DLA DSCC-VID-V62 11618-2011 MICROCIRCUIT LINEAR TEMPERATURE SENSOR MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKED B

2、Y RAJESH PITHADIA TITLE MICROCIRCUIT, LINEAR, TEMPERATURE SENSOR, MONOLITHIC SILICON 11-10-04 APPROVED BY CHARLES F. SAFFLE SIZE A CODE IDENT. NO. 16236 DWG NO. V62/11618 REV PAGE 1 OF 12 AMSC N/A 5962-V075-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

3、IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance temperature sensor microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawi

4、ng Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/11618 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (S

5、ee 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 TMP422 Dual channel temperature sensor 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 8 M0-178-BA Plastic small outline surface mount 1.

6、2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking pe

7、rmitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (VS) +7 V Input voltage (VIN): DX1, DX2, DX3, and DX4 pins . -0.5 V to VS+ 0.5 V SDA and SCL pins . -0.5 to 7 V Inp

8、ut current . 10 mA Power dissipation (PD) . 230 mW Junction temperature range (TJ) +150C Storage temperature range (TSTG) -60C to +130C Electrostatic discharge (ESD) rating: Human body model (HBM) . 3000 V Charged device model (CDM) 1000 V Machine Model (MM) . 200 V Thermal resistance, junction to c

9、ase (JC) . 164C/W typical Thermal resistance, junction to ambient (JA) 108C/W typical 1.4 Recommended operating conditions. 2/ Supply voltage range (VS) 2.7 V to 5.5 V Operating free-air temperature range (TA) . -55C to +125C 1/ Stresses beyond those listed under “absolute maximum rating” may cause

10、permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device

11、reliability. 2/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. Provided by IHSNot for ResaleNo reproduction or networking

12、permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the JEDEC Office, 3103

13、North 10th Street, Suite 240-S, Arlington, VA 22201-2107 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifie

14、r C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are

15、as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The termi

16、nal connections shall be as shown in figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symb

17、ol Conditions VS= 2.7 V to 5.5 V unless otherwise specifiedTemperature, TADevice type Limits Unit Min Max Temperature error Local temperature sensor TELOCAL-55C to +125C 01 1.25 2.5 C Remote 2/ temperature sensor TEREMOTETA= -55C to +125C, TD= -55C to +125C, VS= 3.3 V -55C to +125C 01 1 3 C TA= -55C

18、 to +125C, TD= -55C to +125C 3 5 Remote temperature sensor versus supply (local/remote) VS= 2.7 V to 5.5 V -55C to +125C 01 0.2 0.72 C/V Temperature measurement Conversion time (per channel) -55C to +125C 01 100 130 ms Resolution, local temperature sensor (programmable) -55C to +125C 01 12 typical B

19、its Resolution, remote temperature sensor -55C to +125C 01 12 typical Bits Remote sensor source currents, high Series resistance 3 k maximum -55C to +125C 01 120 typical A Remote sensor source currents, medium high -55C to +125C 01 60 typical A Remote sensor source currents, medium low -55C to +125C

20、 01 12 typical A Remote sensor source currents, low -55C to +125C 01 6 typical A Remote transistor ideality factor Optimized ideality factor -55C to +125C 01 1.008 typical See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

21、-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 6 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions VS= 2.7 V to 5.5 V unless otherwise specifiedTemperature, TADevice type Limits Unit Min Max System management bus (SMBus

22、) interface Logic input high voltage (SCL, SDA) VIH-55C to +125C 01 2.1 V Logic input low voltage (SCL, SDA) VIL-55C to +125C 01 0.8 V Hysteresis -55C to +125C 01 500 typical mV SMBus output low sink current -55C to +125C 01 6 mA SDA output low voltage VOLIOUT= 6 mA -55C to +125C 01 0.4 V Logic inpu

23、t current 0 VIN 6 V -55C to +125C 01 -1 +1 A SMBus input capacitance (SCL, SDA) -55C to +125C 01 3 typical pF SMBus clock frequency -55C to +125C 01 3.4 MHz SMBus timeout -55C to +125C 01 25 35 ms SCL falling edge to SDA valid time -55C to +125C 01 1 s Digital inputs Input capacitance CIN-55C to +12

24、5C 01 3 typical pF Input logic levels, input high voltage VIH-55C to +125C 01 0.7 (+VS) (+VS) +0.5 V Input logic levels, input low voltage VIL-55C to +125C 01 -0.5 0.3 (+VS) V Leakage input current IIN0 VIN VS-55C to +125C 01 1 A See footnotes at end of table. Provided by IHSNot for ResaleNo reprodu

25、ction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 7 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol Conditions VS= 2.7 V to 5.5 V unless otherwise specifiedTemperature, TADe

