DIN EN 16602-70-28-2015 Space product assurance - Repair and modification of printed circuit board assemblies for space use English version EN 16602-70-28 2014《航天产品保证 航天用印刷电路板组件的维修.pdf

1、Juni 2015DEUTSCHE NORM DIN-Normenausschuss Luft- und Raumfahrt (NL)Preisgruppe 26DIN Deutsches Institut fr Normung e. V. Jede Art der Vervielfltigung, auch auszugsweise, nur mit Genehmigung des DIN Deutsches Institut fr Normung e. V., Berlin, gestattet.ICS 49.140!%B,W“2310952www.din.deDDIN EN 16602-

2、70-28Raumfahrtproduktsicherung Reparatur und Modifikation von Leiterplatten-Baugruppen fr denEinsatz im Weltraum;Englische Fassung EN 16602-70-28:2014Space product assurance Repair and modification of printed circuit board assemblies for space use;English version EN 16602-70-28:2014Assurance produit

3、 des projets spatiaux Rparation et modification des ensembles de circuits imprims pour utilisation spatiale;Version anglaise EN 16602-70-28:2014Alleinverkauf der Normen durch Beuth Verlag GmbH, 10772 Berlin www.beuth.deGesamtumfang 79 SeitenDIN EN 16602-70-28:2015-06 2 Nationales Vorwort Dieses Doku

4、ment (EN 16602-70-28:2014) wurde vom Technischen Komitee CEN/CLC/TC 5 Raumfahrt“ erarbeitet, dessen Sekretariat vom DIN (Deutschland) gehalten wird. Das zustndige deutsche Normungsgremium ist der Arbeitsausschuss NA 131-10-01 AA Interoperabilitt von Informations-, Kommunikations- und Navigationssyst

5、emen“ im DIN-Normenausschuss Luft- und Raumfahrt (NL). Dieses Dokument (EN 16602-70-28:2014) basiert auf ECSS-Q-ST-70-28C. Dieses Dokument enthlt unter Bercksichtigung des DIN-Prsidialbeschlusses 1/2004 nur die englische Originalfassung von EN 16602-70-28:2014. Dieses Dokument wurde speziell zur Beh

6、andlung von Raumfahrtsystemen erarbeitet und hat daher Vorrang vor jeglicher Europischer Norm, da es denselben Anwendungsbereich hat, jedoch ber einen greren Geltungsbereich (z. B. Luft- und Raumfahrt) verfgt. DIN EN 16602-70-28:2015-06 3 Nationaler Anhang NA (informativ) Begriffe und Abkrzungen 3 B

7、egriffe und Abkrzungen 3.1 Begriffe aus anderen Normen Fr die Anwendung dieses Dokuments gelten die Begriffe nach ECSS-S-ST-00-01. 3.2 Fr diese Norm spezifische Begriffe 3.2.1 Modifikation Prozess des Modifizierens eines elektronischen Schaltkreises durch Hinzufgen oder Entfernen elektrischer Teile

8、oder der Verdrahtung 3.2.2 Reparatur nderung an einem Bauelement mit allen zugehrigen Anschlssen, einschlielich des Wiederbefestigens abgehobener Ltaugen oder Leiterbahnen oder jeglicher vergleichbarer Verfahren nach dieser Norm ANMERKUNG 1 Eine nderung der Bauelemente zum Zwecke der Abstimmung, d.

9、h. Auftrennen der Ltverbindungen und ndern der Bauelementwerte, gilt nicht als Reparatur, Nacharbeit oder Modifikation. ANMERKUNG 2 Bei der Abstimmung werden Ltverbindungen mit der geringstmglichen Menge an Lot erreicht, gerade ausreichend, um den Kontakt sicherzustellen. 3.2.3 Nacharbeit Prozess de

10、s Nacharbeitens einer fehlerhaften Ltverbindung (ohne nderung der Bauelemente) als Folge des Reparatur- oder Modifikationsprozesses oder zum Zwecke der Wiederherstellung der Ausfhrungsgte von potentiell fehlerhaften Ltverbindungen 3.3 Abkrzungen Fr die Anwendung dieses Dokuments gelten die Abkrzunge

