DLA DSCC-VID-V62 04759 REV A-2011 MICROCIRCUIT DIGITAL ADVANCED CMOS QUADRUPLE 2-INPUT POSITIVE-AND GATE WITH TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Update boilerplate paragraphs to current requirements. - PHN 11-09-19 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing RE

2、V PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A PAGE 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Charles F. Saffle DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing CHECKED BY Charles F. Saffle TITLE MICROCIRCUIT, DIGITAL, ADVANCED CMOS, QUADRUPLE 2-INPUT POSITIVE-A

3、ND GATE, WITH TTL COMPATIBLE INPUTS, MONOLITHIC SILICON YY-MM-DD 04-12-09 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/04759 REV A PAGE 1 OF 8 AMSC N/A 5962-V085-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY

4、 CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04759 REV A PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance quadruple 2-input positive-AND gate, with TTL compatible inputs microcircuit, with an operating temperature range of -

5、40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/04759 - 01 X E Drawing Device type Case outline

6、 Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 SN74ACT08-EP Quadruple 2-input positive-AND gate, with TTL compatible inputs 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC P

7、UB 95 Package style X 14 JEDEC MS-012 Plastic small-outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Othe

8、r 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V to 7 V Input voltage range (VI) . -0.5 V to VCC+ 0.5 V 2/ Output voltage range (VO) . -0.5 V to VCC+ 0.5 V 2/ Input clamp current (IIK) (VIVCC) 20 mA Output clamp current (IOK) (VOVCC) 20 mA Continuous output current (IO) (VO= 0

9、to VCC) 50 mA Continuous current through VCCor GND . 200 mA Package thermal impedance (JA) . 86C/W 3/ Storage temperature range (TSTG) . -65C to +150C 1/ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functio

10、nal operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ The input and output voltage ratings may be exceeded if th

11、e input and output current ratings are observed. 3/ The package thermal impedance is calculated in accordance with JESD 51-7. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 D

12、WG NO. V62/04759 REV A PAGE 3 1.4 Recommended operating conditions. 4/ Supply voltage range (VCC) . 4.5 V to 5.5 V Minimum high-level input voltage (VIH) 2 V Maximum low-level input voltage (VIL) . 0.8 V Input voltage range (VI) . 0 V to VCCOutput voltage range (VO) . 0 V to VCCMaximum high-level ou

13、tput current (IOH) . -24 mA Maximum low-level output current (IOL) . 24 mA Maximum input transition rise or fall rate (t/v) . 8 ns/V Operating free-air temperature range (TA) -40C to +85C 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC PUB 95 Registered and Standard Ou

14、tlines for Semiconductor Devices JEDEC STD 51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA

15、22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be

16、 marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physica

17、l dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Function table. The function table shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be

18、as shown in figure 3. 3.5.4 Terminal connections. The terminal connections shall be as shown in figure 4. 3.5.5 Timing waveforms and test circuit. The timing waveforms and test circuit shall be as shown in figure 5. 4/ All unused inputs of the device must be held at VCCor GND to ensure proper device

19、 operation. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04759 REV A PAGE 4 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions VCCTemper

20、ature, TADevice type Limits Unit Min Max High level output voltage VOHIOH= -50 A 4.5 V 25C, -40C to 85C 01 4.4 V 5.5 V 5.4 IOH= -24 mA 4.5 V 25C 3.86 -40C to 85C 3.76 5.5 V 25C 4.86 -40C to 85C 4.76 IOH= -75 mA 2/ 5.5 V -40C to 85C 3.85 Low level output voltage VOLIOL= 50 A 4.5 V 25C, -40C to 85C 0.

21、1 V 5.5 V 0.1 IOL= 24 mA 4.5 V 25C 0.36 -40C to 85C 0.44 5.5 V 25C 0.36 -40C to 85C 0.44 IOL= 75 mA 2/ 5.5 V -40C to 85C 1.65 Input current IIVI= VCCor GND 5.5 V 25C 0.1 A -40C to 85C 1 Quiescent supply current ICCVI= VCCor GND IO= 0 A 5.5 V 25C 2 A -40C to 85C 20 Quiescent supply current delta ICC3

22、/ One input at 3.4 V, Other inputs at VCCor GND 5.5 V -40C to 85C 1.5 mA Input capacitance CIVI= VCCor GND 5 V 25C 4.5 TYP pF Power dissipation capacitance CpdCL= 50 pF f = 1 MHz 5 V 25C 20 TYP pF Propagation delay time, A or B to Y tPLHCL= 50 pF See figure 5. 4.5 V and 5.5 V 25C 1 9 ns -40C to 85C

23、1 10 tPHL4.5 V and 5.5 V 25C 1 9 -40C to 85C 1 10 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may

24、 not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms. 3/ This is the increase in supply current for each

25、 input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04759 REV A PAGE 5 Case X Dimens

26、ions Symbol Inches Millimeters Symbol Inches Millimeters Min Max Min Max Min Max Min Max A - .069 - 1.75 E .150 .157 3.80 4.00 A1 .004 .010 0.10 0.25 E1 .228 .244 5.80 6.20 b .012 .020 0.31 0.51 e .050 BSC 1.27 BSC c .007 .010 0.17 0.25 L .016 .050 0.40 1.27 D .337 .344 8.55 8.75 NOTES: 1. This draw

27、ing is subject to change without notice. 2. Falls within JEDEC MS-012. 3. All linear dimensions are shown in inches (millimeters). Millimeters equivalents are given for general information only. 4. Body dimensions do not include mold flash or protrusion not to exceed 0.006 inches (0.15 millimeters).

28、 FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04759 REV A PAGE 6 (each gate) Inputs Output Y A B H L X H X L H L L H = High voltage leve

29、l L = Low voltage level X = Immaterial FIGURE 2. Function table. FIGURE 3. Logic diagram. Device type 01 Case outline X Terminal number Terminal symbol Terminal number Terminal symbol 1 1A 8 3Y 2 1B 9 3A 3 1Y 10 3B 4 2A 11 4Y 5 2B 12 4A 6 2Y 13 4B 7 GND 14 VCCFIGURE 4. Terminal connections. Provided

30、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04759 REV A PAGE 7 NOTES: 1. CLincludes probe and jig capacitance. 2. All input pulses are supplied by generators having th

31、e following characteristics: PRR 1 MHz, ZO= 50, tr 2.5 ns, tf 2.5 ns 3. The outputs are measured one at a time, with one input transition per measurement. FIGURE 5. Timing waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DE

32、FENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04759 REV A PAGE 8 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedure

33、s should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard

34、commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers da

35、ta book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued avail

36、ability as a source of supply for the item. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Vendor part number Top-Side Marking V62/04759-01XE 01295 SN74ACT08IDREP SACT08IEP 1/ The vendor item drawing establishes an administrative control number for identifying the

37、 item on the engineering documentation. CAGE code Source of supply 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-