DLA DSCC-DWG-95014 REV C-2009 RESISTOR CHIP FIXED FILM STYLE 0402 [Use ARMY MIL-PRF-55342 11 A (2) ARMY MIL-PRF-55342 11A (1) ARMY MIL-PRF-55342 11A ARMY MIL-PRF-55342 11 (1) ARMY .pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add requirement for solder mounting integrity, paragraph 4.4.1.2. Update document to current DoD policy. 14 May 98 W. E. Sindelar B Five year document review. Update to present DoD policy requirements. 7 Nov 03 Kendall A. Cottongim C Inactivation for new de

2、sign. 11 Oct 09 Michael A. Radecki Notice of Inactivation for New Design DSCC Drawing 95014 is inactive for new design and is no longer used, except for replacement purposes. Use MIL-PRF-55342/11. CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS COLUMB

3、US, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Source control drawing REV STATUS OF PAGES REV C C C C C C C C PAGES 1 2 3 4 5 6 7 8 Original date of drawing: 5 July 1995 PREPARED BY DENNIS L. CROSS DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OH CHECKED BY DENNIS L. CROSS

4、TITLE RESISTOR, CHIP, FIXED, FILM, STYLE 0402 APPROVED BY DAVID E. MOORE SIZE A CODE IDENT. NO. 14933 DWG NO. 95014 REV C PAGE 1 OF 8 AMSC N/A 5905-E705 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZ

5、E A CODE IDENT NO. 14933 DWG NO. 95014 REV C PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a fixed, film, chip resistor, style 0402. 1.2 Part or Identifying Number (PIN). The complete PIN is shown in the following example: 95014 K 1001 F B S Drawing number Characteristic (se

6、e 3.3.1) Resistance value (see 3.3.2) Tolerance (see 3.3.4) Termination material (see 3.3.5) Screening level (see 3.3.6) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. The following specifications and standards form a part of this document to the extent specifi

7、ed herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, General Specification for. DEPART

8、MENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. * (Copies of th

9、ese documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) * 2.2 Order of precedence. Unless otherwise noted herein or in the event of a conflict between the text of this

10、 document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The ind

11、ividual item requirements shall be in accordance with MIL-PRF-55342, and specified herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 95014 REV C PAGE 3 3.2 Interf

12、ace and physical dimensions. The resistor shall meet the interface and physical dimensions as specified in MIL-PRF-55342 and herein (see figure 1). 3.3 Electrical characteristics. 3.3.1 Resistance temperature characteristic. The resistance temperature characteristic shall not exceed the values speci

13、fied below: Characteristic Resistance range K (100 ppm/C) 100 ohms to 100 kilohms M (300 ppm/C) 1 ohm to 10 megohms A B C D E 1.07 +0.20 0.56 +0.13 0.25/0.84 0.25 +0.13 0.25 +0.13 NOTES: 1. Dimensions are in millimeters. 2. Inch equivalents are given for general information only. 3. The pictorial vi

14、ew of the style above does not depict the actual size and is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope, and do not alter the functional aspects of the device are acceptable. FIGURE 1. Chip resistor. mm Inche

15、s 0.13 0.005 0.15 0.006 0.20 0.008 0.25 0.010 0.56 0.022 0.84 0.033 1.04 0.041 1.07 0.042 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 95014 REV C PAGE 4 3.3.2 Resis

16、tance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent significant figures and the last digit specifies the number of zeros to follow. When the value of resistance is less than 100 ohms, or when fractional values of an ohm are required, the let

17、ter “R“ shall be substituted for one of the significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified in 3.3.3. Resistance values not listed in the “10 to 100“ decade table of MIL-PRF-55342 for the appropriate resistance

18、tolerance shall be considered as not conforming to the specification. The standard values for every decade shall follow the sequence demonstrated for the “10 to 100“ decade table specified in MIL-PRF-55342. TABLE I. Resistance value designations. Designation Resistance ohms 1R00 to 9R88 incl. 10R0 t

19、o 98R8 incl. 1000 to 9880 incl. 1001 to 9881 incl. 1002 to 9882 incl. 1003 to 9883 incl. 1004 to 9884 incl. 1.00 to 9.88 incl. 10.0 to 98.8 incl. 100.0 to 988.0 incl. 1,000.0 to 9,880.0 incl. 10,000.0 to 98,800.0 incl. 100,000.0 to 988,000.0 incl. 1,000,000.0 to 9,880,000.0 incl. 3.3.3 Resistance ra

20、nge. The resistance range shall be from 1 ohm to 10 megohms (see 3.3.1). 3.3.4 Resistance tolerance. Resistors are available in resistance tolerances as specified in table II. TABLE II. Resistance tolerance. Symbol Resistance tolerance percent D F G J K +0.5 +1.0 +2.0 +5.0 +10.0 3.3.5 Termination. T

21、ermination material shall be in accordance with MIL-PRF-55342 code letter B. * 3.3.5.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloye

22、d with a minimum of 3 percent lead, by mass (see 6.3). 3.3.6 Screening level. Resistors are available screened (S) or partially screened (P) as specified in 4.4.1.1.1.1, 4.4.1.1.1.2, and table III herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