11、n in ECSS-S-ST-00-01 und die folgenden Abkrzungen: Abkrzung Bedeutung PCB Leiterplatte (en: printed circuit board) PTFE Polytetrafluorethylen (en: Polytetrafluoroethylene) PTH Durchkontaktierung/metallisiertes Loch (en: plated-through hole) DIL mit zwei Kontaktreihen/zweireihig (en: dual-in-line) DI

12、N EN 16602-70-28:2015-06 4 Leerseite EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16602-70-28 October 2014 ICS 49.140 English version Space product assurance - Repair and modification of printed circuit board assemblies for space use Assurance produit des projets spatiaux - Rparation et modi

13、fication des ensembles de circuits imprims pour utilisation spatiale Raumfahrtproduktsicherung - Reparatur und Modifikation von Leiterplatten-Baugruppen fr den Einsatz im WeltraumThis European Standard was approved by CEN on 11 April 2014. CEN and CENELEC members are bound to comply with the CEN/CEN

14、ELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre

15、or to any CEN and CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has t

16、he same status as the official versions. CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hunga

17、ry, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2014 CEN/CENELEC All rights of exploitation i

18、n any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16602-70-28:2014 EEN 16602-70-28:2014 (E) 2 Table of contents Foreword 9 1 Scope . 10 2 Normative references . 11 3 Terms, definitions and abbreviated terms 12 3.1 Terms from other standards

19、12 3.2 Terms specific to the present standard . 12 3.3 Abbreviated terms. 13 4 Requirements 14 4.1 Basic requirements . 14 4.1.1 Hazard, health and safety precautions 14 4.1.2 Materials . 14 4.1.3 Facilities 14 4.1.4 General . 14 4.2 Repairs . 15 4.2.1 Repair criteria 15 4.2.2 Number of repairs . 15

20、 4.3 Modifications . 15 4.3.1 Modification criteria . 15 4.3.2 Number of modifications 16 4.4 Rework . 16 4.4.1 Rework criteria 16 4.4.2 Number of reworks 16 4.5 Other requirements . 16 4.6 Removal of conformal coating 17 4.6.1 Requirements 17 4.6.2 Procedure . 17 4.6.3 Acceptance criteria 17 4.7 So

21、lder joint removal and unclinching 18 4.7.1 Procedure . 18 DIN EN 16602-70-28:2015-06 EN 16602-70-28:2014 (E) 3 4.7.2 Acceptance criteria 18 4.8 Repair of damaged gold-plated areas . 18 4.8.1 Requirements 18 4.8.2 Procedure . 18 4.8.3 Acceptance criteria 19 4.9 Repair of damaged conductor tracks 19

22、4.9.1 Requirements 19 4.9.2 Procedure . 19 4.9.3 Acceptance criteria 20 4.10 Repair of lifted conductors 20 4.10.1 Requirements 20 4.10.2 Procedure . 20 4.10.3 Acceptance criteria 20 4.11 Repair of lifted terminal areas (pads) 21 4.11.1 Requirements 21 4.11.2 Procedure . 21 4.11.3 Acceptance criteri

23、a 21 4.12 Terminal post replacement . 21 4.12.1 Requirements 21 4.12.2 Procedure . 21 4.12.3 Acceptance criteria 21 4.13 Wire-to-wire joints . 22 4.13.1 Requirements 22 4.13.2 Procedure . 22 4.13.3 Acceptance criteria 22 4.14 Addition of components 22 4.14.1 Requirements 22 4.14.2 Procedure . 23 4.1

24、4.3 Acceptance criteria 23 4.15 Removal and replacement of axial and multi-lead components. 24 4.15.1 Requirements 24 4.15.2 Procedure . 24 4.15.3 Acceptance criteria 24 4.16 Removal and replacement of flat-pack components 24 4.16.1 Requirements 24 4.16.2 Procedure . 24 4.16.3 Acceptance criteria 25

