DLA DSCC-DWG-88031 REV E-2007 RESISTOR CHIP FIXED FILM 330 WATT STYLE 1505《固定的薄膜片状 330瓦1005型电阻器》.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added new paragraph for resistance. 28 JUL 89 D. Moore B Breakout RTC into specific resistance ranges; power conditioning to allow test parts mounted in a test fixture; change manufacturers part number; editorial changes throughout. 12 OCT 90 D. Moore C Add

2、ed new resistance tolerances, values, and characteristics. Revise to present DoD policy requirements. Editorial changes throughout. 12 JUL 00 Kendall A. CottongimD Extend resistance range of source of supply. Update to present DOD policy requirements. 12 APR 05 Kendall A. Cottongim E Add pure tin pa

3、ragraph. Add new source of supply. Editorial changes throughout. 22 JAN 07 Michael Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Selected item drawing REV STATUS OF PAGES REV

4、 E E E E E E E E E PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Allan R. Knox DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45444-5000 Original date of drawing 4 May 1988 CHECKED BY David W. Withrow TITLE RESISTOR, CHIP, FIXED, FILM, .330 WATT, STYLE 1505 APPROVED BY David E. Moore

5、SIZE A CODE IDENT. NO. 14933 DWG NO. 88031 REV E PAGE 1 OF 9 AMSC N/A 5905-E602 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88031 REV E PAGE 2 1. SCOPE 1.1 Scope. T

6、his drawing describes the requirements for a fixed, film, .330 watt, .150 X .050 chip resistor. 1.2 Part or Identifying Number (PIN) The complete PIN is as follows: 88031 - * * Drawing number Characteristic (see 3.3.6) Resistance and resistance tolerance (see 3.3.1) 2. APPLICABLE DOCUMENTS 2.1 Gover

7、nment documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT O

8、F DEFENSE SPECIFICATIONS MIL-PRF-55342 - Resistor, Fixed, Film, Chip, Nonestablished Reliability, Established Reliability, Space Level, General Specification For. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-790 - Established Relia

9、bility and High Reliability Qualified Product List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps

10、.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this

11、document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specified herein. 3.2 Interface and physical dimensions. The interfac

12、e and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88031 REV E PAGE 3 A B C D E

13、 0.155 0.007 .050 .005 .015/.033 .015 .005 .015 .005 Inches mm .005 0.13 .007 0.18 .015 0.38 .033 0.84 .050 1.27 .155 3.94 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. The pictorial view is representative of the envelope of the item. Slight dev

14、iations from the outline shown, which are contained within the envelope, and do not alter the functional aspect of the device are acceptable. FIGURE 1. Chip resistor. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DA

15、YTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88031 REV E PAGE 4 3.3 Electrical characteristics. 3.3.1 Resistance and resistance tolerance. The nominal resistance expressed in ohms is identified by four characters consisting of three digits and a letter. The letter is used simultaneously as a decim

16、al point, multiplier, and resistance tolerance designator in accordance with MIL-PRF-55342 and herein (see table I). Minimum and maximum resistance values available shall be as specified in 3.3.2, 3.3.6, and 6.6. Resistance values not listed in the “10 to 100“ decade table of MIL-PRF-55342 for the a

17、ppropriate resistance tolerance shall be considered as not conforming to this drawing. The standard values for every decade shall follow the sequence demonstrated for the “10 to 100“ decade table specified in MIL-PRF-55342. TABLE I. Designator of resistance values for resistance tolerances. Designat

18、or for 0.1 percent tolerance Resistance (ohms) 1A00 to 9A88 inclusive 1.00 to 9.88 inclusive 10A0 to 98A8 inclusive 10.0 to 98.8 inclusive 100A to 988A inclusive 100 to 988 inclusive 1B00 to 9B88 inclusive 1,000 to 9880 inclusive 10B0 to 98B8 inclusive 10,000 to 98800 inclusive 100B to 988B inclusiv

19、e 100,000 to 988,000 inclusive 1C00 to 9C88 inclusive 1,000,000 to 9,880,000 inclusive 10C0 10,000,000Designator for 1.0 percent tolerance Resistance (ohms) 1D00 to 9D88 inclusive 1.00 to 9.76 inclusive 10D0 to 98D8 inclusive 10.0 to 97.6 inclusive 100D to 988D inclusive 100 to 976 inclusive 1E00 to

20、 9E88 inclusive 1,000 to 9760 inclusive 10E0 to 98E8 inclusive 10,000 to 97600 inclusive 100E to 988E inclusive 100,000 to 976,000 inclusive 1F00 to 9F88 inclusive 1,000,000 to 9,760,000 inclusive 10F0 10,000,000Designator for 5.0 percent tolerance Resistance (ohms) 1J00 to 9J88 inclusive 1.00 to 9.

