DLA DSCC-VID-V62 04604 REV C-2011 MICROCIRCUIT DIGITAL MICROPOWER SUPPLY VOLTAGE SUPERVISORS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add device type 04. Update boilerplate to current requirements. - CFS 06-06-06 Thomas M. Hess B Add case outline Y. - CFS 07-02-22 Thomas M. Hess C Add device type 05 and 06. Update boilerplate to current requirements. - PHN 11-11-29 Thomas M. Hess CURRENT

2、DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV C C C C C C C C C C C C PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Charles F. Saffle D

3、EFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing CHECKED BY Charles F. Saffle TITLE MICROCIRCUIT, DIGITAL, MICROPOWER SUPPLY VOLTAGE SUPERVISORS, MONOLITHIC SILICON YY-MM-DD 03-10-09 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/04604 REV C PAGE

4、 1 OF 12 AMSC N/A 5962-V011-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requiremen

5、ts of a high performance micropower supply voltage supervisors microcircuit, with an operating temperature range of -40C to +125C for device types 01, 02, and 03, and with an operating temperature range of -55C to +125C for device type 04, 05 and 06. 1.2 Vendor Item Drawing Administrative Control Nu

6、mber. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/04604 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1

7、Device types. Device type Generic Circuit function 01 TLC7701-EP Micropower supply voltage supervisor 1/ 02 TLC7705-EP Micropower supply voltage supervisor 1/ 03 TLC7733-EP Micropower supply voltage supervisor 1/ 04 TLC7701-EP Micropower supply voltage supervisor 2/ 05 TLC7705-EP Micropower supply v

8、oltage supervisor 2/ 06 TLC7733-EP Micropower supply voltage supervisor 2/ 1.2.2 Case outlines. The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 8 JEDEC MO-153 Plastic small-outline Y 8 JEDEC MS-012 Plastic small-outline 1.2.3 Lead finishes. The l

9、ead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other _ 1/ Operating temperature range is -40C to +125C. 2/ Operating temperature range is

10、 -55C to +125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage (VDD) . 7.0 V Input voltage rang

11、e (VI), CONTROL, RESIN, SENSE -0.3 V to 7.0 V 2/ Maximum low output current (IOL) . 10 mA Maximum high output current (IOH) -10 mA Input clamp current (IIK) (VIVDD) 10 mA Output clamp current (IOK) (VOVDD). 10 mA Continuous total power dissipation: Case outline X: TA 25C . 525 mW TA= 85C . 273 mW TA

12、= 125C . 105 mW Derating factor above TA= 25C . 4.2 mW/C Case outline Y: TA 25C . 725 mW TA= 85C . 377 mW TA= 125C . 145 mW Derating factor above TA= 25C . 5.8 mW/C Operating free-air temperature range (TA): Device types 01, 02, and 03 . -40C to +125C Device type 04, 05, and 06 . -55C to +125C Stora

13、ge temperature range (TSTG) -65C to +150C 1.4 Recommended operating conditions. Supply voltage range (VDD) . +2.0 V to +6.0 V Input voltage range (VI) . 0.0 V to VDDMinimum high level input voltage at RESIN and CONTROL (VIH) 0.7xVDD3/ Maximum low level input voltage at RESIN and CONTROL (VIL) . 0.2x

14、VDD3/ Maximum high level output current (IOH) (VDD 2.7V) . -2 mA Maximum low level output current (IOL) (VDD 2.7V) . 2 mA Maximum input transition rise and fall rate at RESIN and CONTROL(t/v) 100 ns/V Operating free-air temperature range (TA): Device types 01, 02, and 03 . -40C to +125C Device type

15、04, 05, and 06 -55C to +125C 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions

16、” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltage values are with respect to GND. 3/ To ensure a low supply current, VILshould be kept VDD 0.3 V. Provided by IHSNot for ResaleNo reproduction or networking permitted with

17、out license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 - Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industri

18、es Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 ident

19、ifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics

20、are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1. 3.5.2 Function table. The funct

21、ion table shall be as shown in figure 2. 3.5.3 Functional diagram. The functional diagram shall be as shown in figure 3. 3.5.4 Terminal connections. The terminal connections shall be as shown in figure 4. 3.5.5 Timing waveforms and test circuit. The timing waveforms and test circuit shall be as show