25、 DIN EN 16602-70-28:2015-06 EN 16602-70-28:2014 (E) 4 4.17 Modification of component connections 25 4.17.1 Requirements 25 4.17.2 Procedure . 25 4.17.3 Acceptance criteria 26 4.18 Cutting of internal track of a multi-layer printed circuit board . 26 4.18.1 Procedure . 26 4.18.2 Acceptance criteria 2

26、6 4.19 Quality assurance . 26 4.19.1 General . 26 4.19.2 Data 26 4.19.3 Nonconformance . 27 4.19.4 Calibration . 27 4.19.5 Traceability . 27 4.19.6 Operator and inspector training and certification . 27 Annex A (informative) Removal of conformal coating . 28 A.1 Introduction . 28 A.2 Tools and mater

27、ials 28 A.3 Methods for the removal of conformal coating 28 A.3.1 Method for the removal of polyurethane and silicone-type coating 28 A.3.2 Method for the removal of epoxy-type coating . 29 Annex B (informative) Solder joint removal and unclinching 31 B.1 Introduction . 31 B.2 Tools and materials 31

28、 B.3 Methods for solder joint removal and unclinching . 31 B.3.1 Method for solder extraction with continuous vacuum . 31 B.3.2 Method for solder extraction using sucker . 32 B.3.3 Method for hot jet extraction 33 B.3.4 Method for the use of wicking braid . 33 B.3.5 Method for unclinching of leads .

29、 34 Annex C (informative) Repair of damaged gold-plated areas 35 C.1 Introduction . 35 C.2 Tools and materials 35 C.3 Methods for the repair of damaged gold-plated areas . 35 C.3.1 Method for the removal of solder splatter on gold plating 35 Annex D (informative) Repair of damaged conductor tracks 3

30、6 D.1 Introduction . 36 DIN EN 16602-70-28:2015-06 EN 16602-70-28:2014 (E) 5 D.2 Tools and materials 36 D.3 Method for the repair of damaged conductor tracks 36 Annex E (informative) Repair of lifted conductors . 37 E.1 Introduction . 37 E.2 Tools and materials 37 E.3 Methods for repair of lifted co

31、nductors 38 E.3.1 Method for the use of epoxy under conductor . 38 E.3.2 Method for the use of epoxy over conductor . 38 Annex F (informative) Repair of lifted terminal areas (pads) . 39 F.1 Introduction . 39 F.2 Tools and materials 40 F.3 Method for the repair of lifted terminal areas (pads) 40 Ann

32、ex G (informative) Terminal post replacement . 41 G.1 Introduction . 41 G.2 Tools and materials 41 G.3 Method for the replacement of terminal post . 41 Annex H (informative) Wire-to-wire joints . 43 H.1 Introduction . 43 H.2 Tools and materials 43 H.3 Method for wire-to-wire joining 43 Annex I (info

33、rmative) Addition of components . 45 I.1 Introduction . 45 I.2 Tools and materials 45 I.3 Methods for addition of components . 46 I.3.1 Method for additional components mounted on reverse (non-component) side of board . 46 I.3.2 Method for additional components mounted on component side of board. 47

34、 I.3.3 Method for additional components mounted on terminal posts, including “piggyback“ mounting . 48 I.3.4 Method for additional components mounted (on reverse side or on component side of board) using staking compound. 49 I.3.5 Method for additional components mounted (on reverse side or on compo

35、nent side of board) to leads of adjacent components 50 I.3.6 Method for the addition of a wire link onto soldered chips on a single side piece of PCB with appropriate pads . 55 I.3.7 Method for the addition of a wire link onto metallized cap of chips directly glued on PCB 56 DIN EN 16602-70-28:2015-

36、06 EN 16602-70-28:2014 (E) 6 Annex J (informative) Removal and replacement of axial and multi-lead components . 57 J.1 Introduction . 57 J.2 Tools and materials 57 J.3 Methods for removal and replacement of axial and multi-lead components 57 J.3.1 Method for the removal of components with axial lead

