DLA DESC-DWG-85141 REV C-2010 DELAY LINE THREE DELAY LINE UNITS 14 PIN DIP COMPATIBLE TTL INTERFACED [Use DLA DSCC-DWG-85151 REV F DLA DSCC-DWG-85151 REV E DLA DESC-DWG-85151 REV D.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Page 1, added inactive for new design notice. Pages 7 and 8, added second source. Editorial changes throughout. 22 Apr 86 Ivan R. Jones B Changed MIL-D-23859 references to MIL-D-83552. Changed 3.4. Added note 4 to figure 1. Clarified inputs and outputs on c

2、ircuit diagram. Added 3.2.1, 3.26, and vendor 50965. Corrected tolerances in table I. Editorial changes throughout. 1 Mar 93 D. Moore C Incorporated boilerplate updates. 22 Feb 10 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV C C C C C C C

3、 C C PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Dan McGrath DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH Original date of drawing 13 Sep 85 CHECKED BY Dan McGrath TITLE DELAY LINE, THREE DELAY LINE UNITS, 14 PIN DIP COMPATIBLE, TTL INTERFACED APPROVED BY Ivan R. Jones SIZE A CODE I

4、DENT. NO. 14933 DWG NO. 85141 SCALE N/A REV C PAGE 1 OF 9 AMSC N/A 5999-E223 INACTIVE FOR NEW DESIGN for new design use DESC drawing 85151 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reprodu

5、ction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85141 REV C SHEET 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a family of active, 14-pin delay lines with three delay line units per pac

6、kage. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as follows: 85141 -01 | | | | Drawing number Dash number (see table I) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not includ

7、e documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 o

8、f this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these document

9、s are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-19491 - Semiconductor Devices, Packaging of. MIL-PRF-83532 - Delay Lines, Active, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Component Parts. MIL-ST

10、D-883 - Microcircuits. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract,

11、 in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Interface and ph

12、ysical dimensions. The interface and physical dimensions shall be in accordance with figure 1. 3.2 Case materials. The case material shall be in accordance with MIL-PRF-83532. 3.2.1 Microcircuits. Microcircuits shall meet the requirements of MIL-STD-883, level B, as a minimum. 3.3 Design and dimensi

13、ons. The design and dimensions shall be in accordance with figure 1. 3.4 Terminals. The terminal material and finish shall be in accordance with MIL-PRF-83532. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON,

14、OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85141 REV C SHEET 3 FIGURE 1. Design and dimensions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85141 REV C SHEET 4 Ltr I

15、nches mm Min Max Min Max A - .820 - 20.83 B - .400 - 10.16 C - .360 - 9.14 D .295 .305 7.49 7.75 E .015 - 0.38 - F .100 typ .160 typ 2.54 typ 4.06 typ G .018 typ .022 typ 0.46 typ 0.56 typ H .010 typ .014 typ 0.25 typ 0.35 typ J .095 .105 2.41 2.67 K .145 .155 3.68 3.94 L .295 .305 7.49 7.75 NOTES:

16、1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tolerance is .005 (0.13 mm). 4. Leads shall be free of case meniscus and other foreign material and shall be solderable for a minimum of .010 inch (0.25 mm) above the seating pla

17、ne of the delay line. 5. Location and shape of standoffs are optional. Height shall be as indicated. FIGURE 1. Design and dimensions - Continued. X Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A

18、CODE IDENT NO. 14933 DWG NO. 85141 REV C SHEET 5 3.5 Temperature coefficient of delay. The temperature coefficient of delay shall be 1.0 ns +1,2000 ppm/C maximum. 3.6 Total delay time. The total delay time shall be in accordance with table I. 3.7 Delay tolerance. The delay tolerance shall be 2 ns or

19、 5 percent, whichever is greater. 3.8 Rise time. The rise time shall be 4 ns maximum. 3.9 Pulse width. The minimum input pulse width shall be 1.2 times the total delay. 3.10. Supply voltage (VCC). The supply voltage shall be 4.75 V dc to 5.25 V dc. 3.11 Supply current: a. Constant “0“ in 70 mA maxim

20、um. b. Constant “1“ in 25 mA maximum. 3.12 Logic 1 input. The logic 1 input shall be 50 A maximum at 2.4 volts or 1.0 mA maximum at 5.5 volts. 3.13. Logic 0 input. The logic 0 input shall be -2 mA maximum at 0.8 volt maximum. 3.14 Logic 1, VOUT. The logic 1, VOUTshall be 2.4 volts minimum. 3.15 Logi

21、c 0, VOUT. The logic 0, VOUTshall be 0.4 volt minimum. 3.16 Fan-out. The fan-out shall be 10 maximum (each delay line is capable of driving 10 TTL). 3.17 Thermal shock. The thermal shock test shall be in accordance with method 107, test condition A, of MIL-STD-202, 5 minutes at temperature extremes

22、and as specified in MIL-PRF-83532. 3.18 Seal. The seal test shall be in accordance with level A of MIL-PRF-83532. 3.19 Terminal strength. The terminal strength test shall be in accordance with method 211, test condition C of MIL-STD-202, and as specified in MIL-PRF-83532. 3.20 Vibration. The vibrati

23、on test shall be in accordance with method 204, test condition B of MIL-STD-202, and as specified in MIL-PRF-83532. 3.21 Shock. The shock test shall be in accordance with method 213, test condition D of MIL-STD-202, and as specified in MIL-PRF-83532. 3.22 Immersion. The immersion test shall be in ac

24、cordance with method 104, test condition A of MIL-STD-202, and as specified in MIL-PRF-83532. 3.23 Moisture resistance. The moisture resistance test shall be as specified in MIL-PRF-83532. 3.24 Solderability. The solderability test shall be as specified in MIL-PRF-83532. 3.25 Resistance to solvents.

