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本文(DLA DSCC-DWG-03005 REV B-2013 RESISTOR FIXED CARBON FILM HIGH PULSE VOLTAGE 1 2 WATT.pdf)为本站会员(刘芸)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA DSCC-DWG-03005 REV B-2013 RESISTOR FIXED CARBON FILM HIGH PULSE VOLTAGE 1 2 WATT.pdf

1、 REVISIONS LT DESCRIPTION DATE APPROVED A Add pure tin prohibition paragraph. Editorial changes throughout. 31 MAR 06 M. Radecki B Add manufacturers eligibility paragraph. Editorial changes throughout. 30 MAY 13 M. Radecki Prepared in accordance with ASME Y14.100 REV STATUS OF PAGES REV B B B B B B

2、B B B B B B B PAGES 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Andrew R. Ernst DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing 5 November 2003 CHECKED BY Andrew R. Ernst TITLE RESISTOR, FIXED, CARBON FILM, HIGH PULSE VOLTAGE, 1/2 WATT APPROVED BY Kendall A. Cottongim SI

3、ZE A CODE IDENT. NO. 037Z3 DWG NO. 03005 REV B PAGE 1 OF 13 AMSC N/A 5905-2013-E49 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE S

4、UPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03005 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a fixed, carbon film, high pulse voltage, .5 watt, resistor. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 03005 - * *

5、Drawing number Resistance (3.3.2) and (3.3.3) Resistance tolerance (see 3.3.4) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless

6、otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Tests Methods For Electronic and Electrical Components Parts MIL-STD-810 - Environmental Engineering Considerations and Laboratory MIL-STD-1276 - Leads fo

7、r Electronic Components Parts MIL-STD-1285 - Marking of Electrical and Electronic Parts * (Copies of these documents are available online at http:/quicksearch.dla.mil or from the DLA Document Services, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) * 2.2 Order of precedence. Unless o

8、therwise noted herein, or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obta

9、ined. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be as specified herein. 3.2 Interface and physical dimensions. Resistors shall meet the interface and physical dimensions as specified herein (see figure 1). 3.3 Electrical characteristics. 3.3.1 Termination finish.

10、Termination material shall be in accordance with MIL-STD-1276 and table I. TABLE I. Termination finish. Termination material in accordance with MIL-STD-1276. C32 - C52 - Electroplated tin lead terminals. Hot solder dipped terminals. 1/ 1/ Hot solder dipped available through purchase order (see 6.2e)

11、. 3.3.1.1 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent, by mass (see 6.4). Provided by IHSNot for Res

12、aleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03005 REV B PAGE 3 Dimension L D H d 0.354 .032 (8.99 .81) 0.125 .02 (3.18 .51) 1.06 .08 (27 2) 0.028 .003 (0.71 .08) NOTES: 1. Dimensions are in

13、 inches. 2. Metric equivalents are given in parenthesis for general information only. 3. The picturization of the style above is given as a representative of the envelope item. Light deviations from the outline shown, which are contained within the envelope and do not alter the functional aspects of

14、 the device, are acceptable. FIGURE 1. Fixed resistors, precision. 3.3.2 Resistance range. The resistance range shall be from 1 kilohm to 22 megohms. 3.3.3 Resistance. The nominal resistance expressed in ohms is identified by a three digit number; the first two digits represent significant figures a

15、nd the last digit specifies the number of zeros to follow. When resistance values less than 10 ohms are required, the letter “R” is substituted for one of the significant digits to represent the decimal point. The resistance may be of any value, but it is preferred that the standard values be chosen

16、 from table II. 3.3.4 Resistance tolerance. Resistors are available in tolerances (G) 2 percent, (J) 5 percent, and (K) 10 percent. TABLE II. Standard resistance values for the 10 to 100 decade. Tolerance G (2%) the change in resistance shall not exceed 5 percent. Provided by IHSNot for ResaleNo rep

