DLA DSCC-DWG-85019 REV E-2008 DELAY LINES PROGRAMMABLE 16 PIN COMPATIBLE 3 BIT TTL COMPATIBLE《3比特的可编程活动延迟线 与16 PIN 及3比特的晶体管 晶体管逻辑电路兼容 并与发射器逻辑耦合》.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added suggested source of supply and changed requirements for inspection of product for delivery. 26 Aug 88 Randy Larson B Changed incremental delay for dash number -09 in table I. Editorial changes throughout. 26 Nov 91 R. Gosciniak C Changes in accordance

2、 with NOR 5999-R003-92. 09 Sep 92 D. Moore D Added 3.3.2, 4.1.3, and note 5 to figure 1. Changed 3.3.3, several AC requirements, and step delay for -09 and -10 in table I. Deleted vendor CAGE 56289. Renumbered most of section 3 paragraphs. Editorial changes throughout. 22 Dec 93 D. Moore E Editorial

3、 and boilerplate updates made throughout. 24 Jun 08 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV E E E E E E E E REV STATUS OF PAGES PAGES 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Dan McGrath DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-500

4、0 CHECKED BY Randy Larson APPROVED BY Ivan R. Jones TITLE DELAY LINES, PROGRAMMABLE 16 PIN COMPATIBLE, 3 BIT, TTL COMPATIBLE SIZE A CODE IDENT. NO. 14933 DWG NO. 85019 Original date of drawing 85-06-13 REV E PAGE 1 OF 8 AMSC N/A 5999-E214CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGEN

5、CY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 85019 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV E SHEET 2 1.1 Scope. This drawing describes the r

6、equirements for a family of programmable, 16-pin compatible, 3-bit, TTL compatible delay lines. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 85019 -01 Drawing number Dash number (see table I) 2. APPLICABLE DOCUMENTS 2.1 General. The documents lis

7、ted in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, docum

8、ent users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part

9、of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. FEDERAL SPECIFICATIONS MIL-DTL-31000 - Technical Data Packages, General Specification For. MIL-PRF-83532 - Delay Lines, Active, General Specific

10、ations for. FEDERAL STANDARDS MIL-STD-202 - Test Method Standard, Electronic and Electrical Component Parts. MIL-STD-883 - Test Method Standard, Microcircuits. MIL-STD-1276 - Leads for Electronic Component Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearc

11、h/ or http:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes prec

12、edence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Interface and physical dimensions. 3.2 Drawing precedence. This drawing takes precedence over documents referred to herein and shall be interpreted

13、 in accordance with MIL-DTL-31000. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 85019 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV E SHEET 3 3.3 Materials. 3.3.1 Case material. Case material shall be molde

14、d or encapsulated epoxy and shall be in accordance with MIL-PRF-83532. 3.3.2 Integrated circuits (ICs). ICs shall meet the requirements of MIL-STD-883, level B, as a minimum. 3.3.3 Terminals. Terminals shall be type LR (0.52) G-*C* in accordance with MIL-STD-1276. The use of pure tin plating as an u

15、ndercoat or final finish is prohibited effective 6 months from the date of revision D to this drawing. 3.4 Configuration and dimensions. See figure 1. 3.5 AC requirements. 3.5.1 Total delay time. See table I. 3.5.2 Temperature coefficient of delay. 500 ppm/C +0.5 ns maximum. 3.5.3 Delay tolerance. 1

16、 ns or 5 percent, whichever is greater. 3.5.4 Rise time. Rise time shall be 4 ns maximum. 3.5.5 Input pulse voltage. 3.0 V maximum. 3.5.6 Input pulse spacing. 3 times pulse width. 3.5.7 Inherent delay. 6 2 ns. 3.5.8 Pulse width. 150 percent of maximum delay. 3.5.9 Truth table. See table II. 3.6 DC r

17、equirements. 3.6.1 Supply voltage (VCC). 4.75 to 5.25 V dc. 3.6.2 Logic 1 input current. 30 mA maximum at 3.0 V. 3.6.3 Logic 0 input current. -30 mA maximum at 0.45 V. 3.6.4 Logic 1, VOUT. 2.4 V minimum. 3.6.5 Logic 0, VOUT. 0.4 V maximum. 3.6.6 Logic 1 input voltage. 2.0 V minimum. 3.6.7 Logic 0 in

18、put voltage. 0.8 V maximum. 3.6.8 Output current, low (IOL). 20.0 mA maximum. 3.6.9 Output current, high (IOH). -1.0 mA maximum. 3.6.10 Power current (ICC). 100 mA maximum. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO.

19、85019 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV E SHEET 4 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tolerance is .010 (0.25 mm). 4. Location and shape of standoffs optional. Height shall be as show

20、n. 5. Leads shall be free of case meniscus and other foreign material and shall be solderable for a minimum of .010 inch above the seating plane of the delay line. FIGURE 1. Configuration and dimensions. Inches mm .010 0.25 .012 0.30 .018 0.46 .025 0.64 .030 0.76 .050 1.27 .150 3.81 .250 6.35 .300 7

21、.62 .350 8.89 .360 9.14 .410 10.41 .820 20.83 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 85019 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV E SHEET 5 TABLE I. PINs and delay times. PIN 85019- Incremental

