DLA DSCC-DWG-94022 REV G-2000 SEMICONDUCTOR DEVICE DIODE STANDARD RECOVERY《标准恢复二极管半导体器件》.pdf

1、LTR ake changes to 4.2,4.3.2, and table II. DESCRIPTION DATE APPROVED PREVIOUS CAGE CODE 14933 SUPERSEDED BY 03723. THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. PMIC NIA PreDared in accordance with MIL-STD-100 Selected item drawina PREPARED BY Robert Petty DEFENSE SUPPLY CENTER, COLUMB

2、US COLUMBUS, OH Original date of drawing CHECKED BY Alan Barone TITLE SEMICONDUCTOR DEVICE, DIODE, STANDARD RECOVERY APPROVEDBY Monica Poelking SIZE CODE IDENT. NO. DWG NO. A I REV G I PAGE I OF IO 03723 94022 AMSC NIA DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

3、 5905-E246 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1. SCOPE I FSM 1 .I Scope. This drawing describes the requirements for standard recovery rectifiers. lo 1.2 Part or Identifvinq Number (PIN). The complete PIN shall be as follows: RNL X94022-

4、O1 XV I I TOP Device type (see 1.2.1) Drawing number L = ,375 1.2.1 Device tvpes. The device type(s) identify the lead length and voltage of the devices as follows: and Device tvpe 94022-01 TXV 94022-1 1 TX 94022-02TXV 94022-1 2TX 94022-03TXV 94022-1 3TX 94022-04TXV 94022-1 4TX inches Fiqure number

5、1 1 1 1 1 1 1 1 TSTG Packaqes Axial lead Axial lead Axial lead Axial lead Axial lead Axial lead Axial lead Axial lead CODE IDENT NO. 03723 1.3 Maximum ratinq. I DWG NO. 94022 VRWM I L = ,375 inches A(PK) 375 375 200 200 375 375 300 300 A(PK) 375 375 94022-01 94022-1 1 94022-04 94022-1 4 94022-02 940

6、22-1 2 94022-03 94022-1 3 500 500 600 600 800 800 1,000 1,000 20 20 20 20 20 20 20 20 1.4 Primarv electrical characteristics. Unless otherwise specified, primary electrical characteristics at TL = +25“C. I R2 VR = rated VRWM TA = +I 00C - mA 0.5 0.1 01 IA 10 3 3 um 1 .O5 1 .O5 1.10 1.10 1.15 1.15 1.

7、15 1.15 um 2.5 2.5 um 1.15 1.15 1.20 1.20 1.25 1.25 1.25 1.25 um E 5 5 5 5 5 5 2.8 5 2.8 5 94022-01 94022-1 1 94022-02 94022-1 2 94022-03 94022-1 3 94022-04 94022-1 4 DEFENSE SUPPLY CENTER, COLUMBUS I COLUMBUS, OHIO SIZE A REV G I PAGE 2 I Provided by IHSNot for ResaleNo reproduction or networking p

8、ermitted without license from IHS-,-,-2. APPLICABLE DOCUMENTS DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 2.1 Government documents. SIZE CODE IDENT NO. DWG NO. A 03723 94022 REV G PAGE 3 2.1 .I Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

9、 part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation (see 6.2). SPEC IF I CAT I ON D

10、EPARTMENT OF DEFENSE MIL-PRF-19500 - Semiconductor Devices, General Specification for. STANDARD DEPARTMENT OF DEFENSE MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Defe

11、nse Automated Printing Service, Building 4D (DPM-DODSSP), 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, how

12、ever, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Interface and phvsical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-19500. Package dimensions shall be in accordance with figure 1 herein. 3.1 .I.

13、 Lead material and finish. Lead material shall be copper. Lead finish shall be hot solder dip. Where a choice of lead finish is desired, it shall be specified in the acquisition document. 3.1.2 Internal construction. Multiple chip construction shall not be permitted. 3.2. Abbreviations, svmbol, and

14、definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500. 3.3 Recvcled, recovered, or environmentallv preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the mate

15、rial meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.4. Markinq. Marking shall be in accordance with MIL-PRF-19500. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Symbol Inche

16、s Min Max BL 94022-01, -1 1, -02, -12, -03, -13 (94022-04, -14) Millimeters Min Max BD 94022-01, -1 1, -02, -12, -03, -13 (94022-04, -14) PD 94022-01, -1 1, -02, -12, -03, -13 (94022-04, -14) LD ECT 1 .o0 B 94022-01, -1 1, -02, -12, -03, -13 (94022-04, -14) 0.19 4.83 25.4 i-Ec1 0.215 Dimensions 0.22

