DLA DESC-DWG-87016 REV N-2012 RESISTOR NETWORK FIXED FILM SURFACE MOUNT 20 PIN LEADLESS CHIP CARRIER.pdf

1、 REVISIONS LT DESCRIPTION DATE APPROVED A Add new tolerance (B). Change RTC to 25 ppm/C. Dimensional changes. Change voltage to 50 V dc. Add new suppliers. 27 MAY 88 D. Moore B Add new requirements for resistance characteristic, power ratings, solderability, and dimensions. 10 MAY 89 D. Moore C Add

2、new supplier. Editorial changes throughout. 28 MAY 91 D. Moore D Change package power rating to 1.0 watt. 6 FEB 92 D. Moore E Extend maximum resistance value to 150 kilohms. Editorial changes throughout. 13 JUL 92 D. Moore F Deleted ozone depleting substance. Added new supplier. Editorial changes th

3、roughout. 13 SEP 93 D. Moore G Changes in accordance with NOR 5905-R006-94. 13 JUL 94 D. Moore H Dimension changes. Editorial changes throughout. 25 SEP 95 N. Christolear J Update and validation of drawing. Changes RTC and power rating paragraphs. Change reference specification to MIL-PRF-914. Edito

4、rial changes throughout. 22 JUN 00 K. Cottongim K Changes in accordance with NOR 5905-R003-02. 6 JUN 02 K. Cottongim L Changes in accordance with NOR 5905-R005-03. 17 DEC 02 K. Cottongim M Remove vendor from suggest sources. Editorial changes throughout. 6 OCT 03 K. Cottongim N Add pure tin, manufac

5、turers eligibility, and pulse application paragraphs. Editorial changes throughout. 3 JUL 12 M. Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES RE

6、V N N N N N N N N N PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Alan R. Knox DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45444-5000 Original date of drawing 6 August 1987 CHECKED BY David W. Withrow TITLE RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 20 PIN, LEADLESS CHIP CARRIER

7、 APPROVED BY David E. Moore SIZE A CODE IDENT. NO. 14933 DWG NO. 87016 REV N PAGE 1 OF 9 AMSC N/A 5905-2012-E17 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87016 RE

8、V N PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a 20 pin, leadless chip carrier, resistor network. These networks are available in hermetically sealed and nonhermetically sealed packages. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 87016 - * * * *

9、 Drawing number Schematic (1.2.1) Resistance value designations (1.2.1.1) Resistance tolerance (3.3.1) Characteristic (1.2.1.2) 1.2.1 Schematic. The schematic of the resistor network shall be identified by a single letter in accordance with figure 1. FIGURE 1. Schematics. Provided by IHSNot for Resa

10、leNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87016 REV N PAGE 3 1.2.1.1 Resistance value designations. The resistance value designations is in accordance with MIL-PRF-914. Resistance value des

11、ignations for the “B” schematic are as specified in table I. TABLE I. Resistance value designation. Resistance designator R1(ohms) R2(ohms) Resistance Designator R1(ohms) R2(ohms) A001 A002 A003 A004 A005 A006 A007 82 120 130 160 180 180 220 130 200 210 260 240 390 270 A008 A009 A010 A011 A012 A013

12、220 330 330 330 1.5k 3k 330 390 470 680 3.3k 6.2k 1.2.1.2 Characteristic. Resistor networks are available in characteristics C, H, K, R, or V in accordance with MIL-PRF-914 (see 3.2). Matched ratios specified in MIL-PRF-914 for characteristics C and V are not applicable to schematic B. 2. APPLICABLE

13、 DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or co

14、ntract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-914 - Resistor Networks, Fixed, Film, Surface Mount, Nonestablished Reliability, and Established Reliability, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-ST

15、D-790 - Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. * (Copies of these documents are available online at https:/assist.dla.mil/quicksear

16、ch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) * 2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein (except for re

17、lated, specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with M

18、IL-PRF-914 and as specified herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87016 REV N PAGE 4 3.2 Interface and physical dimension requirements. Resistors shal

19、l meet the interface and physical dimensions as specified in MIL-PRF-914 and herein (see figure 2). Cavity construction using wire bonding techniques shall be supplied only as a characteristic C hermetically sealed resistor network. 3.2.1 Termination. Termination finish shall be tin-lead or hot sold

20、er dip as specified in MIL-PRF-914. * 3.2.2 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass

21、 (see 6.5). 3.3 Electrical characteristic. 3.3.1 Resistance tolerance. Resistors are available in (B) .1 percent, (D) .5 percent, (F) 1 percent, (G) 2 percent, and (J) 5 percent tolerances. 3.3.2 Resistor power ratings. The power rating for individual resistors shall be in accordance with table II.

