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本文(DLA DSCC-VID-V62 05617 REV B-2012 MICROCIRCUIT DIGITAL-LINEAR WIDE INPUT SYNCHRONOUS BUCK CONTROLLER MONOLITHIC SILICON.pdf)为本站会员(registerpick115)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA DSCC-VID-V62 05617 REV B-2012 MICROCIRCUIT DIGITAL-LINEAR WIDE INPUT SYNCHRONOUS BUCK CONTROLLER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Add JESD51-5 information to paragraph 2. Add sentence to note 2 as specified under figure 1. Update boilerplate paragraphs to current requirements. - ro 11-08-15 C. SAFFLE B Under the SS/SD pin, delete 0.7 V and replace with 0.85 V as specified on figure 3.

2、 - ro 12-03-30 C. SAFFLE CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B B B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 1

3、3 14 15 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY TOM HESS TITLE MICROCIRCUIT, DIGITAL-LINEAR, WIDE INPUT SYNCHRONOUS BUCK CONTROLLER, MONOLITHIC SILICON 05-09-19 APPROVED BY RAYMOND MONNIN SIZE A CODE IDEN

4、T. NO. 16236 DWG NO. V62/05617 REV B PAGE 1 OF 15 AMSC N/A 5962-V038-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05617 REV B PAGE 2 1. SCOPE 1.1 Scope. This

5、 drawing documents the general requirements of a high performance wide input synchronous buck controller microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item dra

6、wing establishes an administrative control number for identifying the item on the engineering documentation: V62/05617 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 TPS40055-EP Wide input

7、 synchronous buck controller sources/sinks output current 02 TPS40054-EP Wide input synchronous buck controller sources output current only 03 TPS40057-EP Wide input synchronous buck controller sources/sinks output current with VOUTprebiased before controller is enabled 1.2.2 Case outline(s). The ca

8、se outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 16 MO-153 Plastic small outline package with thermal pad 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Mat

9、erial A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05617 REV B PAGE 3

10、1.3 Absolute maximum ratings. 1/ Input voltage range (VIN) : VINpin 45 V VFB, SS, SYNC pins -0.3 V to 6 V SW pin . -0.3 V to 45 V SW pin, transient 50 ns . -2.5 V KFF pin, with IIN(max)= -5 mA . -0.3 V to 11 V Output voltage range (VOUT) for COMP, RT, and SS pins -0.3 V to 6 V Input current (IIN) fo

11、r KFF pin . 5 mA Output current (IOUT) for RT pin 200 A Operating junction temperature range (TJ) -55C to +140C Storage temperature range (TSTG) -55C to +150C 2/ Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds . +260C Thermal resistance, junction to case (JC) . 26.6C/W Thermal resistanc

12、e, junction to ambient (JA) 36.5C/W 3/ 4/ Thermal resistance, junction to bottom of thermal pad (JP) 2.1C/W 3/ Junction to top thermal parameter (JT) . 0.848C/W 3/ 4/ 1.4 Recommended operating conditions. 5/ Input voltage range (VIN) . 8 V to 40 V Operating free-air temperature range (TA) . -55C to

13、+125C 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Expos

14、ure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ Long term high temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. 3/ See technical brief SLMA002 Power pad thermally enha

15、nced package. 4/ Tested in accordance with the thermal metric definitions of EIA/JESD51-5. 5/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond

16、the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05617 REV B PAGE 4 2. APPLICABLE DOCUMENTS JEDEC Solid State Technology Association JEDEC PUB 95

17、 - Registered and Standard Outlines for Semiconductor Devices JESD51-5 - Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms (Applications for copies should be addressed to the JEDEC Office, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201-2107 or

18、 online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The

19、 unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, c

20、onstruction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Logic

21、diagram. The logic diagram shall be as shown in figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05617 REV B PAGE 5 TABLE I. Electrical performance charac

