CLC TR 62258-4-2013 Semiconductor die products - Part 4 Questionnaire for die users and suppliers.pdf

1、BSI Standards PublicationPD CLC/TR 62285-4:2013Semiconductor die productsPart 4: Questionnaire for die users and suppliersPD CLC/TR 62285-4:2013 PUBLISHED DOCUMENTNational forewordThis Published Document is the UK implementation ofCLC/ TR 62258-4:2013. It is identical to IEC/TR 62258-4:2012. It supe

2、rsedes PD IEC/TR 62258-4 :2007 which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the

3、 necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2014. Published by BSI Standards Limited 2014ISBN 978 0 580 72901 0 ICS 31.080.99 Compliance with a British Standard cannot confer immunity from legal obligations.This British St

4、andard was published under the authority of the Standards Policy and Strategy Committee on 30 November 2014Amendments/corrigenda issued since publicationDate Text affected TECHNICAL REPORT CLC/TR 62258-4 RAPPORT TECHNIQUE TECHNISCHER BERICHT January 2013 CENELEC European Committee for Electrotechnic

5、al Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. CLC/TR 62

6、258-4:2013 E ICS 31.080.99 Supersedes CLC/TR 62258-4:2007 English version Semiconductor die products - Part 4: Questionnaire for die users and suppliers (IEC/TR 62258-4:2012) Produits de puces de semiconducteurs - Partie 4: Questionnaire destin aux utilisateurs et fournisseurs de puces (CEI/TR 62258

7、-4:2012) Halbleiter-Chip-Erzeugnisse - Teil 4: Fragebogen fr Chip-Anwender und -Lieferanten (IEC/TR 62258-4:2012) This Technical Report was approved by CENELEC on 2012-09-12. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republ

8、ic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. CL

9、C/TR 62258-4:2013 - 2 - Foreword The text of document 47/2073A/DTR, future edition 2 of IEC/TR 62258-4, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as CLC/TR 62258-4:2013. This document supersedes CLC/TR 62258-4:2007. CLC/TR 62

10、258-4:2013 includes the following significant technical changes with respect to CLC/TR 62258-4:2007: The document checklist was changed to mirror EN 62258-1:2010 requirements exactly. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights

11、. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC/TR 62258-4:2012 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the foll

12、owing notes have to be added for the standards indicated: IEC/TR 62258-7 NOTE Harmonised as CLC/TR 62258-7. IEC/TR 62258-8 NOTE Harmonised as CLC/TR 62258-8. - 3 - CLC/TR 62258-4:2013 Annex ZA (normative) Normative references to international publications with their corresponding European publicatio

13、ns The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE

14、 When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60050 Series International Electrotechnical Vocabulary (IEV) - - IEC 62258-1 2009 Semiconductor die products - Part 1: Procurement and u

15、se EN 62258-1 2010 IEC 62258-2 2011 Semiconductor die products - Part 2: Exchange data formats EN 62258-2 2011 2 TR 62258-4 IEC:2012 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope . 6 2 Normative references . 6 3 Terms and definitions . 6 4 General 6 5 Data exchange . 7 Annex A (normative) Customer

16、questionnaire on die devices . 8 Bibliography 18 Table A.1 Basic data 9 Table A.2 Bare die and wafers . 10 Table A.3 Die and wafers with connection structures . 11 Table A.4 Minimally-packaged die devices . 12 Table A.5 Quality, reliability and storage 12 Table A.6 Terminal data . 14 Table A.7 Termi

17、nal geometries 14 Table A.8 Polygon vertices 15 Table A.9 Fiducial definitions . 15 Table A.10 Fiducial positions . 16 Table A.11 Simulator data 16 Table A.12 Group definitions 17 Table A.13 Permutations 17 TR 62258-4 IEC:2012 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS

18、Part 4: Questionnaire for die users and suppliers FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation

19、on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

20、Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparatio

21、n. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus

22、of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are ma

23、de to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transp

24、arently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent ce

25、rtification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability

26、shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including

27、legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this

28、publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standard

29、s. However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62258-4, which is a technical report, has been prepared by IEC te