23、-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 95014 REV C PAGE 5 3.3.7 Power rating. The power rating for chip resistors shall be 50 milliwatts at +70C derated to zero power at +150C (see figure 2). FIGURE 2. Derating curve. 3.3.8 Voltage rating. The maximum co

24、ntinuous working voltage shall not exceed 30 volts. 3.3.9 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.3.10 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence

25、 of mechanical damage. 3.3.11 Power conditioning. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The change in resistance between initial and final measurements shall not exceed (0.5 percent +0.01 ohm). 3.3.12 Solderability. The requirements for solde

26、rability shall be as specified in MIL-PRF-55342 and 4.4.1.1.3 herein. 3.4 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operation

27、al and maintenance requirements, and promotes economically advantageous life cycle costs. * 3.5 Marking. Marking is not required on the resistor; however, each unit package shall be marked with the PIN assigned herein (see 1.2), manufacturers identification code and date and lot codes. * 3.6 Manufac

28、turer eligibility. To be eligible for listing as a approved source of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Products List for at least one part, or perform the group A and group B inspections specified herein on a sample agreed upon by the manufacturer and DSCC-VA. *

29、3.6.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed as an approved source of supply. 3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or appearance. 4. VERIFIC

30、ATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY

31、CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 95014 REV C PAGE 6 4.2 Qualification inspection. Qualification inspection is not applicable to this document. 4.3 Failure rate qualification. The failure rate qualification specified in MIL-PRF-55342 is not applicable to this document. 4.4 Conf

32、ormance inspection. 4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of groups A and B inspections. 4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table III, and shall be made on the same set of sample units, in

33、the order shown. Part per million testing and verification as specified in MIL-PRF-55342 is not applicable to this document. 4.4.1.1.1 Subgroup I. 4.4.1.1.1.1 Screened (S). Screened (S) tests shall be performed on 100 percent of the product supplied under this document. Resistors that are out of res

34、istance tolerance, or which experience a change in resistance greater than that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnished on contracts.

35、 4.4.1.1.1.2 Partially screened (P). Partially screened (P) tests shall be as specified in 4.4.1.1.1.1 except only the 100 percent dc resistance test shall be performed. 4.4.1.1.2 Subgroup II. A sample of 13 parts shall be randomly selected, if one or more defects are found, the lot shall be rescree

36、ned and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected and shall not be supplied against this document. 4.4.1.1.3 Subgroup III. A sample of five parts shall be randomly selected, if one or m

37、ore defects are found, the lot shall be rejected/rescreened in accordance with MIL-PRF-55342. TABLE III. Group A inspection. Inspection Requirement paragraph Method paragraph Sampling procedure Subgroup I DC resistance Thermal shock Power conditioning DC resistance 3.3.9 3.3.10 3.3.11 3.3.9 4.6 4.7

38、4.8 4.6 100 percent Subgroup II Visual inspection 3.2, 3.5, 3.7 4.5 13 samples, 0 failures Subgroup III Solderability 3.3.12 4.9 5 samples 0 failures Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A

39、 CODE IDENT NO. 14933 DWG NO. 95014 REV C PAGE 7 4.4.1.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342 except that the force applied for Subgroup 2, solder mounting integrity shall be 1 kilogram. 4.4.1.2.1 Certification. The acquiring activity, at its discretion, m

40、ay accept a certificate of compliance with group B requirements in lieu of performing group B tests (see 6.2d). 4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction, physical dimensions, marking, and workmanship are in accordance with

41、the applicable requirements of MIL-PRF-55342. 4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342. 4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342. 4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-S

42、TD-202. The following details and exceptions shall apply: a. Method of mounting: Chip resistors sample units shall be loaded on a test fixture. b. Test temperature: +70C 5C. c. Initial resistance measurement of mounted resistors: Initial dc resistance measurement shall be measured at +25C. d. Operat

43、ing conditions: Rated dc continuous working voltage or filtered, nonfiltered full-wave rectified ac voltage shall be applied intermittently, 1 hour and 30 minutes “on”, and 30 minutes “off”, for the applicable number of hours and applicable test temperature. “On time“ shall be three quarters of the

44、total elapsed time. During the “on“ cycle, the voltage shall be regulated and controlled to maintain 5 percent of the rated continuous working voltage. e. Duration: 100 hours 4 hours. f. Stabilization and final dc resistance measurement: Resistors shall be removed from chambers for a minimum of 45 m

45、inutes and stabilized prior to final resistance measurement. g. Examination after test: Resistors shall be examined for evidence of mechanical damage. 4.9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342 and 4.4.1.1.3 herein. 5. PACKAGING 5.1 Packaging. For acquisition p

46、urposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain requisite requirements. Packaging requi

47、rements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the Military Services System Command. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM

48、 products, or by contacting the responsible packaging activity. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 95014 REV C PAGE 8 6. NOTES (This section contains infor

49、mation of a general or explanatory nature, which may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended, also, for use in surfacing mounting applications. 6.2 Ordering data. The contract or purchase or