17、roduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03005 REV B PAGE 5 NOTE: Pulse capability is dependent on resistance values, waveform, repetition rate, circuit inductance, and temperature. The above fig

18、ure is a general guide based on infrequent pulses with peak pulse voltage level not to exceed 5KV. Derate peak wattage by 50 percent for repetitive pulses. Average pulse power must exceed 0.5 watt. Derate continuous and pulse wattage and voltage ratings by 1.05 percent/C above 70C. FIGURE 3. Pulse w

19、ithstanding capability. 3.10 Low temperature operation. When resistors are tested as specified in 4.12, there shall be no evidence of mechanical damage. The change in resistance shall not exceed 2 percent (3 percent on values greater than 100K ohms). 3.11 Thermal shock. When resistors are tested as

20、specified in 4.13, there shall be no evidence of mechanical damage; the change in resistance shall not exceed (2 percent +.05 ohm). 3.12 Low temperature storage. When resistors are tested as specified in 4.14, there shall be no evidence of mechanical damage. The change in resistance shall not exceed

21、 2 percent (3 percent on values greater than 100K ohms). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03005 REV B PAGE 6 3.13 Moisture resistance. When resistors ar

22、e tested as specified in 4.15, there shall be no evidence of mechanical damage or products of corrosion except for normal discoloration, the change in resistance shall not exceed the following: Change in resistance Ohmic range (ohms) 2 percent 3 percent 5 percent 7 percent 56 k 56 k to 470 k 470 k t

23、o 10 M 10 M 3.14 Short time overload. When resistors are tested as specified in 4.16, there shall be no evidence of arching, burning, or charring; the change in resistance shall not exceed 2 percent. 3.15 Terminal strength. 3.15.1 Direct load. When resistors are tested as specified in 4.17, resistor

24、s shall withstand the specified load without mechanical damage. 3.15.2 Twist. When resistors are tested as specified in 4.17.1, there shall be no evidence of breaking or loosening of terminals from the resistor form, or chipping of coating, or other evidence of mechanical damage. The change in resis

25、tance shall not exceed .5 percent. 3.16 Resistance to soldering heat. When resistors are tested as specified in 4.18, there shall be no evidence of mechanical damage. The change in resistance shall not exceed 1 percent. 3.17 Life. When resistors are tested as specified in 4.19, there shall be no evi

26、dence of mechanical damage. The change in resistance between the initial measurement and any of the succeeding measurements, up to and including 1,000 hours, shall not exceed 5 percent (7 percent on values greater than 100K ohms). 3.18 Solderability. When resistors are tested as specified in 4.20, t

27、he dipped surface of the leads shall be at least 95 percent covered with a new solder coating. The remaining 5 percent of the lead surface may show only small pinholes or voids and shall not be concentrated in one area. Bare base metal and areas where the solder dip failed to cover the original coat

28、ing are indications of poor solderability, and shall be cause for failure. 3.19 Fungus. All external materials including the color material, shall be nonnutrient to fungus growth, or shall be suitably treated fungus growth. The manufacturer shall verify by certification that all external materials,

29、including the color coding material, are fungus resistant. 3.20 Marking. Resistors shall be free of missing, illegible, incorrect, mixed or smeared color markings, and shall be permanently color coded in accordance with MIL-STD-1285. 3.21 Recycled, recovered, or environmentally preferable materials.

30、 Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. * 3.22 Manufacturer eligibility. To be eligib

31、le for listing as an approved source of supply, a manufacturer shall perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT. * 3.22.1 Certificate of compliance. A certificate of compliance shall be required from manufact

32、urers requesting to be listed as an approved source of supply. 3.23 Workmanship. Resistors shall be uniform in quality and free from defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE

33、 SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03005 REV B PAGE 7 4. VERIFICATION 4.1 Qualification inspection. Qualification inspection is not applicable to this document. 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for de

