DLA DSCC-DWG-89100 REV B-2002 SEMICONDUCTOR DEVICE POWER SWITCHING REGULATOR ASSEMBLY《固定薄膜片状法兰安装单路TAB高功率10瓦特半导体器件》.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Revise drawing, update sources. 29 September 2000 Monica Poelking B Supplier/address/CAGE change and reformat document 23 May 2002 Thomas M. Hess PREVIOUS CAGE CODE 14933 SUPERSEDED BY 037Z3 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. Prepare

2、d in accordance with MIL-STD-100 Selected item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B A B B B A A A A A A A A A B PAGES 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PMIC N/A PREPARED BY Roger Kissel DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH http:/www.dscc.dla.mil/programs/milspec/docsear

3、ch.asp Original date of drawing CHECKED BY Alan Barone 19 December 1989 APPROVED BY David E. Moore TITLE SEMICONDUCTOR DEVICE, POWER SWITCHING REGULATOR ASSEMBLY SIZE A CODE IDENT. NO. 037Z3 DWG NO. 89100 REV B PAGE 1 OF 16 AMSC N/A 5961-E067 DISTRIBUTION STATEMENT A. Approved for public release; di

4、stribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for power switch

5、ing regulator semiconductor assembly. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as follows: 89100 - 01 TXV | | | | | |_ Drawing Device type Quality level number (see 1.2.1) (see 1.2.1) 1.2.1 Device types. The device types shall identify the polarity and voltage of the devices a

6、s follows: The TX and TXV suffix relates to the JANTX and JANTXV level requirements of MIL-PRF-19500. Device type Quality level Description Figure number 01 TX, TXV 5 A, 60 V, positive 1 (similar to TO-66) 02 TX, TXV 5 A, 80 V, positive 1 (similar to TO-66) 03 TX, TXV 5 A, 100 V, positive 1 (similar

7、 to TO-66) 04 TX, TXV 5 A, 60 V, negative 1 (similar to TO-66) 05 TX, TXV 5 A, 80 V, negative 1 (similar to TO-66) 06 TX, TXV 5 A, 100 V, negative 1 (similar to TO-66) 1.3 Maximum ratings. TC = +25C (unless otherwise noted). Type V 4-1 (input voltage) V 1-2 (output voltage) V 3-4 (Drive input revers

8、e voltage) I 1 (1) (continuous output current) I 3 (drive current) RJC RCA TJ TSTG 01 02 03 04 05 06 V 60 80 100 -60 -80 -100 V 60 80 100 -60 -80 -100 V 5 5 5 -5 -5 -5 A 5 5 5 -5 -5 -5 A -0.2 -0.2 -0.2 0.2 0.2 0.2 C/W 4 4 4 4 4 4 C/W 60 60 60 60 60 60 C -55 to +125 -55 to +125 -55 to +125 -55 to +12

9、5 -55 to +125 -55 to +125 C -65 to +150 -65 to +150 -65 to +150 -65 to +150 -65 to +150 -65 to +150 (1) Applies to TC = +25C, derate 1% per C above TC of +25C. 1.4 Primary electrical characteristics. See table II, group A inspection, for the primary electrical characteristics. 2. APPLICABLE DOCUMENT

10、S 2.1 Government documents. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV A PAGE 3 Dimensions (see notes) Inches Millimeters Inches Millimeters LTR Min Max

11、 Min Max LTR Min Max Min Max A - .620 - 15.75 G - .350 - 8.89 B .050 .075 1.27 1.90 H .570 .590 14.48 14.99 C .028 .034 0.71 0.86 J .142 .152 3.61 3.86 D .958 .962 24.33 24.43 K .360 - 9.14 - E .190 .210 4.83 5.33 L .250 .340 6.35 8.64 F .190 .210 4.83 5.33 Notes: 1. Dimensions are in inches. 2. Met

12、ric equivalents are given for general information only. 3. Case is electrically isolated. 4. Leads may be soldered to within .062 (1.57) of base provided temperature-time exposure is 10 minutes Test condition H Test condition C See table I (omit deltas) Subgroup 3 Steady-state operational life Elect

13、rical tests 1027 340 hours minimum, circuit and conditions as specified on figure 3, TA = +25C See table I (omit deltas) Subgroup 4 De-cap internal visual (design verification) Bond strength 2075 2037 Visual criteria in accordance with qualified design The sample shall be a minimum of 3 devices and

14、shall include all wire sizes. Subgroup 5 Thermal resistance 4081 RJC of the diode (4C/W max) Subgroup 6 High-temperature life (non-operating) Electrical tests 1032 340 hours minimum, TA = +150C See table I (omit deltas) 1/ For sampling plan, see MIL-PRF-19500. Provided by IHSNot for ResaleNo reprodu

