DLA DSCC-VID-V62 04666 REV A-2010 MICROCIRCUIT DIGITAL LOW VOLTAGE CMOS OCTAL BUFFER DRIVER WITH 3-STATE OUTPUTS MONOLITHIC SILICON.pdf

1、 REVISIONSLTR DESCRIPTION DATE APPROVEDA Update boilerplate paragraphs to current requirements. - PHN 10-05-25 Thomas M. Hess Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Charl

2、es F. Saffle DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.milOriginal date of drawing CHECKED BY Charles F. Saffle TITLE MICROCIRCUIT, DIGITAL, LOW VOLTAGE CMOS, OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS, MONOLITHIC SILICON YY-MM-DD 04-03-18 APPROVED BY Thomas M. Hess S

3、IZE A CODE IDENT. NO. 16236 DWG NO. V62/04666 REV PAGE 1 OF 14 AMSC N/A 5962-V051-10 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04666 REV A PAGE 2 1. SCOPE 1

4、.1 Scope. This drawing documents the general requirements of a high performance octal buffer/driver with 3-state outputs microcircuit, with an operating temperature range of -40C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The

5、 vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/04666 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 SN74LV

6、C541A-EP Octal buffer/driver with 3-state outputs 1.2.2 Case outlines. The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 20 MS-013 Plastic small-outlineY 20 MO-153 Plastic small-outline 1.2.3 Lead finishes. The lead finishes are as specified below

7、or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, CO

8、LUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04666 REV A PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V to 6.5 V Input voltage range (VI) . -0.5 V to 6.5 V 2/ Voltage range applied to any output in the high-impedance or power-off state (VO) . -0.5 V to 6

9、.5 V 2/ Voltage range applied to any output in the high or low state (VO) . -0.5 V to VCC+ 0.5 V 2/ 3/ Input clamp current (IIK) (VI 0) -50 mA Output clamp current (IOK) (VO 0) . -50 mA Continuous output current (IO) . 50 mA Continuous current through VCCor GND . 100 mA Package thermal impedance (JA

10、): 4/ X package . 58C/W Y package . 83C/W Storage temperature range (TSTG) . -65C to 150C 5/ 1.4 Recommended operating conditions. 6/ 7/ Supply voltage range (VCC): Operating 2.0 V to 3.6 V Data retention only 1.5 V minimum Minimum high level input voltage (VIH) (VCC= 2.7 V to 3.6 V) . 2.0 V Maximum

11、 low level input voltage (VIL) (VCC= 2.7 V to 3.6 V) 0.8 V Input voltage range (VI) . 0.0 V to 5.5 V Output voltage range (VO): High or low state 0.0 V to VCC3-state . 0.0 V to 5.5 V Maximum high level output current (IOH): VCC= 2.7 V -12 mA VCC= 3.0 V -24 mA Maximum low level output current (IOL):

12、VCC= 2.7 V 12 mA VCC= 3.0 V 24 mA Operating free-air temperature range (TA) -40C to +125C 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions

13、beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are obser

14、ved. 3/ The value of VCCis provided in the recommended operating conditions table. 4/ The package thermal impedance is calculated in accordance with JESD 51-7. 5/ Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall d

15、evice life. 6/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits 7/ All unused inputs of the device must be held at VCCor GND

16、to ensure proper device operation. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04666 REV A PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 - Registered and Standar

17、d Outlines for Semiconductor Devices JEDEC STD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org)

18、 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked

19、 with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimen

20、sion. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1. 3.5.2 Truth table. The truth table shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in

21、 figure 3. 3.5.4 Terminal connections. The terminal connections shall be as shown in figure 4. 3.5.5 Test circuit and timing waveforms. The test circuit and timing waveforms shall be as shown in figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

22、-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04666 REV A PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions Device type : All VCCTemperature, TALimits Unit Min Max High level output voltage VOHIOH= -100 A 2.7 V to 3.6 V 25C,

23、 -40C to 125C VCC 0.2 V IOH= -12 mA 2.7 V 2.2 3.0 V 2.4 IOH= -24 mA 3.0 V 2.2 Low level output voltage VOLIOL= 100 A 2.7 V to 3.6 V 0.2 V IOL= 12 mA 2.7 V 0.4 IOL= 24 mA 3.0 V 0.55 Input current IIVI= 0 to 5.5 V 3.6 V 5 A Three-state output leakage current IOZVO= 0 to 5.5 V 3.6 V 15 A Quiescent supp