22、teristics. 1/ Test Symbol Conditions 2/Temperature, TADevice type Limits Unit Min Max Input supply section Input voltage range VIN-55C to +125C 01,02,03 8 40 V Operating current section Quiescent current IDDOutput drivers not switching, VFB 0.75 V -55C to +125C 01,02,03 3.3 mA BP5 section Output vol

23、tage VBP5IOUT 1 mA -55C to +125C 01,02,03 4.7 5.3 V Oscillator/ramp generator section 3/ Accuracy fOSC8 V VIN 40 V -55C to +125C 01,02,03 465 585 kHz PWM ramp voltage 4/ VRAMPVPEAK VVAL-55C to +125C 01,02,03 2 typical V High level input voltage, SYNC pin VIH-55C to +125C 01,02,03 2 5 V Low level inp

24、ut voltage, SYNC pin VIL-55C to +125C 01,02,03 0.8 V Input current, SYNC pin ISYNC-55C to +125C 01,02,03 11 A Pulse width, SYNC pin -55C to +125C 01,02,03 50 ns RT voltage VRT-55C to +125C 01,02,03 2.37 2.59 V Maximum duty cycle VFB= 0 V, fSW 500 kHz -55C to +125C 01,02,03 84% 94% VFB= 0 V, 4/ 500 k

25、Hz fSW 1 MHz 80% Minimum duty cycle VFB 0.75 V -55C to +125C 01,02,03 0% Feed forward voltage VKFF-55C to +125C 01,02,03 3.35 3.7 V Feed forward current operating range IKFF4/ -55C to +125C 01,02,03 20 1200 A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking p

26、ermitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05617 REV B PAGE 6 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions 2/Temperature, TADevice type Limits Unit Min Max Soft start section Sof

27、t start source current ISS-55C to +125C 01,02,03 1.2 3.6 A Soft start clamp voltage VSS-55C to +125C 01,02,03 3.7 typical V Discharge time tDSCHCSS= 200 pF -55C to +125C 01,02,03 1.4 3.4 s Soft start time tSSCSS= 220 pF, 0 V VSS 1.6 V -55C to +125C 01,02,03 102 230 s BP10 section Output voltage VBP1

28、0IOUT 1 mA -55C to +125C 01,02,03 8.9 10.45 V Error amplification section Feedback input voltage VFB8 V VIN 40 V +25C 01,02,03 0.698 0.704 V 8 V VIN 40 V 0C TA 125C 0.689 0.717 8 V VIN 40 V -55C TA 125C 0.689 0.719 Gain bandwidth GBW4/ -55C to +125C 01,02,03 2.8 MHz Open loop gain AVOL-55C to +125C

29、01,02,03 40 dB High level output source current IOH-55C to +125C 01,02,03 1.85 mA Low level output source current IOL-55C to +125C 01,02,03 1.95 mA High level output voltage VOHISOURCE= 500 A -55C to +125C 01,02,03 3.1 V Low level output voltage VOLISINK= 500 A -55C to +125C 01,02,03 0.37 V Input bi

30、as current IBIASVFB= 0.7 V -55C to +125C 01,02,03 220 nA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05617 REV B PAGE 7 TABLE I.

31、 Electrical performance characteristics Continued. 1/ Test Symbol Conditions 2/Temperature, TADevice type Limits Unit Min Max Current limit section Current limit sink current ISINK-55C to +125C 01,02,03 7.5 12.2 A Propagation delay to output VILIM= 23.7 V, VSW= (VILIM 0.5 V) -55C to +125C 01,02,03 3

32、00 typical ns VILIM= 23.7 V, VSW= (VILIM 2 V) 200 typical Switch leading edge blanking pulse time tON4/ -55C to +125C 01,02,03 100 ns Off time during a fault tOFF-55C to +125C 01,02,03 7 typical cycles Offset voltage SW versus ILIM VOSVILIM= 23.6 V +25C 01,02,03 -115 -50 mV VILIM= 23.6 V 0C TA 125C