17、 5.59 0.235 5.46 5.97 0.12 0.057 .O01 0.2 o.12 I 0.14 3.05 3.55 0.063 1.45 1.60 .O25 5.08 I 3.05 I DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 03723 94022 REV G PAGE 4 I 0.37 I 9.40 NOTES: 1. Cathode is marked with a contrasting color band, or three dots spaced 120“

18、apart. 2. B is the dimension of the ceramic only, except for 94022-04, -14 where it designates the glass sleeve. FIGURE 1. Semiconductor device, diode all tvpes. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3.5 Manufacturer eliqibility. To be elig

19、ible to supply devices to this drawing, the manufacturer shall have an approved facility in accordance with MIL-PRF-19500 for at least one line and at least one qualified JAN device listed on QPL-19500. In addition, all devices specified herein shall meet all requirements of MIL-PRF-19500 except qua

20、lification requirements. It is prohibited for a manufacturer not listed on the DESC drawing approval bulletin to mark devices with this drawing number. appendix E MIL-PRF-19500) - 11 3 3.6. Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be a

21、 suggested source of supply. TX and TXV levels MIL-STD-750, method 3101 (see 4.4.3 herein) 3.7 Submission of certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in 6.5 herein. The certificate of compliance

22、 submitted of DSCC-VAC, prior to listing as an approved source of supply shall state that the manufacturers product meets the requirements of MIL-PRF-19500 and the requirements herein. 9 10 11 12 - 2/31 13 3.8 Workmanship. The semiconductor shall be uniform in quality and free from any defects that

23、will affect life, serviceability, or appearance. Not applicable Not applicable Subgroup 2 of table I herein and table II herein, steps 1 and 2. MIL-STD-750, method 1038, test condition A, t = 96 hours minimum, TA = +125“C Subgroup 2 of table I herein and table II herein, steps 1 and 2. Scope display

24、 in accordance with method 4023 of MIL-STD-750. 4. VERIFICATION DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 4.1 Samplinq and inspection. Unless otherwise specified, sampling and inspection procedures shall be performed in accordance with MIL-PRF-19500, and as specified herein. SIZE CODE IDENT NO.

25、 DWG NO. A 03723 94022 REV G PAGE 5 4.2. Screeninq. All devices shall be screened in accordance with, appendix E, table IV of MIL-PRF-19500 (TXV requirements) and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table

26、I herein shall not be acceptable. I Screen (see table IV of I Measurement I - 11 - 21 - 31 Thermal impedance shall be performed anytime after screen 3. Thermal impedance does not have to be repeated. Delta recordings shall be performed within 16 hours after removal of applied voltage in HTRB. Provid

27、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-4.3. Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as specified herein. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 4.3.1. Group A inspection. Group A inspect

28、ion shall be conducted in accordance with the conditions specified for subgroup testing in table I. SIZE CODE IDENT NO. DWG NO. A 03723 94022 REV G PAGE 6 4.3.2. Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for the group testing in table VI b

29、of MIL-PRF-19500. Electrical measurements shall be in accordance with group A, subgroup 2 herein. Subgroup Method Condition B2 B3 B5 B6 4066 1027 3101 1032 IFSM = rated (see 1.3); 10 surges of 8.3 ms for -01, -1 1, -02, -12, -03, -13, device types, each at 1 minute intervals, condition B, IFSM = rat

30、ed (see 1.3); 10 surges of 8.3 ms at 200A, and 10 surges of 300 ps for -04 and -14 device types, each at 1 minute intervals condition B, TA = +25“C TA = +125“C, VR = 80 % VRWM ; t = 340 hours See 4.4.2. TA = +25“C. TA= +175“C. 4.4. Method of inspection. Methods of inspection shall be as specified in

31、 the appropriate tables and as follows. 4.4.1. Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 4.4.2. Thermal resistance. Thermal resistance measurements shall be performed in accordance with method 31 O1 of MIL-STD-750. The maximum limit of Re

32、JL (max) shall be 8.OoC/W and IO.O“C/W for -04 and -14 only. a. lM measurement current: 10 mA. b. IH forward heating current: 30 A minimum, (10A minimum for -04, and -14). c. tH heating time: Thermal equilibrium . d. tMD measurement delay time: 1 O0 - 250 LS. 4.4.3. Thermal impedance (ZBJX). The ZBJ

33、X measurements shall be performed in accordance with MIL-STD-750, method 3101. The maximum limit ZBJX in screening (table IV of MIL-PRF-19500) shall be derived by each vendor by means of process control. When three lot date codes have exhibited control the data from these three lots will be used to