22、 delay per step Total delay 1/ change 01 02 03 04 .5 ns .3 ns 1 ns .4 ns 2 ns .8 ns 3 ns 1.0 ns 3.5 ns 7 ns 14 ns 21 ns 05 06 07 5 ns 1.5 ns 10 ns 1.5 ns 15 ns 1.5 ns 35 ns 70 ns 105 ns 08 09 10 20 ns 1.5 ns 40 ns 2.5 ns 50 ns 3.5 ns 140 ns 280 ns 350 ns 1/ Delay value does not include T0delay. TABL

23、E II. Truth table. Address (bit no.) Enable 3 2 1 Delay out 0 0 0 0 0 0 0 0 0 0 1 1 0 1 0 1 T0T1T2T30 0 0 0 1 1 1 1 1 0 0 1 1 0 1 0 1 T4T5T6T70 1 = High 0 = Low = Dont care T0= Reference or inherent delay of circuit T1to T7= Multiplier of incremental delay Provided by IHSNot for ResaleNo reproductio

24、n or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 85019 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV E SHEET 6 3.7 Environmental requirements. 3.7.1 Thermal shock. Method 107, test condition B-1, MIL-STD-202, 5 minutes at temperature extremes, and in ac

25、cordance with MIL-PRF-83532. 3.7.2 Sealing. As specified in MIL-PRF-83532. 3.7.3 Terminal strength. Method 211, test condition C, MIL-STD-202, and in accordance with MIL-PRF-83532. 3.7.4 Vibration. Method 204, test condition B, MIL-STD-202, and in accordance with MIL-PRF-83532. 3.7.5 Shock. Method 2

26、13, test condition D, MIL-STD-202, and in accordance with MIL-PRF-83532. 3.7.6 Immersion. Method 104, test condition A, MIL-STD-202, and in accordance with MIL-PRF-83532. 3.7.7 Moisture resistance. As specified in MIL-PRF-83532. 3.7.8 Solderability. As specified in MIL-PRF-83532. 3.7.9 Resistance to

27、 solvents. As specified in MIL-PRF-83532. 3.7.10 Operating temperature range. -55C to +125C. 3.7.11 Storage temperature. -65C to +130C. 3.8 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent

28、possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.9 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-83532 Q

29、ualified Product List for at least one part, or perform the Group A and Group B inspections specified herein on a sample of parts agreed upon by the manufacturer and DSCC-VA. 3.10 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved

30、 source of supply. 3.11 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.12 Mar

31、king. Marking shall be in accordance with MIL-PRF-83532, except that the PIN shall be as specified in 1.2. 3.13 Workmanship. Parts shall be free of flash pits, voids, and excessive mold marks. A Visible parting line is acceptable. 4. QUALITY ASSURANCE PROVISIONS 4.1. Sampling and inspection. Unless

32、otherwise specified, sampling and inspection procedures shall be performed in accordance with the group A inspection for level A of MIL-PRF-83532. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 85019 DEFENSE ELECTRONICS

33、SUPPLY CENTER DAYTON, OHIO SIZE A REV E SHEET 7 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to co

34、ntact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is availab

35、le from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES 6.1 Intended use. Devices conforming to this drawing are intended for use when military specifications do not exist and qualified mil

36、itary devices that will perform the required function are not available for OEM application. 6.2 Ordering data. The contract or purchase order should specify the following, as a minimum: a. Complete PIN (see 1.2). b. Requirement for the manufacturer to include one copy of the quality conformance ins

37、pection data with each shipment of parts (if applicable, see 4.1.2 and 6.2c). c. Statement of whether the manufacturer performs the group A inspection or provides certification of compliance with the group A inspection. d. Requirement for the manufacturer to notify the acquiring activity in the even

38、t of a change in the product. e. Requirements for packaging and packing. 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and ca

39、n develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional inform

40、ation on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Users of record. Coordination of this document for future revisions is coordinated only with the approved source(s) of supply and the users of record of this document. Requests to be added as

41、a recorded user of this drawing may be achieved online at mailto:relaydla.mil or if in writing to: Defense Supply Center, Columbus, ATTN: DSCC/VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. 6.5 Approved source(s) of supply. Approved source(s) of su

42、pply are listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained online at mailto:relaydla.mil, or by contacting Defense Supply Center, Columbus, ATTN: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614

43、) 692-4481 or DSN 850-4481. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 85019 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV E SHEET 8 1/ Parts must be purchased to the DSCC PIN to assure that all performan

44、ce requirements and tests are met. Vendor CAGE Vendor name number and address 00222 ESC Electronics Inc. 33 Comac Loop Ronkonkoma, NY 11779-6858 (631) 467-5328 16714 Rhombus Industries, Incorporated 313 N. Birch Street Santa Ana, CA 92701-5263 (714) 898-0960 22519 Data Delay Devices, Incorporated 3

45、Mount Prospect Avenue Clifton, NJ 07013-1915 (973) 773-2299 Similar vendor PINs 1/ PIN 85019- CAGE 00222 CAGE 22519 CAGE 16714 01 SPTT3-05 PDU-138-5 DSP-019-01 02 SPTT3-1 PDU-138-1 DSP-019-02 03 SPTT3-2 PDU-138-2 DSP-019-03 04 SPTT3-3 PDU-138-3 DSP-019-04 05 SPTT3-5 PDU-138-5 DSP-019-05 06 SPTT3-10 PDU-138-10 DSP-019-06 07 SPTT3-15 PDU-138-15 DSP-019-07 08 SPTT3-20 PDU-138-20 DSP-019-08 09 SPTT3-40 PDU-138-40 DSP-019-09 10 SPTT3-50 PDU-138-50 DSP-019-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-