22、3.3.3 Package power rating. The package power rating shall be in accordance with table II. For temperatures in excess of 70C, derate in accordance with MIL-PRF-914. TABLE II. Power ratings. Schematics Characteristic K Characteristic K Characteristics C, H, R, and V Characteristics C, H, R, and V Ele

23、ment (watts) Network (watts) Element (watts) Network (watts) A B C D 0.10 0.05 0.05 0.10 1.00 1.00 0.95 1.00 0.050 0.025 0.025 0.050 0.50 0.50 0.475 0.50 3.3.4 Power conditioning. Power conditioning shall be in accordance with MIL-PRF-914 at 1.5 times rated power specified for individual resistors (

24、see 3.3.2). 3.3.5 Temperature range. The operating temperature range shall be -55C to +125C. 3.3.6 Resistance temperature characteristic. The resistance temperature characteristic shall be in accordance with MIL-PRF-914. 3.3.7 TC tracking. The TC tracking shall be 10 ppm/C. 3.3.8 Resistance range. T

25、he resistance range shall be from 10 ohms to 1 megohms. 3.3.9 Operating voltage. The maximum operating voltage shall be 50 V dc. 3.3.10 Solderability. When resistors are tested as specified in 4.5, there shall be no evidence of electrical or mechanical damage. Provided by IHSNot for ResaleNo reprodu

26、ction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87016 REV N PAGE 5 3.3.10.1 Failure criteria for leadless packages. The criteria for acceptable solderability during evaluation of the terminations are: a. The

27、 total surface area of the dipped part of the termination is at least 95 percent covered by a continuous new solder coating. b. That pinholes, voids, porosity, nonwetting, or dewetting are not concentrated in one area and do not exceed 5 percent of the total metallized termination area. c. That ther

28、e shall be no solder bridging between any termination area and any other termination area not connected to it by design. In the event that the solder dipping causes bridging, the test shall not be considered a failure provided that a local application of heat (i.e., gas, soldering iron, or redipping

29、) results in solder pullback and no wetting of the dielectric area is indicated by microscope examination at a magnification of between 10 and 20x. That area of the surface to be tested as specified in 4.6c shall include the total metallized area of both the castellations and the terminal pads. In c

30、ase of a dispute, the percentage of coverage with pinholes or voids shall be determined by actual measurement of these areas, as compared to the total area. 3.4 Environmental characteristic. The environmental characteristics shall be in accordance with MIL-PRF-914 characteristic C, H, K, R, or V, ex

31、cept for RTC (see 3.3.6). 3.5 Marking. Marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in 1.2, with the manufacturers CAGE number or trade mark and date code. 3.6 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmenta

32、lly preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. * 3.7 Manufacturer eligibility. To be eligible for listing as a approved source of

33、 supply, a manufacturer shall be listed on the MIL-PRF-914 Qualified Products List for at least one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT. * 3.7.1 Certificate of compliance. A certificate of com

34、pliance shall be required from manufacturers requesting to be listed as an approved source of supply. 3.8 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assu

35、rance program specified in MIL-PRF-914 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.2.1 Failure rate qualification. The failure rate qualification specified in MIL-PRF-91

36、4 is not applicable to this document. 4.3 Conformance inspection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87016 REV N PAGE 6 4.3.1 Inspection of product for del

37、ivery. Inspection of product for delivery shall consist of group A and group B inspections of MIL-PRF-914. 4.3.2 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). Inches 0.003 0.0

38、05 0.008 0.014 0.015 mm 0.08 0.13 0.20 0.36 0.38 Inches 0.020 0.023 0.025 0.040 0.050 mm 0.51 0.58 0.64 1.02 1.27 Inches 0.085 0.200 0.250 0.310 0.350 mm 2.16 5.08 6.35 7.87 8.89 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise spe

39、cified, tolerances are .008 (0.20 mm). 4. Adjacent corner pads may be rounded or diagonally cut to meet the .015 (0.38 mm) minimum requirement. FIGURE 2. Leadless chip carrier. .310MAX.015 MAX.003 MIN.014.008Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH

40、S-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 87016 REV N PAGE 7 4.4 Inspection of packaging. Inspection of packaging shall be in accordance with MIL-PRF-914. 4.5 “B” schematic tests. For the tests on “B” schematic, the dc resistance measurements, resistance

41、 temperature characteristics measurement, and short time overload power application shall be made between each terminal and the application common terminal without compensation for the shunt circuits. The pin to pin dc resistance measurements shall be used directly to determine the acceptability to

42、section 3 requirements. 4.6 Solderability. Solderability shall be in accordance with method 208 of MIL-STD-202. The following details shall apply: a. Application of flux. Flux type shall be in accordance with MIL-PRF-914. Terminations shall be immersed in the flux, which is at room ambient temperatu

43、re, to the minimum depth necessary to cover the surface to be tested. The terminations shall be completely immersed by individually dipping each edge with the Y1 axis 30 degrees to 45 degrees from vertical. The terminations to be tested shall be immersed in the flux for a period of 5 seconds to 10 s

44、econds. b. Solder dip. The dross and burned flux shall be skimmed from the surface of the molten solder. (NOTE: May not require separate operation in wave or flow pot). The molten solder shall be maintained at a uniform temperature of 245C 5C. The surface of the molten solder shall be skimmed again

45、prior to immersing the terminations in the solder. The part shall be attached to a dipping device and the flux covered terminations immersed, one side at a time, in molten solder to the depth, and in the same manner specified in 4.6a. The immersion and emersion rates shall be 1.000 .250 inch per sec

46、ond and dwell time in the solder bath shall be 5.0 seconds 0.5 second. After the dipping process, the part shall be allowed to cool in air. Residue flux shall be removed from the terminations by rinsing in a suitable solvent. If necessary, a soft cloth or cotton swab moistened with clean 91 percent

47、isopropyl alcohol shall be used to remove all remaining flux. c. Examinations of terminations. After each dip coated termination has been thoroughly cleaned of flux, the castellation and pad shall be examined using a magnification between 10x and 20x. 4.7 Visual and mechanical examination. Resistors

48、 shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-914. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contra

49、ct or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity within the Military Departmen