34、establish a fixed screening limit, (not to exceed the group A, subgroup 2 limit). Once a fixed limit has been established, monitor all future sealing lots using a five piece sample from each lot to be plotted on the applicable and R chart. a. lM measurement current: 10 mA. b. IH forward heating curr

35、ent: 30 A minimum, (10A minimum for -04, and -14). c. tH heating time: 10 ms. d. tMD measurement delay time: 1 O0 - 250 PS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE I. Group A inspection. DEFENSE SUPPLY CENTER, COLUMBUS I COLUMBUS, OHIO

36、Inspection 11 SIZE A Subqroup 1 Visual and mechanical inspection CODE IDENT NO. 03723 Subqroup 2 Thermal impedance 94022-01, -1 1, -02, -12, -03, -13 94022-04, -14 I DWG NO. 94022 Reverse current 94022-01, -1 1, -02, -12, -03, -13 94022-04, -14 Fotward voltage 94022-01, -1 1 94022-02, -12 94022-03,

37、-13, -04, -14 Fotward voltage 94022-04, -14 Subqroup 3 High temperature operation Reverse current 94022-01, -1 1, -02, -12, -03, -13 94022-04, -14 Low temperature operation Fotward voltage 94022-01, -1 1 94022-02, -12 94022-03, -13, -04, -14 Subqroup 4 Reverse recovery time Subqroup 5 Not applicable

38、 Method 2071 3101 401 6 401 1 401 1 401 6 401 1 4031 See footnotes at end of table. Conditions See 4.4.3 VR = rated VRWM IF = 20 A (pk) 21 IF = 375 A (pk) 21 TA = +I 00C VR = rated VRWM TA = -55OC IF = 20 A (pk) 21 TA = +25“C; IF = 0.5 A IR = 1 A, IRE= = 0.25 A Symbol ZBJX I RI vF1 vF3 I R2 vF2 trr1

39、 Li Min S Max 0.5 0.7 10 3 1 .O5 1 .I 1.15 2.5 500 1 O0 1.15 1.2 1.25 5.0 Unit “CIW “CIW pA dc pA dc V V pA dc pA dc V PS REV G I PAGE 7 I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE I. Group A inspection - Continued. Inspection I/ Subqroup

40、 6 Surge current Method 4066 Electrical measurements Min Conditions Max Tp = 8.3 ms; (for -01, -1 1, -02, -12, -03, -13, IFSM = rated IFSM; 6 surges minimum 1 surge per minute maximum Tp = 300 ps for -04 and -14) IO = O; VR = O IFSM = rated IFSM; 6 surges minimum 1 surge per minute maximum Subgroup

41、2 herein except thermal impedance 10 = 0; VR = 0 Step 1. 2. - I/ - 21 PW3OOys For sampling plan, see MIL-PRF-19500. Inspection MIL-STD-750 Symbol Limits Unit Method Conditions Min Max Reverse current 401 6 AIR, 100 percent of initial value pA dc or 1 .O PA, which ever is Fotward voltage 401 1 TABLEI

42、I. 0 DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Ita measurements. SIZE CODE IDENT NO. DWG NO. A 03723 94022 REV G PAGE 8 Symbol Unit 5. PACKAGING 5.1 Packaqinq. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of

43、 materiel is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity within the Military Department or Defense Agency,

44、or within the Military Departments System Command. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. Provided by IHSNot for ResaleNo reproduction or networki

45、ng permitted without license from IHS-,-,-6. NOTES DEFENSE SUPPLY CENTER, COLUMBUS I COLUMBUS, OHIO (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) SIZE A 6.1 Intended use. Devices conforming to this drawing are intended for use when

46、 military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. This drawing is intended exclusively to prevent the proliferation of unnecessary duplicate specification, drawings, and stock catalog listings. When a m

47、ilitary specification is created and the product by this drawing has been listed on QPL-19500, this drawing will be inactivated and will not be used for new design. The QPL-19500 product shall be the preferred item for all applications. CODE IDENT NO. 03723 6.2 Orderinq data. The contract or purchas

48、e order should specify the following: I DWG NO. 94022 a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for

49、 packaging and packing. 6.3 Users of record. Coordination of this document for future revisions are coordinated only with the suggested sources of supply and the users of record of this document. Requests to be added as a recorded user of this drawing should be in writing to: Defense Supply Center, Columbus, ATTN: DSCCNAC, Post Office Box 3990, Columbus, OH 43216-5000 or by telephone (614) 692-0510 or DSN 850-0510. 6.4 S