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本文(DLA DSCC-VID-V62 09639-2011 MICROCIRCUIT LINEAR QUAD 1 2 MUE A SINGLE SUPPLY OPERATIONAL AMPLIFIER MONOLITHIC SILICON.pdf)为本站会员(inwarn120)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA DSCC-VID-V62 09639-2011 MICROCIRCUIT LINEAR QUAD 1 2 MUE A SINGLE SUPPLY OPERATIONAL AMPLIFIER MONOLITHIC SILICON.pdf

1、 REVISIONSLTR DESCRIPTION DATE APPROVEDPrepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED BY RAJESH

2、 PITHADIA TITLE MICROCIRCUIT, LINEAR, QUAD, 1.2 A, SINGLE SUPPLY OPERATIONAL AMPLIFIER, MONOLITHIC SILICON 11-07-07 APPROVED BY CHARLES F. SAFFLE SIZE A CODE IDENT. NO. 16236 DWG NO. V62/09639 REV PAGE 1 OF 10 AMSC N/A 5962-V052-11 Provided by IHSNot for ResaleNo reproduction or networking permitted

3、 without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09639 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a quad, 1.2 A, single supply operational amplifier microcircuit, with an operating temperature range of -

4、55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/09639 - 01 X B Drawing Device type Case outlin

5、e Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 MAX418 Quad, 1.2 A, single supply operational amplifier 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style

6、X 14 MS-012-AB Small outline1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Z Other Provided by IHSNot for ResaleNo re

7、production or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09639 REV PAGE 3 1.3 Absolute maximum ratings. 1/ 2/ Total supply voltage (+V to -V) . 12 V Input voltage (+V + 0.3 V) to (-V 0.3 V) Continuous current: All in

8、put pins . 10 mA All other pins 50 mA Short-circuit duration Continuous Junction temperature (TJ) 150C Storage temperature range (TSTG) . -65C to +160C Lead temperature (soldering, 10 seconds) . +300C Electrostatic discharge (ESD): Human body model (HBM) . 2,000 V Moisture sensitivity level (MSL) Le

9、vel 1 1.4 Recommended operating conditions. 3/ Supply voltage +V = +2.5 V, -V = -2.5 V Operating free-air temperature range (TA) . -55C to +125C 1.5 Thermal data table. Case outline letter X X Units PC board Single layer Multi-layer 4/ Power dissipation (PD), maximum at +70C 667 988 mW Power dissipa

10、tion (PD) derating above +70C 8.3 12.3 mW/C Thermal resistance, junction to case (JC) 37 32C/W Thermal resistance, junction to ambient (JA) 120 81 C/W 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and function

11、al operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ The absolute maximum ratings do not apply to devices suppli

12、ed in die or wafer form. 3/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 4/ Package thermal resistances were obtained us

13、ing the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO S

14、IZE A CODE IDENT NO. 16236 DWG NO. V62/09639 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices JEDEC JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Applications for copies should be addressed to the

15、Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or

16、logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performan

17、ce characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal

18、 connections. The terminal connections shall be as shown in figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09639 REV PAGE 5 TABLE I. Electrical performance charac

19、teristics. 1/ Test Symbol Conditions +V = 2.5 V, -V = -2.5 V unless otherwise specifiedTemperature, TADevice type Limits Unit Min Max Input offset voltage VOS+25C 01 4.0 mV -55C to +125C 6.0 Offset voltage temperature coefficient TCVOS-55C to +125C 01 10 V/C Input bias current IBVCM= 0 V 2/ +25C 01

20、10.0 pA VCM= 0 V -55C to +125C 1.0 nA Large signal voltage gain AVOLVOUT= 2 V, RL= 1 M +25C 01 10 V/mV -55C to +125C 5 Gain bandwidth GBW +25C 01 4 kHz Input common mode range CMR +25C 01 -V +V 1.2 V Output voltage swing VORL= 1 M +25C 01 2.45 V -55C to +125C 2.45 Common mode rejection ratio CMRR 3/

21、 +25C 01 60 dB -55C to +125C 60 Power supply rejection ratio PSRR VIN= 0 V, +V = 2.5 V to 7.5 V +25C 01 800 V/V -55C to +125C 800 Slew rate SR +25C 01 3 V/ms Supply current per amplifier ISY+25C 01 1.6 A -55C to +125C 2.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or

22、 networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09639 REV PAGE 6 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions +V = 2.5 V, -V = -2.5 V unless otherwise specifiedTemperature, TADevic

23、e type Limits Unit Min Max Output sink current IOSINKVOUT= 0 V +25C 01 50 A -55C to +125C 20 Output source current IOSOURCEVOUT= 0 V +25C 01 250 A -55C to +125C 200 Supply voltage (+V to V) VS+25C 01 2.5 10.0 V Input noise voltage enfO= 1 kHz +25C 01 150 typical nV / Hz fO= 0.1 Hz to 10 Hz 6 typical

24、 Vp-p1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of

25、 specific parametric testing, product performance is assured by characterization and/or design. 2/ Production-automated test equipment cannot resolve input bias currents below 1 pA. Lab equipment has shown the device typical input bias current below 0.1 pA. 3/ VCM= -V to (+V - 1.2 V). Provided by IH

26、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09639 REV PAGE 7 Case X FIGURE 1. Case outline Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH

27、S-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09639 REV PAGE 8 Case X continued. Symbol Dimensions Inches Millimeters Min Max Min Max A 0.053 0.069 1.35 1.75 A1 0.004 0.010 0.10 0.25 b 0.014 0.019 0.35 0.49 c 0.007 0.010 0.19 0.25 D 0.337 0.344 8.55 8.75 e 0.050

28、BSC 1.27 BSC E 0.150 0.157 3.80 4.00 E1 0.228 0.244 5.80 6.20 L 0.016 0.050 0.40 1.27 n 14 14NOTES: 1. Controlling dimensions are millimeter, inch dimensions are given for reference only. 2. Dimensions D and E do not include mold flash. 3. Mold flash or protrusions do not exceed 0.15 mm (0.006 inch)

29、. 4. Leads to be coplanar within 0.10 mm (0.004 inch). 5. Falls within reference to JEDEC MS-012-AB. FIGURE 1. Case outline - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236

30、DWG NO. V62/09639 REV PAGE 9 Device type 01 Case outline X Terminal number Terminal symbol Description 1 OUTA Amplifier output A 2 -INA Inverting input A 3 +INA Noninverting input A 4 +V Positive supply pin. Connect to (+) terminal of power supply. 5 +INB Noninverting input B 6 -INB Inverting input

31、B 7 OUTB Amplifier output B 8 OUTC Amplifier output C 9 -INC Inverting input C 10 +INC Noninverting input C 11 -V Negative power supply pin. Connect to (-) terminal of power supply or ground. 12 +IND Noninverting input D 13 -IND Inverting input D 14 OUTD Amplifier output D FIGURE 2. Terminal connect

32、ions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/09639 REV PAGE 10 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing al

33、l inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preserv

34、ation, packaging, labeling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1C minimum. 6.2 Configuration control.

35、The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggeste

36、d source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Vendor part number 2/ V62/09639-01XB 1ES66 MAX418MSD/PR 1/ The vendor item dr

37、awing establishes an administrative control number for identifying the item on the engineering documentation. 2/ Add “-T” suffix for tape and reel. CAGE code Source of supply 1ES66 Maxim Integrated Products 120 San Gabriel Drive Sunnyvale, CA 94086-5125 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

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