DLA DSCC-DWG-09027-2011 CAPACITORS FIXED CERAMIC CHIP TIGHT TOLERANCE THIN FILM 1210.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV PAGES 1 2 3 4 5 6 7 9 10 11 12 PMIC N/A PREPARED BY John Bonitatibus DESIGN ACTIVITY DLA LAND AND MARITIME COLUMBUS, OH Original date of drawing 30 August 2011 CHECKED BY

2、Mark Rush TITLE CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210 APPROVED BY Michael A. Radecki SIZE A CODE IDENT. NO. 037Z3 DWG NO. 09027 SCALE N/A REV PAGE 1 OF 12 AMSC N/A 5910-E446Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

3、DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09027 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing and MIL-PRF-55681 describe the requirements for capacitors, ceramic, chip. These capacitors are composed of a single or double layer dielectric thin film and are of smaller size

4、 with lower voltages and tighter tolerances than those currently offered in MIL-PRF-55681. 1.2 Part or Identifying Number (PIN) The complete PIN is as follows: 09027- BP 100 B J T - Drawing number Dielectric (see 1.2.1) Capacitance value (see 1.2.2) Voltage (see 1.2.3) Capacitance tolerance (see 1.2

5、.4) Termination finish (see 1.2.5) Group C testing option (see 1.2.6) 1.2.1 Dielectric rated temperature and voltage-temperature limits. The rated temperature and voltage-temperature limits are identified by a two-letter symbol. The first letter “B“ indicates the rated temperature of -55C to +125C;

6、the second letter indicates the voltage-temperature limits across the rated temperature as shown in table I. TABLE I. Voltagetemperature limit. Symbol Capacitance change with reference to +25C Step A through step D of MIL-PRF-55681 table XIII Percent rated voltage Step E through step G of MIL-PRF-55

7、681 table XIII P 30 ppm/ degree C 100 30 ppm/ degree C H 60 ppm/ degree C 100 60 ppm/ degree C 1.2.2 Capacitance value. The nominal capacitance value, expressed in picofarads (pF) is identified by a three-digit number; the first two digits represent significant figures and the last digit specifies t

8、he number of zeros to follow. When the nominal value is less than 10 pF, the letter “R” is used to indicate the decimal point and the succeeding digit(s) of the group represent significant figure(s). 1R0 indicates 1.0 pF; R75 indicates 0.75 pF; and 0R5 indicates 0.5 pF. 1.2.3 Voltage. The rated volt

9、age for continuous operation at +125C is identified by a single letter as shown in table II. TABLE II. Rated voltage. Symbol Rated voltage (volts, dc) X 10 Y 16 Z 25 A 50 B 100 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COL

10、UMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09027 REV PAGE 3 1.2.4 Capacitance tolerance. The capacitance tolerance is identified by a single letter in accordance with table III. TABLE III. Capacitance tolerance. Symbol Capacitance tolerance () A 0.05 pF B 0.1 pF C 0.25 pF D 0.5 pF F 1 percent G

11、 2 percent J 5 percent P 0.02 pF Q 0.03 pF X 0.015 pF Z 0.01 pF 1.2.5 Termination finish. Termination finish is identified by a single letter as shown in table IV. TABLE IV. Termination finish. Symbol Termination finish T Base metallization-barrier metal-solder coated (tin/silver alloy with a minimu

12、m of 4 percent silver) 1.2.6 Group C testing option. To require MIL-PRF-55681 group C testing, use the appropriate letter from table V. If group C testing is not desired, leave this location blank. When optional group C testing is requested, terminal strength, series resonance, and moisture resistan

13、ce are not applicable. NOTE: Ordering group C options that contain a 2,000-hour life test may extend the processing time by 90 days or more. TABLE V. Group C testing options. Letter Group C testing option C Full group C L 2,000 hour life test only M 1,000 hour life test only H Low voltage humidity o

14、nly N/A No group C testing 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples

15、. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, a

16、nd handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. Provided by IHSNot for ResaleNo reproduction or networking perm

17、itted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09027 REV PAGE 4 DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Gener

18、al Specification For. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Component Parts, Test Methods for. MIL-STD-883 - Microcircuits, Test Methods for. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at https:/assist.