34、livery shall consist of group A and group B inspections (see 6.2c). 4.3 Group A inspection. Group A inspection shall consist of the inspections specified in table IV, and shall be made on the same set of sample units, in the order shown. TABLE IV. Group A inspection. Inspection Requirement paragraph

35、 Test method paragraph Number of samples Subgroup I DC resistance 3.4 4.6 100 percent Subgroup II Visual and mechanical inspection 3.2 and 3.20 4.5 13 Subgroup III Solderability 3.18 4.20 5 4.3.1 Subgroup I. Subgroup I tests shall be performed on 100 percent of the product supplied under this specif

36、ication. Resistors that are out of resistance tolerance or which experience a change in resistance greater than that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects or one resistor, whichever is greater, due to exceeding the speci

37、fied resistance change limit, shall not be furnished on the contract. 4.3.2 Subgroup II. A sample of 13 parts shall be randomly selected, if one or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defect

38、s are found in this second sample, the lot shall be rejected and shall not be supplied against this document. 4.3.3 Subgroup III (solderability). A sample of 5 parts shall be randomly selected, as an option; the manufacturer may use electrical rejects from subgroup I test for all or part of the samp

39、le. If there are one or more defects, the lot is rejected. The manufacturer may use the following for corrective action: a. Each lot that was used to form the failed lot shall be individually submitted to the solderability test. Lots that pass the solderability test are available for shipment. b. Th

40、e failed lot is submitted to a 100 percent hot solder dip. A subsequent solderability test shall then be performed. If the lot passes, it is available for shipment; if the lot fails, the manufacturer may perform the hot solder dip one additional time. If the lot fails, the lot is considered rejected

41、 and shall not be supplied to this drawing. 4.3.3.1 Disposition of samples. The solderability test is considered a destructive test. Samples submitted to the solderability test shall not be supplied on the contract. 4.4 Group B inspection. Group B inspection shall consist of the inspections specifie

42、d in table V, in the order shown. 4.4.1 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2c). 4.4.2 Action in case of failure. If any of subgroups fail Group B testing and an appropri

43、ate lot screen can be established, the lot shall be screened and a new set of samples (see table V for number of samples), from the screened lot, shall be submitted to the subgroup(s) that failed. If one or more defects are found, in the resubmitted samples, the lot shall be rejected and shall not b

44、e supplied to this specification. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03005 REV B PAGE 8 4.4.3 Disposition of sample units. Sample units that have been sub

45、jected to group B inspections shall not be supplied to this specification TABLE V. Group B inspection. Inspection Requirement paragraph Test method paragraph Number of sample units for inspection Number of failures allowed Monthly Subgroup 1 Life 3.17 4.19 5 0 Subgroup 2 Voltage coefficient Dielectr

46、ic withstanding voltage Insulation resistance Resistance to pulse 3.6 3.7 3.8 3.9 4.8 4.9 4.10 4.11 5 0 Quarterly Low temperature operation Thermal shock Low temperature storage Moisture resistance Short time overload 3.10 3.11 3.12 3.13 3.14 4.12 4.13 4.14 4.15 4.16 5 0 Semiannually Subgroup 1 Resi

47、stance temperature characteristic 3.5 4.7 5 0 Subgroup 2 Terminal strength Resistance to soldering heat 3.15 3.16 4.17 4.18 5 0 Subgroup 3 Fungus 3.19 4.21 5 0 4.5 Visual and mechanical inspection. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, m

48、arking, and workmanship are in accordance with the applicable requirements 3.2, 3.20, and 3.23. 4.6 DC resistance. (see 3.4). Resistors shall be tested in accordance with method 303 of MIL-STD-202. The following details and exception shall apply: a. Measuring apparatus: The same measuring instrument

49、 shall be used for any one test, but not necessarily for all tests. b. Test voltage: Table VI gives the recommended test voltage to be used. Other test voltages may be used; however, in the event of a difference in resistance readings attributable to the test voltage used, the specified test voltage listed in table VI shall be used. TABLE VI. DC resistance test

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