24、ly current ICCVI= VCCor GND IO= 0 A 3.6 V 10 A 3.6 V VI 5.5 V 2/ IO= 0 A 10 Quiescent supply current delta ICCOne input at VCC 0.6 V, Other inputs at VCCor GND 2.7 V to 3.6 V 500 A Input capacitance CiVI= VCCor GND 3.3 V 25C 4 TYP pF Output capacitance COVO= VCCor GND 3.3 V 5.5 TYP pF Power dissipat

25、ion capacitance per buffer/driver CpdOutputs enabled f = 10 MHz 2.5 V 58 TYP pF 3.3 V 33 TYP Outputs disabled f = 10 MHz 2.5 V 2 TYP 3.3 V 2 TYP Propagation delay time, A to Y tpd2.7 V 25C, -40C to 125C 5.6 ns 3.3 V 0.3 V 1 5.1 Propagation delay time, output enable, OEnullnullnullnullto Y ten2.7 V 7

26、.5 3.3 V 0.3 V 1 7 Propagation delay time, output disable, OEnullnullnullnullto Y tdis2.7 V 7.7 3.3 V 0.3 V 1 7 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be t

27、ested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ This applies in the disabled state only. Provided by IHSNot for ResaleNo reproduction or netwo

28、rking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04666 REV A PAGE 6 Case X Dimensions Symbol Inches Millimeters Symbol Inches Millimeters Min Max Min Max Min Max Min Max A - 0.069 - 1.75 E 0.150 0.157 3.81 4.00 A1 0.0

29、04 0.010 0.10 0.25 E1 0.228 0.244 5.80 6.20 b 0.014 0.020 0.35 0.51 e 0.050 BSC 1.27 BSC c 0.008 NOM 0.20 NOM L 0.016 0.044 0.40 1.12 D 0.500 0.510 12.70 12.95 NOTES: 1. All linear dimensions are in inches (millimeters). 2. This case outline is subject to change without notice. 3. Body dimensions do

30、 not include mold flash or protrusion, not to exceed 0.006 inches (0.15 mm). 4. Falls within JEDEC MS-013. FIGURE 1. Case outlines. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 1

31、6236 DWG NO. V62/04666 REV A PAGE 7 Case Y Dimensions Symbol Millimeters Inches Symbol Millimeters Inches Min Max Min Max Min Max Min Max A - 1.20 - 0.047 E 4.30 4.50 0.169 0.177 A1 0.05 0.15 0.002 0.006 E1 6.20 6.60 0.244 0.260 b 0.19 0.30 0.007 0.012 e 0.65 BSC 0.026 BSC c 0.15 NOM 0.006 NOM L 0.5

32、0 0.75 0.020 0.030 D 6.40 6.60 0.252 0.260 NOTES: 1. All linear dimensions are in millimeters (inches). 2. This case outline is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion, not to exceed 0.15 millimeters (0.006 in). 4. Fall within JEDEC MO-153. FIGURE

33、 1. Case outlines - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04666 REV A PAGE 8 Inputs Output OE1nullnullnullnullnullnullOE2nullnullnullnullnulln

34、ullA Y L L L L L L H H H X X Z X H X Z H = High voltage level L = Low voltage level X = Immaterial Z = High-impedance state FIGURE 2. Truth table. FIGURE 3. Logic diagram. Device type 01 Case outlines: X and Y Terminal number Terminal symbol Terminal number Terminal symbol 1 OE1nullnullnullnullnulln

35、ull11 Y8 2 A1 12 Y7 3 A2 13 Y6 4 A3 14 Y5 A4 15 Y4 A5 16 Y3 A6 17 Y2 A7 18 Y1 A8 19 OE2nullnullnullnullnullnullGND 20 VCCFIGURE 4. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SI

36、ZE A CODE IDENT NO. 16236 DWG NO. V62/04666 REV A PAGE 9 NOTES: 1. CLincludes probe and jig capacitance. 2. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the

37、output is high except when disabled by the output control. 3. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO= 50 . 4. The outputs are measured one at a time with one input transition per measurement. 5. tPLZand tPHZare the same as tdis. 6. tPZLand tP

38、ZHare the same as ten. 7. tPLHand tPHLare the same as tpd. FIGURE 5. Test circuit and timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04666 REV A

39、 PAGE 10 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging,

40、 and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices

41、are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawin

42、g will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1

43、/ Device manufacturer CAGE code Vendor part number Top side marking V62/04666-01XE 01295 SN74LVC541AQDWREP C541AEP V62/04666-01YE 01295 SN74LVC541AQPWREP C541AEP 1/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. CAGE co

44、de Source of supply 01295 Texas Instruments, Inc. Semiconductor Group8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-