DLA DSCC-DWG-88034 REV J-2006 RESISTOR FIXED FILM CHIP LOW VALUES HIGH POWER STYLE 2512《固定的薄膜片状低压高功率2512型电阻器》.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add new paragraph on resistance. Editorial changes throughout. 31 Jul 1989 D. Moore B Revise 3.3.6 to include ranges for resistance temperature coefficient. Revise 4.8 to include provisions for test fixturing. 10 Jan 1990 D. Moore C Revise 3.3.5 to reflect

2、new voltage rating. Editorial changes throughout. 12 Jun 1990 D. Moore D Add new characteristic E. Revise 3.3.4 to reflect new power ratings. Revise 3.3.6 to list characteristic E. Add new vendor, similar PIN. Editorial changes throughout. 26 Feb 1992 D. Moore E Revise 3.3.5 voltage rating to 200 vo

3、lts. Dimensional change. Editorial changes throughout. 13 Feb 1995 Edward Back F Add new source of supply. Add resistance tolerance 0.1 percent and 5.0 percent. Dimension changes in accordance with MIL-PRF-55342/9. Editorial corrections throughout. 5 Apr 1999 James A. Crum G Extend minimum resistanc

4、e value to 1 ohm for characteristic K however, each unit package shall be marked in accordance with MIL-STD-1285 and include the PIN as specified herein (see 1.2), the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. 3.5 Recycled, recovered, or environmentally

5、preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.6 Certificate of compl

6、iance. A certificate of compliance shall be required from manufacturers requesting to be a suggested source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproduction o

7、r networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88034 REV J PAGE 6 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-7

8、90 is not applicable to this document. 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspecti

9、on of product for delivery. Inspection of product for delivery shall consist of the groups A and B inspections. 4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table II, and shall be made on the same set of sample units, in the order shown. 4.4.1.1.1 Subg

10、roup 1. Subgroup I tests shall be performed on a production lot basis on 100 percent of the product supplied under this document. Resistors that are out of resistance tolerance, or which experience a change in resistance greater than that permitted for the tests of this subgroup shall be removed fro

11、m the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnished on contracts. 4.4.1.1.2 Subgroup 2. Subgroup II tests shall be performed on an inspection lot basis. A sample of 13 parts shall be randomly selected; if o

12、ne or more defects are found, the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against the document. 4.4.1.1.3 Subgroup 3. Subgroup 3

13、tests shall be performed as specified in MIL-PRF-55342. 4.4.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342 except subgroup 1 and subgroup 2 tests shall be performed on ceramic boards. 4.4.2.1 Certification. The acquiring activity, at its discretion, may accept a c

14、ertificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with the applicabl

15、e requirements of MIL-PRF-55342. TABLE II. Group A inspection. Inspection Requirement Method Sampling procedure Subgroup 1 DC resistance Thermal shock Power conditioning DC resistance 3.3.9 3.3.10 3.3.11 3.3.9 4.6 4.7 4.8 4.6 100 percent Subgroup 2 Visual inspection 3.2, 3.4, 3.7 4.5 13 samples, 0 f

16、ailures Subgroup 3 Solderability 3.3.12 4.9 See 4.4.1.1.3 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88034 REV J PAGE 7 4.6 DC resistance. DC resistance shall be t

17、ested in accordance with MIL-PRF-55342. 4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. The following details and exceptions shall apply: a. Method of mounting: Chip res

18、istor sample units shall be mounted on a test fixture. b. Test temperature: +70C 5C. c. Initial resistance measurement of mounted resistors: Initial dc resistance measurement shall be measured at +25C. d. Operating conditions: Rated dc continuous working voltage or filtered full wave rectified ac vo

19、ltage shall be applied intermittently, 1.5 hours “on”, and 0.5 hour “off”, for the applicable number of hours and applicable test temperature. “On time“ shall be three quarters of the total elapsed time. During the “on“ cycle, the voltage shall be regulated and controlled to maintain 5 percent of th

20、e rated continuous working voltage. e. Duration: 100 hours 4 hours. f. Stabilization and final dc resistance measurement: Resistors shall be removed from chambers for a minimum of 45 minutes and stabilized prior to final resistance measurement. g. Examination after test: Resistors shall be examined

21、for evidence of mechanical damage. 4.9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be perform

22、ed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain requisite requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the

23、Military Services System Command. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory n

24、ature which may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended. Resistors are also for use in surface mount applications. 6.2 Ordering data. The contract or purchase order should specify the fol

25、lowing: a. Complete PIN (see 1.2). b. Requirements for delivery and one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. d. Whether the manufa

26、cturer performs the group B tests or provides certification of compliance with group B requirements. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88034 REV J PAGE 8

27、6.3 PIN supersession. PINs of revision E of this document have been superseded by a new PIN in revision F that includes a combination resistance value and resistance tolerance in accordance with MIL-PRF-55342 and herein. 6.4 Electrostatic charge. Under several combinations of conditions, these resis

28、tors can be electrically damaged, by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping resistors. Direct shipment to the Government is controlled by MIL-DTL-39032 which specifies a preventive packaging procedure. 6.5 Short Time Over

29、load Test. The short time overload test in Group B inspection of MIL-PRF-55342 is to be performed on ceramic boards. See DSCC drawing 04032 for compliance to current revision of MIL-PRF-55342. 6.6 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit ti

30、n whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of

31、tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.7 User of record. Coordination of this document for future revisions is co

32、ordinated only with the suggested source of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at resistordla.mil or in writing to: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or D

33、SN 850-0552. 6.8 Suggested source of supply. Suggested source of supply is listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained online at resistordla.mil or contact DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or b

34、y telephone (614) 692-0552 or DSN 850-0552. DSCC drawing PIN 88034-* Vendor similar designation or type number 1/ Vendor CAGE Vendor name and address Characteristics: K and M, resistance values: 1 ohm through 15 megohms, resistance tolerance: 1 and 5 percent. J1500-*F J1500-*J 50316 MINI-SYSTEMS, IN

35、C. 20 David Road N. Attleboro, MA 02761-0069 Characteristics: E, H, K, and M, resistance values: 1 ohm through 15 megohms, resistance tolerance: 0.1, 1.0, and 5.0 pct. as specified (see 3.3.6). H2512CPX* (DEC034) H2512CA* (DEC034) 56235 State of the Art, Inc. 2470 Foxhill Road State College, PA 16803-1797 1/ Parts must be purchased to this DSCC PIN to assure that all performance requirements and tests are met. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-