19、daps.dla.mil/quicksearch or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of thes

20、e documents are those cited in the solicitation or contract. AGILENT TECHNOLOGIES Application Note 1369-6 - How To Accurately Evaluate Low ESR, High Q RF Chip Devices. (Copies of these documents are available online at http:/ or from Agilent Technologies, Inc., 5301 Stevens Creek Blvd., Santa Clara

21、CA 95051) INTERNATIONAL ELECTROTECHNICAL COMMISION (IEC) IEC 60068-2-58 - Test Methods for Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD). (Copies of these documents are available online at http:/ or from Global Engineering Documents

22、, Attn: Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776) 2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. No

23、thing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55681, and as specified herein. Unless otherwise stated, these capaci

24、tors shall be capable of meeting all electrical, environmental, and mechanical requirements of MIL-PRF-55681. 3.2 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of capacitor components and solder shall not exceed 96 percent,

25、 by mass. Tin shall be alloyed with a minimum of 4 percent silver, by mass (see 6.4). 3.3 Interface and physical dimensions. The interface and physical dimensions shall be as specified herein (see figure 1). 3.4 Electrical characteristics. 3.4.1 Dielectric type. The dielectric type shall be BP (30 p

26、pm/C) or BH (60ppm/C) single or double layer film as shown in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09027 REV PAGE 5 T W B2 L B1 NOTES: 1. Dimensions are in i

27、nches. 2. Metric equivalents are given for general information only. FIGURE 1. Physical dimensions and configuration. 3.4.2 Voltage conditioning. When tested in accordance with MIL-PRF-55681, capacitors shall meet the following requirements: a. Dielectric withstanding voltage (DWV) (at +25C): As spe

28、cified in 3.4.3. b. Insulation resistance (IR) (at +25C): Shall be as specified in 3.4.4. c. Capacitance (at +25C): Shall be as specified in 3.4.5. d. Dissipation factor (DF) (at +25C): Shall be as specified in 3.4.6. 3.4.3 Dielectric withstanding voltage (DWV). In accordance with MIL-PRF-55681, exc

29、ept the test voltage shall be 6 times rated voltage, minimum. 3.4.4 Insulation resistance. When measured in accordance with MIL-PRF-55681, the insulation resistance shall be as follows: At +25C: Minimum of 10,000 megohms. 3.4.5 Capacitance. When measured in accordance with method 305 of MIL-STD-202,

30、 capacitance shall be as specified in table VIII. The following conditions shall apply: a. Test frequency: 1 MHz 100 kHz. b. Test voltage: 1.0 volt 0.2 volt rms. Inches mm .0039 0.100 .0079 0.200 .0169 0.430 .0366 0.930 .0984 2.500 .1189 3.020 Dimensions L .0039 W .0039 T .0079 B1 .0039 B2 .0039 .11

31、89 .0984 .0366 .0169 .0169 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09027 REV PAGE 6 3.4.6 Dissipation factor (+25C). When measured at the frequency and voltage specified

32、 in 3.4.5, the dissipation factor shall be less than 0.15 percent. 3.4.7 Equivalent series resistance (ESR). When tested on Agilent RF Impedance/Material Analyzer 4291B/E4991A or equivalent, in accordance with Agilent Technologies Application Note 1369-6, the ESR shall be less than the limits shown

33、in table VIII. The following details shall apply: Test frequency: For capacitance values 1 pF: 1.8 GHz. For capacitance values 1 pF: 1.0 GHz. 3.5 Visual and mechanical examination. In accordance with MIL-PRF-55681. 3.6 Solderability. When tested in accordance with IEC 60068-2-58, the immersed metall

34、ized surface shall be least 95 percent covered with a smooth solder coating. The remaining 5 percent of the surface may contain small pinholes or exposed termination material; however, these shall not be concentrated in one area. The following details shall apply: a. Solder temperature: +235C 5C. b.