22、n in figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Test conditions u

23、nless otherwise specified 2/ VDDTemperature, TADevice type Limits Unit Min Max High level output voltage VOHIOH= -20 A 2.0 V 3/ All 1.8 V 2.7 V 2.5 4.5 V 4.3 IOH= -2 mA 4.5 V 3.7 Low level output voltage VOLIOL= 20 A 2.0 V 3/ All 0.2 V 2.7 V 0.2 4.5 V 0.2 IOL= 2 mA 4.5 V 0.5 Negative-going input thr

24、eshold voltage, SENSE VIT-4/ 2.0 V to 6.0 V 3/ 01, 04 1.04 1.16 V 02, 05 4.43 4.63 03, 06 2.855 3.03 Hysteresis voltage, SENSE Vhys2.0 V to 6.0 V +25C 01, 04 30 TYP mV 02, 05 70 TYP 03, 06 70 TYP Power-up reset voltage Vres5/ IOL= 20 A 2.0 V to 6.0 V 3/ All 1.0 V Input current IIRESIN VI= 0.0 V to V

25、DD2.0 V to 6.0 V 3/ All 2.0 A CONTROL VI= VDD15.0 SENSE VI= 5.0 V 10.0 SENSE VI= 5.0 V 01 2 Supply current IDDRESIN = VDD, SENSE = VDD VITmax + 0.2 V, CONTROL = 0.0 V, Outputs open 2.0 V to 6.0 V 3/ All 16.0 A Supply current during tdIDD(d)VCT= 0.0 V, RESIN = VDD, SENSE = VDD, CONTROL = 0.0 V, Outpu

26、ts open 5.0 V 3/ All 150 A Input capacitance, SENSE CIVI= 0.0 V to VDD2.0 V to 6.0 V +25C All 50 TYP pF See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO

27、. 16236 DWG NO. V62/04604 REV C PAGE 6 TABLE I. Electrical performance characteristics - Continued. 1/ Test Symbol Test conditions unless otherwise specified 6/ VDDTemperature, TADevice type Limits Unit Min Max Delay time, from VI(SENSE) VIT+to RESET and RESET tdRESIN = 0.7 x VDD, CONTROL = 0.2 x VD

28、D, CT= 100 nF, See figure 5 5.0 V 3/ 01, 02 03 1.1 4.2 ms 04, 05, 06 2.1 TYP Propagation delay time, from SENSE to RESET tPLHVIH= VIT+max + 0.2 V, VIL= VIT-min - 0.2 V, RESIN = 0.7 x VDD, CONTROL = 0.2 x VDD, CT= NC 7/ 5.0 V 3/ All 20.0 s tPHL5.0 Propagation delay time, from SENSE to RESET tPLH5.0 V

29、 3/ All 5.0 s tPHL20.0 Propagation delay time, from RESIN to RESET tPLHVIH= 0.7 x VDD, VIL= 0.2 x VDD, SENSE = VIT+max + 0.2 V, CONTROL = 0.2 x VDD, CT= NC 7/ 5.0 V 3/ All 20.0 s tPHL60.0 ns Propagation delay time, from RESIN to RESET tPLH5.0 V 3/ All 65.0 ns tPHL20.0 s Propagation delay time, from

30、CONTROL to RESET tPLHVIH= 0.7 x VDD, VIL= 0.2 x VDD, SENSE = VIT+max + 0.2 V, RESIN = 0.7 x VDD, CT= NC 7/ 5.0 V 3/ All 58.0 ns tPHL58.0 Low-level minimum pulse duration to switch RESET and RESET, from SENSE VIH= VIT+max + 0.2 V, VIL= VIT-min - 0.2 V 5.0 V 3/ 01, 02, 03 3.0 s 04, 05 ,06 4 Low-level

31、minimum pulse duration to switch RESET and RESET, from RESIN VIH= 0.7 x VDD, VIL= 0.2 x VDD5.0 V 3/ All 1.0 s Rise time, to RESET and RESET tr10% to 90% 5.0 V 3/ All 8.0 TYP ns/V tf90% to 10% 4.0 TYP 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure pr