30、chnical committee 47: Semiconductor devices. This technical report contains attached files in the form of 47-62258-4-TR-E-worksheet.xls. These files are intended to be used as a complement and do not form an integral part of the technical report. This second edition cancels and replaces the first ed

31、ition published in 2007 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: 4 TR 62258-4 IEC:2012 The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly. The text of this technical r

32、eport is based on the following documents: Enquiry draft Report on voting 47/2073A/DTR 47/2108/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/

33、IEC Directives, Part 2. A list of all the parts in the IEC 62258 series, published under the general title Semiconductor die products, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC

34、web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. TR 62258-4 IEC:2012 5 INTRODUCTION This technical report is based on the work carried out in the ESPRIT 4th

35、 Framework Project GOODDIE which resulted in the publication of the ES 59008 series of European specifications. Organizations that helped prepare this document included the ESPRIT ENCAST and ENCASIT projects, the Die Products Consortium, JEITA, JEDEC and ZVEI. 6 TR 62258-4 IEC:2012 SEMICONDUCTOR DIE

36、 PRODUCTS Part 4: Questionnaire for die users and suppliers 1 Scope This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially

37、 encapsulated die and wafers. This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for di

38、e devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fi

39、elds. Different markets may require different subsets of the information requested herein. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies.

40、 For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050 (all parts), International Electrotechnical Vocabulary (available at http:/www.electropedia.org) IEC 62258-1:2009, Semiconductor die products Part 1: Procurement and use IEC 62258-2:2

41、011 Semiconductor die products Part 2: Exchange data formats 3 Terms and definitions For the purposes of this document, the terms and definitions given in the IEC 60050 series and IEC 62258-2:2011 apply. 4 General To comply with IEC 62258-1:2009, that standard requires that suppliers of die devices

42、furnish information which is necessary and sufficient for users of the devices at all stages of design, procurement, manufacture and test of the products containing them. The questionnaire in Annex A provides a pro forma that can form a standard basis for supplying such information and is intended a

43、s an aid to compliance with the standard. TR 62258-4 IEC:2012 7 Where references are made in this technical report to clauses in IEC 62258-1:2009 and IEC 62258-2:2011, they apply to those editions only. The tables in the annexes contain requirements for information that is not yet covered by those p

44、arts of the standard but which will be included in future issues. Furthermore, some of the terminology may not be exactly in accordance with those standards. For example, the term “pad” is replaced by “terminal” in this technical report. Whilst it is expected that much of the information supplied wi

45、ll be in the public domain and available from such sources as manufacturers data sheets, neither the standard nor the questionnaire places an obligation on a supplier to make information public. Any information that a supplier considers to be proprietary or commercially sensitive may be supplied und

46、er the terms of a non-disclosure agreement. 5 Data exchange In conjunction with the questionnaire tables in Annex A, a spreadsheet is available which allows the information to be supplied electronically. Use of the spreadsheet (47-62258-4-TR-E-worksheet.xls) will also enable computer-sensible descri

47、ptions of die devices to be generated that can then be converted to the DDX format as defined in IEC 62258-2:2011, the XML format compliant with the schema in IEC 62258-7, the EXPRESS model schema as defined in IEC 62258-8 or other appropriate formats. Software is available to allow conversion from

48、the spreadsheet tables into DDX, XML and SPF formats and may be available for other formats (see the attached Excel spreadsheet). Compared to the printed form of the questionnaire as given in Annex A, use of the spreadsheet has the following advantages. Notes to the cells in the spreadsheet give the

49、 full text of the corresponding clauses in IEC 62258-1:2009. Linked worksheets deal with the requirements for terminal and other information, including pad shape, size and position, terminal connections, fiducials, simulators, terminal grouping and permutability. Notes to the cells here give the requirements for the detailed terminal information as required for data exchange in IEC 62258-2:2011. The format of the information is consistent with that required in IEC 6