35、 Dwell time: 2 +0, -0.5 seconds. 3.7 Temperature cycling (air to air). In accordance with method 1010.8 of MIL-STD-883, the following details and requirements shall apply: a. Number of cycles: 15. b. Exposure time at extreme temperatures: 30 1 minute. c. Capacitance change: Shall change not more tha

36、n 2 percent for capacitor values 5 pF. Shall change not more than 0.25 pF for capacitor values 5 pF. 3.8 Resistance to soldering heat. In accordance with IEC 60068-2-58, the following details and requirements shall apply: a. Temperature: 260 5C. b. Test duration: 10 0.5 seconds. c. Capacitance chang

37、e: Shall change not more than 2 percent for capacitor values 5 pF. Shall change not more than 0.25 pF for capacitor values 5 pF. 3.9 Humidity, steady state, low voltage. In accordance with MIL-PRF-55681, except: a. Test duration: 1,000 hours. b. Test voltage: rated. c. Capacitance change: Shall chan

38、ge not more than 2 percent for capacitor values 5 pF. Shall change not more than 0.25 pF for capacitor values 5 pF. d. IR: Not applicable. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z

39、3 DWG NO. 09027 REV PAGE 7 3.10 Life (at elevated ambient temperature). In accordance with MIL-PRF-55681, except: a. Test duration: As specified (see table V). b. Sample size: 20 pieces per production lot. c. Capacitance change: Shall change not more than 2 percent for capacitor values 5 pF. Shall c

40、hange not more than 0.25 pF for capacitor values 5 pF. d. DF: 0.3 percent. e. IR: Not applicable. 3.11 Marking. As a minimum, marking shall be on the package due to the small size of the chips. The package marking shall be in accordance with MIL-STD-1285, except the PIN shall be as specified in 1.2

41、with manufacturers name or CAGE code and date code. The manufacturer may, at their option, mark some information on the chips. 3.12 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-55681 Qualified Products List for at

42、 least one part, or perform the group A and group C inspections specified herein on a sample of parts agreed upon by the manufacturer and DLA Land and Maritime-VA. 3.13 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of

43、supply. 3.14 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically ad

44、vantageous life cycle costs. 3.15 Workmanship. In accordance with MIL-PRF-55681. 4. VERIFICATION 4.1 Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection. Qualification inspection is not required. b. Conformance inspection

45、 (see 4.2). 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for delivery shall consist of all tests specified in group A herein (see table VI). When optional group C of MIL-PRF-55681 testing is requested (see table V), the following exceptions shall apply:

46、 a. Terminal strength, series resonance, and moisture resistance are not applicable. b. Thermal shock and immersion shall be replaced by temperature cycling (air to air) herein (see 3.7). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND M

47、ARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 09027 REV PAGE 8 4.2.1.1 Group A inspection. Group A inspection shall consist of the examinations and tests specified in table VI, in the order shown. TABLE VI. Group A inspection. Inspection Requirement paragraph Sampling Procedure Subgroup

48、 1 Voltage conditioning 3.4.2 100 percent Dielectric withstanding voltage (DWV) 3.4.3 Insulation resistance (IR) (+25C) 3.4.4 Capacitance 3.4.5 Dissipation factor (DF) 3.4.6 Subgroup 2 Visual and mechanical examination 3.5 Table VII, 0 failures Subgroup 3 ESR 3.4.7 6 samples, 0 failures Subgroup 4 Solderability 3.6 5 samples, 0 failures 4.2.1.1.1 Subgroup 1 tests. 4.2.1.1.1.1 Sampling plan. Subgroup 1 tests shall be performed on a production lot basis on 100 percent of the product supplied under this drawing. Capacitors failing the tests