37、s (destructive removal) 57 J.3.2 Method for the removal of multi-lead components (destructive removal) 58 Annex K (informative) Removal and replacement of flat-pack components 60 K.1 Introduction . 60 K.2 Tools and materials 60 K.3 Method for the removal and replacement of flat-pack components . 60

38、Annex L (informative) Modification of component connections . 62 L.1 Introduction . 62 L.2 Tools and materials 62 L.3 Methods for modification of component connections . 62 L.3.1 Method for the soldering of a wrap-around connection to an extended component lead 62 L.3.2 Method for the soldering of c

39、omponent lead to a stud lead mounted into an existing hole 63 L.3.3 Method for mounting a dual-in-line (DIL) package with or without a wire link soldered onto a cropped lead 64 L.3.4 Method for mounting a connector with or without a wire link soldered onto a cropped lead 66 L.3.5 Method for the addi

40、tion of a wire link into a plated-through hole occupied by a flat-section lead 67 L.3.6 Method for the addition of a wire link on top of a flat-pack lead . 69 L.3.7 Method for the isolation of a component lead 69 L.3.8 Method for the addition of a wire link onto terminal pad of soldered chips . 71 A

41、nnex M (informative) Cutting of internal track of a multi-layer printed circuit board . 73 M.1 Introduction . 73 M.2 Tools and materials 73 M.3 Method for cutting the internal track of a multi-layer printed circuit board 73 Bibliography . 75 DIN EN 16602-70-28:2015-06 EN 16602-70-28:2014 (E) 7 Figur

42、es Figure A-1 : Removal of coating by thermal parting device . 30 Figure B-1 : Continuous vacuum solder extraction on stud lead . 32 Figure B-2 : Pulse-type solder sucker in use 32 Figure B-3 : Lifting individual leads with hot jet . 33 Figure B-4 : Cross-sectional view of wicking method 34 Figure B

43、-5 : Hot unclinching with thermal parting device 34 Figure E-1 : Lifted conductors. 37 Figure E-2 : Repair using epoxy under conductor . 38 Figure E-3 : Repair using epoxy over conductor . 38 Figure F-1 : Lifted terminal area . 39 Figure F-2 : Terminal areas without track . 39 Figure F-3 : Terminal

44、areas with track attached 40 Figure G-1 : Terminal post replacement . 42 Figure H-1 : Use of approved type support clamp/heat sink . 44 Figure I-1 : Additional components mounted on reverse (non-component) side of board 47 Figure I-2 : Additional components mounted on component side of board 48 Figu

45、re I-3 :“Piggyback” mounting of one component on top of another . 49 Figure I-4 : Mounting and wiring of additional axially-leaded components mounted (on reverse side or on component side of board) using staking compound 51 Figure I-5 : Upside down mounting and wiring of additional side-brazed DIL c

46、omponent (on reverse side or on component side of board) using staking compound 52 Figure I-6 : Mounting of additional non-axially leaded components, e.g. capacitors, with wire connecting top or bottom sides of the circuit board using staking compound (on reverse side or on component side of board)

47、52 Figure I-7 : Mounting of additional component (on component side of board) with wire connections on reverse side of board using staking compound 53 Figure I-8 : Mounting of additional component (on reverse side of board) across extended leads of adjacent components 53 Figure I-9 : Mounting of add

48、itional component by linking to a “pigtailed” lead of an adjacent component . 54 Figure I-10 : Mounting of additional component by linking to lead of an adjacent transistor (or other large component) . 55 Figure I-11 : Addition of a wire link onto metallized cap of chips directly glued on PCB 56 Fig

49、ure J-1 : Removal of multi-lead components, clipping of component leads 58 Figure J-2 : Removal of multi-lead components, removal of remaining component leads . 59 Figure K-1 : Removal of flat-pack components . 61 Figure L-1 : Soldering of a wrap-around connection to an extended component lead . 63 Figure L-2 : Soldering of component lead to a stud lead mounted into an existing hole 64 DIN EN 16602-70-28:2015-06 EN 16602-70-28:2014 (E) 8 Figure L-3 : Mounting a dual-in-line package with or without a wire link soldered onto a