DLA DSCC-DWG-06001 REV E-2013 RESISTORS CHIP FIXED BULK METAL FOIL ULTRA PRECISION STYLE 2010.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add new vendor. Add pure tin prohibition. Editorial requirements throughout 17 Mar 2006 M. Radecki B Vendor part number change 19 July 2006 M. Radecki C Corrections to power rating (figure 2), table II and table IV 09 Aug 2007 M. Radecki D Vendor recommende

2、d changes. Current DoD requirements. Editorial requirements throughout 06 Aug 2009 M. Radecki E Vendor address change. Add new vendor. Editorial changes throughout. 01 Mar 2013 M. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV E E E E E E E E PAGES 1

3、2 3 4 5 6 7 8 PMIC N/A PREPARED BY Jesus V. Garcia III DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing 18 October 2005 CHECKED BY Andrew R. Ernst TITLE RESISTORS, CHIP, FIXED, BULK METAL FOIL, ULTRA PRECISION, STYLE 2010 APPROVED BY William E. Sindelar SIZE A CODE IDENT. NO. 03

4、7Z3 DWG NO. 06001 REV E PAGE 1 OF 8 AMSC N/A 5905-2012-E03 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS C

5、OLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06001 REV E PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a bulk metal foil, ultra precision, chip resistor, style 2010. 1.2 Part or Identifying Number (PIN). The complete PIN is as follows: 06001 - * * * Drawing number Resis

6、tance value (see 3.3.1) Power and voltage rating (See 3.3.4) Tolerance (see 3.3.3) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. The following specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise

7、 specified, the issues of these documents are those listed in the cited in the solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General Specification for. DEPARTMENT

8、 OF DEFENSE STANDARDS MIL-STD-690 - Failure Rate Sampling Plans and Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. (Copies of these documents are avai

9、lable online at https:/assist.dla.mil/quicksearch/ or from the DLA Document Service, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the referenc

10、es cited herein (except for related specification sheets), the text of this document takes precedence unless otherwise noted. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The indivi

11、dual item requirements shall be as specified herein. 3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Passivation is not applicable, however, a protective coating over the element shall be provided. Provide

12、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06001 REV E PAGE 3 3.3 Electrical characteristics 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by

13、six characters, consisting of five digits and a letter. The letter is used simultaneously as a decimal point and as a multiplier. For resistance values: a. Greater than or equal to 1 ohm but less than 1,000 ohms, the letter “R“ is used to represent a decimal point. b. Greater than or equal to 1,000

14、ohms but less than 1 megohm, the letter “K“ is used to represent a decimal point. All digits preceding and following the letters (R or K) of the group represent significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified in

15、 3.3.2. The standard values for every decade shall follow the sequence specified in the 10 to 100 decade table of MIL-PRF-55342 for resistance tolerances D and F. The resistance values for tolerances T (inactive for new design), Q, A, B, and C may be any value within the limits specified herein, but

16、 it is preferred that values be chosen from the “B“ column of the 10 to 100 decade table of MIL-PRF-55342. The resistance values for tolerance D shall follow the standard values listed under tolerance B of MIL-PRF-55342. L W T D .198 .005 .097 .005 .025 MAX .025 .005 NOTES: 1. Dimensions are in Inch

17、es. Metric equivalents are given for general information only. 2. The pictorial view of the styles above is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope and do not alter the functional aspects of the device, ar

18、e acceptable. 3. Tolerances shall be +/- 0.005 inch (+/- 0.13 mm) unless otherwise specified. 4. The bottom view shown above represents the mounting side. FIGURE 1. Chip resistor. Inches mm .005 0.13 .025 0.64 .097 2.46 .198 5.03 Uncoated Ceramic Provided by IHSNot for ResaleNo reproduction or netwo

19、rking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06001 REV E PAGE 4 TABLE I. Designation of resistance values. Designation Resistance ohms 10R000 to 99R900 incl. 10 to 99.900 incl. 100R00 to 999R00 incl. 100 to 999.00 inc

20、l. 1K0000 to 9K9900 incl. 1000 to 9,999.00 incl. 10K000 to 55K000 incl. 10,000 to 55,000 incl. 3.3.2 Resistance range and resistance temperature characteristic. The resistance range shall be from 10 ohms to 55 kilohms. The corresponding resistance temperature characteristic is specified in table II.