33、-155 -38 VILIM= 23.6 V -55C TA 125C -155 -10 VILIM= 11.6 V +25C -118 -43 VILIM= 11.6 V 0C TA 125C -160 -45 VILIM= 11.6 V -55C TA 125C -160 -15 Output driver section Low side driver rise time tLRISECLOAD= 2200 pF -55C to +125C 01,02,03 110 ns Low side driver fall time tLFALLCLOAD= 2200 pF -55C to +12

34、5C 01,02,03 58 ns High side driver rise time tHRISECLOAD= 2200 pF, (HDRV SW) -55C to +125C 01,02,03 105 ns High side driver fall time tHFALLCLOAD= 2200 pF, (HDRV SW) -55C to +125C 01,02,03 82 ns High level output voltage, HDRV pin VOHIHDRV= -0.1 A (HDRV SW) -55C to +125C 01,02,03 BOOST -1.9 V Low le

35、vel output voltage, HDRV pin VOLIHDRV= 0.1 A (HDRV SW) -55C to +125C 01,02,03 0.85 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62

36、/05617 REV B PAGE 8 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions 2/Temperature, TADevice type Limits Unit Min Max Output driver section - Continued High level output voltage, LDRV pin VOHILDRV= -0.1 A -55C to +125C 01,02,03 BP10 -1.8 V Low level output voltage

37、, LDRV VOLILDRV= 0.1 A -55C to +125C 01,02,03 0.6 V Minimum controllable pulse width -55C to +125C 01,02,03 160 ns SS/SD shutdown section Shutdown threshold voltage VSDOutputs off -55C to +125C 01,02,03 85 170 mV Device active threshold voltage VEN-55C to +125C 01,02,03 180 260 mV Boost regulator se

38、ction Output voltage VBOOSTVIN= 24 V -55C to +125C 01,02,03 30.8 33.9 V Rectifier zero current comparator section Switch voltage VSWLDRV output OFF -55C to +125C 02 -10 0 mV SW node section Leakage current 4/ ILEAK-55C to +125C 01,02,03 35 A Thermal shutdown section Shutdown temperature TSD4/ -55C t

39、o +125C 01,02,03 165 typical C Hysteresis TSD4/ -55C to +125C 01,02,03 20 typical C See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/

40、05617 REV B PAGE 9 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions 2/Temperature, TADevice type Limits Unit Min Max Undervoltage lockout (UVLO) section KFF programmable threshold voltage VUVLORKFF= 28.7 k -55C to +125C 01,02,03 6.85 7.95 V UVLO, fixed VDD-55C to

41、+125C 01,02,03 7.05 7.9 V UVLO, hysteresis VDD-55C to +125C 01,02,03 0.46 typical V 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temper

42、ature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Unless otherwise specified, TA= -55C to +125C, VIN= 24 V dc, RT= 90.0 k, IKFF= 150 A, fSW= 500 kHz, all parameters at zero

43、 power dissipation. 3/ IKFFincreases with SYNC frequency, IKFFdecreases with maximum duty cycle. 4/ Ensured by design. Not production tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE I

44、DENT NO. 16236 DWG NO. V62/05617 REV B PAGE 10 Case X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05617 REV B PAGE 11 Case X Symbol Dim

45、ensions Inches Millimeters Min Max Min Max A - 0.004 - 1.20 A1 0.001 0.005 0.05 0.15 b 0.007 0.011 0.19 0.30 c 0.005 NOM 0.15 NOM D 0.192 0.200 4.90 5.10 E 0.169 0.177 4.30 4.50 E1 0.244 0.259 6.20 6.60 e 0.025 BSC 0.65 BSC L 0.019 0.029 0.50 0.75 n 16 16 NOTES: 1. Controlling dimensions are millime

46、ter, inch dimensions are given for reference only. 2. Body dimensions do not include mold flash or protrusions. Mold flash and protrusion shall not exceed (0.005 inch) 0.15 mm per side. 3. Falls within JEDEC MO-153. 4. This package is designed to be soldered to a thermal pad on the board. Refer to t

47、echnical brief, power pad thermally enhanced package, manufacturers literature number SLMA002 for information regarding recommended board layout. FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05617 REV B PAGE

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