25、 The resistance to solvents test shall be as specified in MIL-PRF-83532. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85141 REV C SHEET 6 3.26 Check for internal sh

26、orts. When a test signal is applied to any input, a delay signal should be detected at the output for that line only. For example, when input 1 is tested, there shall be no signal detected at outputs 2 and 3. All inputs shall be checked in this manner to ensure there are no shorts between lines. 3.2

27、7 Temperature range. The operating temperature range shall be -55C to +125. 3.28 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the o

28、perational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.29 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-83532 Qualified Product List for at least one part, or perform th

29、e Group A and Group C inspections specified herein on a sample of parts agreed upon by the manufacturer and DSCC-VA. 3.30 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3.31 Pure tin. The use of pure tin, as

30、an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.32 Marking. Marking shall be in accordance with MIL-PRF-83532 ex

31、cept that the PIN shall be as specified in 1.2. 3.33 Workmanship. Parts shall be free of flash pits, voids, and excessive mold marks. Visible parting line is acceptable. TABLE I. PINs and delay times. DSCC PIN 85141- Delay per line (ns) DSCC PIN 85141- Delay per line (ns) 001 002 003 004 005 006 007

32、 008 009 010 011 012 013 014 015 016 017 018 019 020 021 5.2 6.2 7.2 8.2 9.2 10.2 11.2 12.2 13.2 14.2 15.2 16.2 17.2 18.2 19.2 20.2 21.2 22.2 23.2 24.2 25.2 022 023 024 025 026 027 028 029 030 031 032 033 034 035 036 037 038 039 040 041 042 30.2 35.2 40.2 45.2.3 50.2.5 55.2.8 60.3 65.3.3 70.3.5 75.3

33、.8 80.4 85.4.3 90.4.5 95.4.8 100 5 125.6.3 150.7.5 175.8.8 200.10 225.11.3 250.12.5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85141 REV C SHEET 7 4. VERIFICATION

34、 4.1 Sampling and inspection. Unless otherwise specified, sampling and inspection procedures shall be performed in accordance with MIL-PRF-83532. 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for delivery shall consist of compliance with group A inspecti

35、on for level A of MIL-PRF-83532. 4.2.2 Inspection of packaging. The sampling and inspection of the preservation, packing, and container marking shall be in accordance with the requirements for semiconductor devices in MIL-DTL-19491. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging

36、 requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained

37、 by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by cont

38、acting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Devices conforming to this drawing are intended for use when military specifications do not exist and qualified mil

39、itary devices that will perform the required function are not available for OEM application. 6.2 Ordering data. The acquisition document should specify the following, as a minimum: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certificate o

40、f compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirement for the manufacturer to notify the acquiring activity in the event of a change in product. d. Requirements for packaging and packing. 6.3 Tin whisker growth. The use of alloys w

41、ith tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over t

42、op of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Users of

43、 record. Coordination of this document for future revisions is coordinated only with the approved source(s) of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at mailto:relaydla.mil or if in writing to: Defense Supply Ce

44、nter, Columbus, ATTN: DSCC/VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. 6.5 Approved source(s) of supply. Approved source(s) of supply are listed herein. Additional sources will be added as they become available. Assistance in the use of this dra

45、wing may be obtained online at mailto:relaydla.mil, or by contacting Defense Supply Center, Columbus, ATTN: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

46、m IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85141 REV C SHEET 8 DSCC PIN 85141- Vendor similar PIN 1/ CAGE 00222 CAGE 22519 001 002 003 004 005 95-28-05 95-28-06 95-28-07 95-28-08 95-28-09 MDU3-5M MDU3-6M MDU3-7M MDU3-8M MDU3-9M 006 007 008 009 010 95

47、-28-10 95-28-11 95-28-12 95-28-13 95-28-14 MDU3-10M MDU3-11M MDU3-12M MDU3-13M MDU3-14M 011 012 013 014 015 95-28-15 95-28-16 95-28-17 95-28-18 95-28-19 MDU3-15M MDU3-16M MDU3-17M MDU3-18M MDU3-19M 016 017 018 19 020 021 95-28-20 95-28-21 95-28-22 95-28-23 95-28-24 95-28-25 MDU3-20M MDU3-21M MDU3-22

48、M MDU3-23M MDU3-24M MDU3-25M 022 023 024 025 026 95-28-30 95-28-35 95-28-40 95-28-45 95-28-50 MDU3-30M MDU3-35M MDU3-40M MDU3-45M MDU3-50M 027 028 029 030 031 95-28-55 95-28-60 95-28-65 95-28-70 95-28-75 MDU3-55M MDU3-60M MDU3-65M MDU3-70M MDU3-75M See footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 85141 REV C SHEET 9 DSCC PIN 85141- Vendor similar PIN 1/ CAGE