32、oduct performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and al parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ All cha

33、racteristics are measured with CT= 0.1 F. 3/ TA= -40C to +125C for device types 01, 02, and 03. TA= -55C to +125C for device type 04, 05 and 06. 4/ To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 F) should be connected near the supply terminals. 5/ The lowest supp

34、ly voltage at which RESET becomes active. The symbol Vresis not currently listed within EIA or JEDEC standards for semiconductor symbology. Rise time of VDD 15 s/V. 6/ Switching characteristics are at VDD= 5.0 V, RL= 2 k, CL= 50 pF, and TA= Full Range, unless otherwise noted. 7/ NC = No capacitor, a

35、nd includes up to 100 pF probe and jig capacitance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 7 Case X SEATINGPLANESEEDETAIL AbD1 458E E1AA1

36、e0.25(.010)c0-8LDETAIL AGAGEPLANEM0.10(.004)0.10(.004)Dimensions Symbol Millimeters Inches Symbol Millimeters Inches Min Max Min Max Min Max Min Max A 1.20 0.047 E 4.30 4.50 0.169 0.177 A1 0.05 0.15 0.002 0.006 E1 6.20 6.60 0.244 0.260 b 0.19 0.30 0.007 0.012 e 0.65 NOM 0.026 NOM c 0.15 NOM 0.006 NO

37、M L 0.50 0.75 0.020 0.030 D 2.90 3.10 0.114 0.122 NOTES: 1. This drawing is subject to change without notice. 2. Body dimensions do not include mold flash or protrusion not to exceed 0.15 mm (0.006 inches). 3. Falls within JEDEC MO-153. 4. All linear dimensions are shown in millimeters (inches). Inc

38、hes equivalents are given for general information only. FIGURE 1. Case outlines. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 8 Case Y ebD1 458

39、E E1AA1SEEDETAIL Ac0-8LDETAIL ASEATINGPLANE.010(0.25) MPIN 1INDEX AREAGAUGE.004(0.10)PLANEA2Dimensions Symbol Inches Millimeters Symbol Inches Millimeters Min Max Min Max Min Max Min Max A - 0.069 - 1.27 D 0.189 0.197 4.80 5.00 A1 0.004 0.010 0.10 0.25 E 0.150 0.157 3.80 4.00 A2 0.010 BSC 0.25 BSC E

40、1 0.228 0.244 5.80 6.20 b 0.012 0.020 0.31 0.51 e 0.050 BSC 1.27 BSC c 0.007 0.010 0.17 0.25 L 0.016 0.050 0.40 1.27 NOTES: 1. This drawing is subject to change without notice. 2. Body length does not include mold flash, protrusions, or gate burrs not to exceed 0.006 inches (0.15 mm) per end. Body w

41、idth does not include interlead flash not to exceed 0.017 inches (0.43 mm) per side. 3. Falls within JEDEC MS-012 variation AA. 4. All linear dimensions are shown in inches (millimeters). Millimeters equivalents are given for general information only. FIGURE 1. Case outlines - Continued. Provided by

42、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 9 CONTROL RESIN VI(SENSE)VIT+RESET RESET L L L L H H H H L L H H L L H H False True False True False True Fal

43、se True H H H L* H H H H L L L H* L L L H* * = RESET and RESET states shown are valid for t td. FIGURE 2. Function table. NOTE: 1. Outputs are totem-pole configuration. External pullup or pulldown resistors are not required. 2. Nominal values: R1 (Typ) R2 (Typ) TLC7701 0 TLC7705 910 k 290 k TLC7733

44、750 k 450 k FIGURE 3. Functional diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 10 Device types All Case outlines X and Y Terminal numbe

45、r Terminal symbol 1 CONTROL 2 RESIN 3 CT 4 GND 5 RESET 6 RESET 7 SENSE 8 VDDFIGURE 4. Terminal connections. NOTE: 1. For switching characteristics, RL= 2 k. 2. CL= 50 pF includes jig and probe capacitance. FIGURE 5. Timing waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or n

46、etworking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 11 FIGURE 5. Timing waveforms and test circuit - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr

47、om IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04604 REV C PAGE 12 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance wit