26、vice type Limits Unit Min Max Power supply Specified voltage range VS-55C to +125C 01 2.7 5.5 V Quiescent current IQ0.0625 conversions per second -55C to +125C 01 38 A Eight conversions per second 525 Serial bus inactive, shutdown mode 10 Serial bus active, fS= 400 kHz, shutdown mode 90 typical Seri

27、al bus active, fS= 3.4 MHz, shutdown mode 350 typical Undervoltage lockout UVLO -55C to +125C 01 2.3 2.6 V Power on reset threshold POR -55C to +125C 01 2.3 V 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temp

28、erature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Tested with less than 5 effective series resist

29、ance and 100 pF differential input capacitance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 8 Case X FIGURE 1. Case outline. Provided by IHSNot for Resale

30、No reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 9 Case X Symbol Dimensions Inches Millimeters Min Max Min Max A 0.035 0.051 0.90 1.30 A1 0.00 0.005 0.00 0.15 A2 0.035 0.057 0.90 1.45 b 0.

31、008 0.014 0.22 0.38 c 0.003 0.008 0.08 0.22 D 0.110 0.118 2.80 3.00 e 0.025 BSC 0.65 BSC E 0.057 0.068 1.45 1.75 E1 0.102 0.118 2.60 3.00 L 0.011 0.023 0.30 0.60 L1 0.009 BSC 0.25 BSC NOTES: 1. Controlling dimensions are millimeter, inch dimensions are given for reference only. 2. Package outline ex

32、clusive of metal burr and dambar protrusion/intrusion. 3. Package outline inclusive of soldering plating. 4. A visual index feature must be located within the pin 1 index area. 5. Body length does not include flash or protrusion. Mold flash and protrusion shall not exceed 0.25 mm ( 0.009 inch ) per

33、side. 6. Falls within reference to JEDEC MO-178-BA. FIGURE 1. Case outline - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 10 Device type 01 Case

34、 outline X Terminal number Terminal symbol Description 1 DX1 Channel 1 remote temperature sensor connection pin. Also sets the device address. See Table III. 2 DX2 Channel 1 remote temperature sensor connection pin. Also sets the device address. See Table III. 3 DX3 Channel 2 remote temperature sens

35、or connection pin. Also sets the device address. See Table III. 4 DX4 Channel 2 remote temperature sensor connection pin. Also sets the device address. See Table III. 5 GND Ground. 6 SDA Serial data line for SMBus, open drain; requires pull up resistors +VS. 7 SCL Serial clock line for SMBus, open d

36、rain; requires pull up resistor to +VS. 8 +VSPositive supply voltage (2.7 V to 5.5 V). FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618

37、REV PAGE 11 TABLE II. Slave address options. Two wire slave address DX1 DX2 DX3 DX4 1001 100 DXP1 DXN1 DXP2 DXN2 1001 101 DXP1 DXN1 DXN2 DXP2 1001 110 DXN1 DXP1 DXP2 DXN2 1001 111 DXN1 DXP1 DXN2 DXP2 This device supports four slave addresses. The slave device address is set by the connections betwee

38、n the external transistors and the device according to figure 3 and Table II. If one of the channels is unused, the respective DXP (positive emitter base junction voltage) connection should be connected to GND, and the DXN (negative emitter base junction voltage) connection should be left unconnecte

39、d. The polarity of the transistor for external channel 2 (DX3 andDX4 pins) sets the least significant bit of the slave address. The polarity of the transistor for external channel 1 (DX1 and DX2 pins) sets the next least significant bit of the slave address. The device checks the polarity of the ext

40、ernal transistor at power on, or after software reset, by forcing current to DX1 pin while connecting DX2 pin to approximately 0.6 V. If the voltage on DX1 pin does not pull up to near the +VSof the device, DX1 pin functions as DXP for channel 1, and the second LSB of the slave address is “0”. If th

41、e voltage on DX1 pin does pull up to near +VS, the device forces current to DX2 while connecting DX1 pin to 0.6 V. If the voltage on DX2 pin does not pull up to near +VS, the device uses DX2 pin for DXP of channel 1, and sets the second LSB of the slave address to “1”. If both pins are shorted to GN

42、D or if both pins are open, the device uses DX1 pin as DXP and sets the address bit to “0”. This process is then repeated for channel 2 (DX3 and DX4 pins). If the device is to be used with transistors that are located on another integrated circuit (IC) (such as central processing unit (CPU), digital

43、 signal processor (DSP), or graphics processor), it is recommended to use DX1 pin or DX3 pin as DXP to ensure correct address detection. If the other IC has a lower supply voltage or is not powered when the device tries to detect the slave address, a protection diode may turn on during the detection

44、 process and the device may incorrectly choose the DXP pin and corresponding slave address. Using DX1 pin and/or DX3 pin for transistors that are on other ICs ensures correct operation independent of supply sequencing or levels. FIGURE 3. Connections for device address setup. Provided by IHSNot for

45、ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/11618 REV PAGE 12 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test require

46、ments as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, a

47、nd marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source