DLA DSCC-VID-V62 05618 REV B-2013 MICROCIRCUIT DIGITAL TEMPERATURE SENSOR MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Correct lead finish for device 01 on last page. - CFS 05-12-02 Thomas M. Hess B Update paragraph 6.3, device -02XA is no longer available. Update paragraphs to current requirements. - ro 13-12-16 Charles F. Saffle CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS

2、 CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218

3、-3990 Original date of drawing YY-MM-DD CHECKED BY TOM HESS TITLE MICROCIRCUIT, DIGITAL, TEMPERATURE SENSOR, MONOLITHIC SILICON 05-09-01 APPROVED BY RAYMOND MONNIN SIZE A CODE IDENT. NO. 16236 DWG NO. V62/05618 REV B PAGE 1 OF 10 AMSC N/A 5962-V059-13 Provided by IHSNot for ResaleNo reproduction or

4、networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance temperature sensor microcircuit, with an operating tem

5、perature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/05618 - 01 X E Drawing Devi

6、ce type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 TMP100-EP Temperature sensor 02 TMP101-EP Temperature sensor 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JED

7、EC PUB 95 Package style X 6 MO-178-AB Plastic small outline package 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium

8、 Z Other 1.3 Absolute maximum ratings. 1/ Supply voltage (V+) 7.5 V Input voltage range (VIN) . -0.5 V to 7.5 V Operating free-air temperature range (TA) . -55C to +125C Storage temperature range (TSTG) -60C to 150C Maximum junction temperature (TJ) . 150C Leading temperature soldering . 300C Therma

9、l resistance, junction to ambient (JA) 165C/W 2/ 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended

10、operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ The thermal impedance, JAfor the DBV package is determined for JEDEC high-K PCB (JESD 51-7). Provided by IHSNot for ResaleNo reproduction or networking permitted

11、 without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 3 1.4 Recommended operating conditions. 3/ Supply voltage range (V+) 2.7 V to 5.5 V Operating free-air temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS

12、JEDEC Solid State Technology Association EIA/JESD 51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wil

13、son Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identif

14、ication (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1

15、.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections s

16、hall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. _ 3/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product u

17、sed beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 4 TABLE I. Electrical performance characteristics. 1/ Test Symbol Co

18、nditions VDD= 2.7 V to 5.5 VTemperature, TADevice type Limits Unit Min Max Temperature input section Range -55C to +125C 01, 02 -55 +125 C Accuracy (temperature error) -25C to +85C 01, 02 2 C -55C to +125C 3 Resolution Selectable -55C to +125C 01, 02 0.0625 typical C Digital input/output section Hig

19、h level input voltage VIH-55C to +125C 01, 02 0.7 (V+) (V+) +0.5 V Low level input voltage VIL-55C to +125C 01, 02 -0.5 0.3 (V+) V Input current IINVIN= 0 V to 6 V -55C to +125C 01, 02 1 A Low level output voltage VOLIOL= 3 mA, SDA pin -55C to +125C 01, 02 0 0.4 V IOL= 4 mA, ALERT pin -55C to +125C

20、02 0 0.4 Resolution Selectable -55C to +125C 01, 02 9 to 12 typical bits Conversion time 9 bit -55C to +125C 01, 02 75 ms 10 bit -55C to +125C 150 11 bit -55C to +125C 300 12 bit -55C to +125C 600 Conversion time 9 bit -55C to +125C 01, 02 25 typical s/s 10 bit -55C to +125C 12 typical 11 bit -55C t

21、o +125C 6 typical 12 bit -55C to +125C 3 typical See footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 5 TABLE I. Electric

22、al performance characteristics Continued. 1/ Test Symbol Conditions VDD= 2.7 V to 5.5 VTemperature, TA Device type Limits Unit Min Max Power supply section Quiescent current IQSerial bus inactive -55C to +125C 01, 02 75 A Serial bus active, SCL = 400 kHz -55C to +125C 70 typical Serial bus active, S

23、CL = 3.4 MHz -55C to +125C 150 typical Shutdown current ISDSerial bus inactive -55C to +125C 01, 02 1 A Serial bus active, SCL = 400 kHz -55C to +125C 20 typical Serial bus active, SCL = 3.4 MHz -55C to +125C 100 typical 1/ Testing and other quality control techniques are used to the extent deemed n

24、ecessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and

25、/or design. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 6 Case X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or netwo

26、rking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 7 Case X Symbol Dimensions Inches Millimeters Min Max Min Max A - 0.057 - 1.45 A1 0.000 0.005 0.00 0.15 b 0.009 0.019 0.25 0.50 c 0.003 0.008 0.08 0.22

27、 D 0.108 0.120 2.75 3.05 E 0.057 0.068 1.45 1.75 E1 0.102 0.118 2.60 3.00 e 0.037 BSC 0.95 BSC L 0.011 0.021 0.30 0.55 L1 0.009 NOM 0.25 NOM n 6 6 NOTES: 1. Controlling dimensions are millimeter, inch dimensions are given for reference only. 2. Body dimensions do not include mold flash or protrusion

28、. 3. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation. 4. Falls within JEDEC MO-178 variation AB, except minimum lead width. FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER,

29、 COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 8 Device types 01 02 Case outline X Terminal number Terminal symbol 1 SCL SCL 2 GND GND 3 ADD1 ALERT 4 V+ V+ 5 ADD0 ADD0 6 SDA SDA Terminal symbol I/O Description SCL I Serial clock. GND - Ground. ADD1 I Slave address

30、select pin 1. ALERT O Alert status pin. V+ - Supply voltage. ADD0 I Slave address select pin 0. SDA I/O Serial data. FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A

31、 CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 9 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/05618 REV B PAGE 10 4. VERIFICATION 4

32、.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture

33、sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharg

34、e sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as chan

35、ges are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all current sources of

36、supply at http:/www.landandmaritime.dla.mil/Programs/Smcr/. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Package 2/ Top-side marking Vendor part number V62/05618-01XE 01295 SOT23 100E TMP100MDBVREP V62/05618-02XA 3/ SOT23-6 (DBV) 101E TMP101MDBVREP 1/ The vendor

37、 item drawing establishes an administrative control number for identifying the item on the engineering documentation. 2/ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available from the manufacturer. Available in reel of 3000. 3/ Not availa

38、ble from an approved source of supply. CAGE code Source of supply 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-