPECIFICATION References: Cabinets and racks: IEC 297; IEC 297-2; DIN 41 494, Teil 1, Teil 5 Din 41 488. Plug-in units: IEC 297-3, DIN 41 494, Teil 5. Printed circuit boards (PCBs): IEC 297-3, DIN 40 801, Teil 2: DIN 41 494, Teil 2; IEC 326-3; IEC 48D (SEC) 12.

27、 Connectors: IEC 603-2, DIN 41 612, Teil 1 and Teil 6; IEC 48B (C.O.) 137; IEC 48B (C.O.) 138. PCB sizes and dimensions Type I Type II Type III Connectors The proposed connector for all types of cards shall be a 96-pin connector according to IEC 48B (C.O.) 137 or IEC 48B (C.O.) 138 (see Note). The f

28、emale part of the connector shall be on the PCB of the plug-in unit and the male part on the backplane or the DTE (inverted pin assignment). The connector may be equipped with less than 96 pins depending on the application. The use of additional connectors according to IS0 21 10 and/or IS0 4903 on t

29、he Type II and III PCBs is optional. Positioii of the connector oit the PCB Thepositionoftheconnectorson the3 types ofcardsisshowninFigures2.1 (T/CD01-14) to2.6 (T/CD01-14). The use of additional connectors (IEC 603-/x or IS0 2110, IS0 4902, IS0 4903, .) is possible. A possible position of the optio

30、nal connectors is shown in Figure 2.2 (T/CD 01-14). Note: There are two candidates of connectors with inverted pin assignment under discussion: IEC 48B (C.0.)137, the so called DIN-version and IEC 48B (C.O.) 138, the so called Ericsson version. A definite IEC number for the one or the other connecto

31、r (in the following represented by IEC 602-x) is still open. If a DTE or a rack is intended to accept DCEs with the one or the other type of connector, the differences in the mechanical dimensions should be noted. Fig- ure 2.3 (T/CD 01-14) shows the major differences between both connectors. In all

32、other figures, reference is made to Fig- ure 2.3 (T/CD 01-14) whenever necessary. see Figure 2.1 (T/CD 01-14) see Figure 2.2(T/CD 01-14) see Figures 2.4 (T/CD 01-14), 2.5 (T/CD 01-14), 2.6 (T/CD 01-14) Edition of November 15, 1986 CEPT T/CD*OL-L4*E 6 2326434 0003416 3 M T/CD O1 -14 E Annex 1, Page 5

33、 t 2.5 _L I I I I I I I I I I 3 fi L 2 v 2.5 t- Notes: Board thickness 1.6k0.2, reference IEC 249-2. All dimensions are shown in millimeters. Figure 2.1 (T/CD 01-14). Type I card basic dimensions. Edition of November 15, 1986 TICD O1 -1 4 E Annex 1, Page 6 CEPT T/CD*OL-L4*E 8b m 2326434 0003437 3 m

34、Usable space for components . and printed circuits I 1 .I I Z 96-pin or 12110 or/and is0 4903 connector ;I In m. m m c O O O Ln OC +I Ln m rn rn (u Notes: Board thickness 1.6f0.2 reference IEC 249-2. All dimensions are shown in millimeters. Figure 2.2 (T/CD 01-14). Type II card basic dimensions. I 7

35、 O Edition of November 15, 1986 CEPT T/CD*O3-34*E b = 232b414 0003438 5 T/CD O1 -14 E Annex 1, Page 7 Center of Mounting Hole Center of I Connector -1 4.35 I f 1 DIN-Version (1.6 Center of PC Board (1.6) -+kt Ericsson-Version Figure 2.3 (T/CD 01-14). Basic differences between DIN- and Ericsson-Versi

36、on. Edition of November 15, 1986 r T/CD01-14E a Annex 1, Page 8 in o“ m-4 CEPT T/CD*OL-L4*E b m 232b434 0003439 7 = 66.7 L l 233.4 8 w c .d c. 3 W Figure 2.4 (T/CD 01-14). Type III card (Italian proposal). T/CD O1 -I 4 E Annex 1, Page 9 C o c ! l i l Edition of November 15, 1986 I O O Figure 2.5 (T/

37、CD 01-14). Type III card (Spanish proposal). CEPT T/CD*OL-LY*E 8b W 232b434 0003423 5 D T/CD O1 -14 E Annex 1, Page 10 80.0 88.90 17.78 3.8, i 7.49 ! i+ ! i 3 ! i 1 I E 8 O * G H H n s -a Edition of November 15, 1986 T/CD O1 -1 4 E Annex 1, Page 11 2.2.2. Pin Allocation The pin allocations of the op