15、ction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV A PAGE 10 TABLE IV. Group C inspection. MIL-STD-750 Inspection 1/ Method Conditions Subgroup 1 Physical dimensions 2066 Dimensions as specified on f

16、igure 1 Subgroup 2 Thermal Shock Terminal strength Hermetic seal Fine leak Gross leak Moisture resistance Electrical end-points 1056 2036 1071 1021 Test condition B Test condition A, weight = 3 pounds, time = 15 s Test condition H Test condition C Omit initial conditioning See table I (omit deltas)

17、Subgroup 3 Shock Vibration variable frequency Constant acceleration Electrical tests 2016 2056 2006 Non-operating, 1500 Gs, 0.5 ms, 5 blows in each orientation (X1, Y1, Z1) 1 minute in each orientation, X1, Y1 at 10,000 G minimum See table I (omit deltas) Subgroup 4 Salt atmosphere (corrosion) 1041

18、Subgroup 5 Not applicable Subgroup 6 Steady-state operational life Electrical tests 1026 1000 hours, circuit and conditions as specified on figure 3, TA = +25C See table I (omit deltas) 1/ For sampling plan, see MIL-PRF-19500. Provided by IHSNot for ResaleNo reproduction or networking permitted with

19、out license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV A PAGE 11 TABLE V. Group E inspection for initial design verification. MIL-STD-750 Inspection Method Conditions Sample plan Subgroup 1 Thermal shock (temperature cycling) Hermetic se

20、al Electrical tests 1051 1071 No dwell time is required at +25C, test condition C, except T = -55C to +150C, (1000 cycles including screening), textreme 10 minutes See table I (omit deltas) 22 devices c = 0 Subgroup 2 Steady-state dc blocking life Electrical end-points 1027 1,000 hours, circuit and

21、conditions as specified on figure 2, TA = +125C See table I (omit deltas) 22 devices c = 0 Subgroup 3 Destructive physical analysis Visual criteria in accordance with design 3 devices c = 0 Subgroups 4, 5, and 6 Not applicable Provided by IHSNot for ResaleNo reproduction or networking permitted with

22、out license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV A PAGE 12 Note: Test circuits and conditions for 04, -05, and 06 are identical but of opposite polarity. FIGURE 2. High temperature reverse bias circuit. Provided by IHSNot for Resal

23、eNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV A PAGE 13 Note: No heat sink allowed. TA must be controlled to prevent thermal runaway. FIGURE 3. Burn-in circuit. Provided by IHSNot for

24、 ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV A PAGE 14 NOTE: Test circuit and conditions for 04, -05, and 06 are identical but of opposite polarity VIN = -25 V, VOUT = -5 V. FI

25、GURE 4. Switching speed circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV A PAGE 15 NOTES: 1. Adjust TON to obtain specified IOUT. 2. Negative output

26、test circuits and waveforms are identical but have opposite polarity. Component values Dash numbers R3L L H C F RL IOUT A -01, -04 3000 300 100 2.5 2 -02, -05 4000 300 100 2.5 2 -03, -06 5000 300 100 2.5 2 FIGURE 5. Reverse bias clamped inductive test circuit and conditions. Provided by IHSNot for R

27、esaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 89100 REV B PAGE 16 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or o

28、rder (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity within the

29、 Military Department or Defense Agency, or within the Military Departments System Command. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This s

30、ection contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Power switching regulator assemblies conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perfor

31、m the required function are not available for the OEM application. This drawing is intended exclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When a military specification exists and the product covered by this drawing has been qu

32、alified for listing on QML-19500, this drawing will be inactivated and will not be used for new design. The QML-19500 product shall be the preferred item for all applications. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2.1). b. Requirements

33、 for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for packaging and packing. 6.3 Users of record. Coordination of this document for future revisions

34、are coordinated only with the suggested sources of supply and the users of record of this document. Requests to be added as a recorded user of this drawing should be in writing to: Defense Supply Center, Columbus, ATTN: DSCC/VAC, Post Office Box 3990, Columbus, OH 43216-5000 or by telephone (614) 69

35、2-0510 or DSN 850-0510. 6.4 Suggested source of supply. A suggested source of supply is listed herein. Additional sources will be added as they become available. The vendor listed herein has agreed to this drawing and has submitted a certificate of compliance (see 3.6 herein) to DSCC-VAC. DSCC drawi

36、ng PIN (1) Vendor similar PIN Vendor CAGE Vendor name and address 89100-01TX, TXV 89100-02TX, TXV 89100-03TX, TXV 89100-04TX, TXV 89100-05TX, TXV 89100-06TX, TXV PIC600 PIC601 PIC602 PIC610 PIC611 PIC612 43611 43611 43611 43611 43611 43611 Microsemi NES 6 Lake Street Lawrence, MA 01841-3011 (1) Parts must be purchased to this DSCC PIN to assure that all performance requirements are met. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-