21、10 inclusive 10J0 to 98J8 inclusive 10.0 to 91.0 inclusive 100J to 988J inclusive 100 to 910 inclusive 1K00 to 9K88 inclusive 1,000 to 9100 inclusive 10K0 to 98K8 inclusive 10,000 to 91000 inclusive 100K to 988K inclusive 100,000 to 910,000 inclusive 1L00 to 9L88 inclusive 1,000,000 to 9,100,000 inc

22、lusive 10L0 10,000,0003.3.2 Resistance range. The resistance range shall be from 1 ohm to 10 megohms. 3.3.3 Resistance tolerances. The resistance tolerances for chip resistors shall be 0.1 percent, 1 percent, and 5 percent in accordance with MIL-PRF-55342 and table I herein. 3.3.4 Power rating. The

23、power rating for chip resistors shall be 0.330 watt at +70C derated to zero power at +150C (see figure 2). 3.3.5 Voltage rating. The maximum continuous working voltage shall not exceed 100 volts. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENS

24、E ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88031 REV E PAGE 5 3.3.6 Resistance temperature coefficient. The resistance temperature coefficient shall be in accordance with MIL-PRF-55342 and not exceed the values specified below: Characteristic Resistance range Resista

25、nce tolerance E and H 100 ohms thru 1.5 megohm 0.1 percent E and H 10 ohms thru 1.5 megohm 1.0 percent K and M 1 ohm thru 10 megohms 1.0 percent K and M 1 ohm thru 10 megohms 5.0 percent 3.3.7 Termination. Termination material shall be in accordance with MIL-PRF-55342, code letter B. 3.3.7.1 Pure ti

26、n. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.4). 3.3.8 DC resistance. When resistors are

27、 tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.3.9 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence of mechanical damage. 3.3.10 Power conditioning. When resistors are tested as specified in

28、4.8, there shall be no evidence of mechanical damage. The change in resistance between initial and final measurements shall not exceed (0.5 percent 0.01 ohm). 3.3.11 Solderability. When resistors are tested as specified in 4.9, they shall meet the criteria for surface mount leadless components in th

29、e test method. FIGURE 2. Derating curve. 3.4 Marking. Marking of the individual chip resistors is not required; however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government Entity (CA

30、GE) code, and date lot codes. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88031 REV E PAGE 6 3.5 Recycled, recovered, or environmentally preferable materials. Recyc

31、led, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.6 Certificate of compliance. A certificate of com

32、pliance shall be required from manufacturers requesting to be a suggested source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance prog

33、ram specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 is n

34、ot applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of the groups A and B inspections. 4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table II, and shall b

35、e made on the same set of sample units, in the order shown. 4.4.1.1.1 Subgroup 1. Subgroup I tests shall be performed on a production lot basis on 100 percent of the product supplied under this document. Resistors that are out of resistance tolerance, or which experience a change in resistance great

36、er than that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnished on contracts. 4.4.1.1.2 Subgroup 2. Subgroup II tests shall be performed on an i

37、nspection lot basis. A sample of 13 parts shall be randomly selected; if one or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and sha

38、ll not be supplied against the document. 4.4.1.1.3 Subgroup 3. Subgroup 3 tests shall be performed as specified in MIL-PRF-55342. 4.4.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342. 4.4.2.1 Certification. The acquiring activity, at its discretion, may accept a cer

39、tificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicable

40、requirements of MIL-PRF-55342. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88031 REV E PAGE 7 TABLE II. Group A inspection. Inspection Requirement Method Sampling p

41、rocedure Subgroup 1 DC resistance Thermal shock Power conditioning DC resistance 3.3.8 3.3.9 3.3.10 3.3.8 4.6 4.7 4.8 4.6 100 percent Subgroup 2 Visual inspection 3.2, 3.4, 3.7 4.5 13 samples, 0 failures Subgroup 3 Solderability 3.3.11 4.9 See 4.4.1.1.3 4.6 DC resistance. DC resistance shall be test

42、ed in accordance with MIL-PRF-55342. 4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. The following details and exceptions shall apply: a. Method of mounting: Chip resist

43、or sample units shall be mounted on a test fixture. b. Test temperature: +70C 5C. c. Operating conditions: Rated dc continuous working voltage or filtered full wave rectified ac voltage shall be applied intermittently, 1.5 hours “on”, and 0.5 hour “off”, for the applicable number of hours and applic

44、able test temperature. “On time“ shall be three quarters of the total elapsed time. During the “on“ cycle, the voltage shall be regulated and controlled to maintain 5 percent of the rated continuous working voltage. d. Duration: 100 hours 4 hours. e. Stabilization and final dc resistance measurement

45、: Resistors shall be removed from chambers for a minimum of 45 minutes and stabilized prior to final resistance measurement. f. Examination after test: Resistors shall be examined for evidence of mechanical damage. 4.9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342. 5.

46、 PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascert

47、ain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defen

48、se Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88031 REV E

49、PAGE 8 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended. Resistors are also for use in surface mount applications. 6.2 Order