21、 Table II. Resistance range and resistance temperature characteristic. Resistance range Resistance Temperature Characteristic (RTC) in ppm/OC Power rating (see 3.3.4) 250 - 100K 4 A 1/ 50 - 250 5 25 - 50 6 10 - 25 8 5 - 10 12 100 - 100K 2 B 1/ 50 - 100 3 10 - 50 4 250 - 55K 4 C 50 - 250 5 25 - 50 6

22、10 - 25 8 100 - 55K 3 D 50 - 100 4 10 - 50 5 1/ Inactive for new design with corresponding resistance range and RTC. 3.3.3 Resistance tolerance. Resistors are available in resistance tolerances as specified in table III. TABLE III. Resistance tolerance. Symbol Resistance tolerance percent Available

23、resistance range T 1/ 0.01 250 to 100k Q 0.02 A 0.05 100 to 55k B 0.1 50 to 55k C 0.25 25 to 55k D 0.5 10 to 55k F 1.0 1/ Inactive for new design Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CO

24、DE IDENT NO. 037Z3 DWG NO. 06001 REV E PAGE 5 3.3.4 Power and voltage rating. The power rating is at 70OC derated to +150OC at zero power (see figure 2) and maximum voltage is specified in table IV. Table IV. Power and voltage rating Symbol Maximum power rating (mWatts) Voltage (in volts) A 1/ 300 E

25、=PR E = Voltage P = Power R = Resistance B 1/ 500 C 300 D 500 1/ Inactive for new design FIGURE 2. Derating curve. 3.3.5 Termination. The termination material shall be in accordance with MIL-PRF-55342, code letter B. 3.3.6 Pure tin. The use of pure tin, as an underplate or final finish, is prohibite

26、d both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.4 Thermal shock. When resistors are tested as specified in MIL-PRF-55342 for thermal shock the change in r

27、esistance shall not exceed 0.03 percent +0.01 ohm. 3.5 Low temperature operation. When resistors are tested as specified in MIL-PRF-55342 for low temperature operation the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.6 Short time overload. When resistors are tested as specified in

28、 MIL-PRF-55342 for short time overload the change in resistance shall not exceed 0.02 percent +0.01 ohm. 3.7 High temperature exposure. When resistors are tested as specified in MIL-PRF-55342 for high temperature exposure the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.8 Resistan

29、ce to soldering heat. When resistors are tested as specified in MIL-PRF-55342 for resistance to soldering heat the change in resistance shall not exceed 0.02 percent +0.01 ohm. -65 -50 -25 0 25 50 75 100 125 150 175 100 80 60 40 20 0 Percentofrated power70OC -55OC Provided by IHSNot for ResaleNo rep

30、roduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06001 REV E PAGE 6 3.9 Moisture resistance. When resistors are tested as specified in MIL-PRF-55342 for moisture resistance the change in resistance shall

31、 not exceed 0.1 percent +0.01 ohm. 3.10 Life. When resistors are tested as specified in MIL-PRF-55342 for life the change in resistance shall not exceed 0.05 percent +0.01 ohm. 3.11 Resistance temperature characteristic. When resistors are tested as specified in MIL-PRF-55342 the RTC shall not excee

32、d the values specified (see 3.3.2). 3.12 Marking. Marking is not required on this resistor; however, each waffle pack and each unit package shall be marked with the PIN assigned herein (see 1.2), the manufacturers identification code, the date code, and the lot code. At the option of the manufacture

33、r, the resistor may be marked (i.e., laser, color dot, etc.). The marking shall remain legible after all tests. 3.13 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Product List for at least one part,

34、 or perform the group A and group B inspections specified herein on a sample of parts agreed upon by the manufacturer and DLA Land and Maritime-VA. 3.13.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed as approved sources of supply

35、. 3.14 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements and promotes economically advantage

36、ous life cycle costs. 3.15 Workmanship. Resistors shall be processed in such a manner as to be uniform in quality and be free from defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and

37、 maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 and MIL-STD-690 is not applicable to t

38、his document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of group A inspection (ER level only). PPM reporting, subgroup 1, subgroup 3, are not applicable) and group B inspection of MIL-PRF-55342. 4.4.1.1 Certification. The p

39、rocuring activity may accept a certificate of compliance in lieu of Group B inspection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 06001 REV E PAGE 7 5. PACKAGING

40、 5.1 Packaging. For acquisition purpose, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packagi

41、ng requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys

42、automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended to be used in thick or thin film c

43、ircuits where microcircuity is intended, also, for use in surface mounting application. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery: One copy of the conformance inspection data or a certificate of compliance

44、that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Packaging requirements. d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B requirements (see 4.4.1.1). 6.3 Tin whisker growth. The use of alloys

45、with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over

46、top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Toleran

47、ce caution. Soldering temperature used during installation may cause resistance to shift up to 0.05 %. 6.5 Recommended mounting. A low profile solder fillet is recommended (25 percent to 85 percent of chip “T“ dimension). IR, vapor phase, and convection reflow are recommended. The resistance element

48、 must be mounted in the up position to prevent failure of the part. 6.6 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shippin

49、g resistors. Direct shipment to Government is controlled by MIL-DTL-39032 that specifies a preventative packaging procedure. 6.7 Pulse applications. Designers are CAUTIONED on using these resistors in pulse applications. Since they have not been qualified nor tested for such applications, damage and premature