38、tional connectors according IS0 2110 or 4903 are given in those standards. The 96-pin connector may contain the following circuits: - digital interchange circuits, - power supply circuits, - telephone line circuits (see Note in 1.3.), - circuits to the telephone set or an equivalent (see Note in 1.3

39、.), - additional circuits, In Appendix 1 design objectives for the allocation of all pins are recorded. Edition of November 15, 1986 CEPT T/CD*OL-L4*E 6 6 2326434 0003423 9 T/CD O1 -14 E Annex 1, Page 12 r-1 I Sub-connector Allocation Pin Allocation (top side) - 2 3 Line Sub-connector (see Note) 10

40、11 12 13 14 15 Sub-connector 16 3 x 14 pins 17 18 19 20 21 22 23 24 25 26 27 Power Supply 28 Sub-connector Interchange 2 x 14 pins or -_- 2 x 7 pins or 3 x 7 pins 29 30 31 32 - Sub-connector frame behind the O * O * O * O * O * O * O O O 1oF o 118014 20103 o 114015 30104 o 119016 40105 0 115017 5010

41、6 0 141018 60107 o 120019 JO O 80109 o 140021 90116 o 125022 100117 o 111023 11 OF o 113024 12122 0 14225 13m121 o O O O O O O O o-5v O -5vo 0-12v O -12vo ot12v O two ot5v O t5vo oi5v O +5V O ov ovo O ov O ovo / I t. backplane Printed Circuit Board /I - I I I I I I I I I I I I I I I I I I I I I I I

42、II II I I I - l i View from the rear of the backplane or front view of the PCB edge connector F: for future international standardization Pins of row b are optional o Pin cannot be accessed via Sub-connector + Pin should not be connected (see Note) xx o lyy respectively lyy o xx: pin has a certain f

43、unction: lyy is the number of Recommendation V.24 Interchange Circuit, xx is the number of the related pin of the IS0 21 10 connector O 2.2.2.1. Pin Allocation for Type I and II cards for V.-Series DCEs with TTL electrical characteristics 7- - Edition of November 15, 1986 CEPT T/CD*OL-L4*E 86 W 232b

44、4L4 0003424 O Sub-connector Allocation Line Sub-connector (see Note) I 2 Interchange Sub-connector 2 x 14 pins or 3 x 14 pins 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Power Supply Sub-connector 2 x 7 pins or 3 x 7 pins 26 27 28 * O * O * O * Io O OT R OC O 01 OG Io O O O O O O O Io O -5v O -12v

45、O t12v O t5v O t5v O ov O ov O a * O * O * O O O O O O e O O O O O O O O O O O O O O O O O O * O * O * O * o O F/B o O so O XI O o: O O O O O O O o -5v O -12v O t12v O 15v O t5v O ov O ov O / I Sub-connector frame behind the backplane I l I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I T

46、/CD O1 -14 E Annex 1, Page 13 View from the rear of the backplane or front view of the PCB edge connector Unassigned pins of the interface section are reserved for future international standardization Pins of row b are optional o Pin cannot be accessed via Sub-connector Pin should not be connected D

47、esignations of Interchange Circuits are in accordance with Recommendation X.24 Printed Circuit Board/ I - - I 2.2.2.2. Pin Allocation for Type I and II cards for X.21, X.20, X.22 DCEs with TTL electrical characteristics Edition of November 15, 1986 CEPT T/CD*OL-L4*E 6 9 2326414 0003425 2 W T/CD O1 -

48、14 E Annex 1, Page 14 I-I II 2“ a *I 3a * 01 4 *. O *I 50 * I 6* O *I 7a * I 8* O *I 9 30 O oc I 10 O O I i 2.103 o 114e15 I 12 30104 O. I 14 a e I Sub-connector Allocation Pin Allocation (top side) C b oov o ov -_- Line Sub-connector (see Note) - 13 4a105 115al7 I Interchange Sub - c o n n e c t o

49、r 2 x 14 pins or 3 x 14 pins 18 80109 a 140021 I 19 o O 125022 I 20 e a 01 21 O a I 23 o a 01 24 o O 01 25 10 O oc I 26 8-5V a -5V O I 27 O -12v a -12v a I 22 a a 142a25 I - - 28 o t12V o t12v e I Power Supply Sub-connect.or 2 x 7 pins or 29 a+5V a 151 a I 3 x 7 pins 30 0t5V 0 t5V 0 I 31 aov a ova I View from the rear of the backplane or front view of the PCB connector Unassigned pins of the interface section are reserved for future international

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