DLA MIL-DTL-19491 H-2002 SEMICONDUCTOR DEVICES PACKAGING OF《半导体设备包装》.pdf

1、 MIL-DTL-19491H 28 June 2002 SUPERSEDING MIL-S-19491G 26 June 1992 DETAIL SPECIFICATION SEMICONDUCTOR DEVICES, PACKAGING OF This specification is approved for use by all Departments and Agencies of the Department of Defense 1. SCOPE 1.1 Scope. This specification covers the requirements for the prese

2、rvation, packing, and container marking of semiconductor devices such as transistors and diodes (FSC 5961) (see 6.1). 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in ot

3、her sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification

4、, whether or not they are listed. 2.2 Government documents . 2.2.1 Specifications, standards, and handbooks . The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed

5、 in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATIONS FEDERAL A-A-59135 - Packaging Material, Sheet. A-A-59136 - Cushioning Material, Packaging, Closed Cell Foam Plank. A-A-55485 - Mountin

6、g Pads, Electrical-Electronic Component, General Requirements for. DEPARTMENT OF DEFENSE MIL-DTL-117 - Bags, Heat-Sealable. MIL-PRF-19500 - Semiconductor Devices, General Specification for. MIL-PRF-81705 - Barrier Materials, Flexible, Electrostatic Protective, Heat- Sealable. AMSC N/A AREA PACK DIST

7、RIBUTION STATEMENT A. Approved for public release; distribution is unlimited.INCH-POUND The documentation and process conversion measures necessary to comply with this revision shall be completed by 27 September 2002. Beneficial comments (recommendations, additions, deletions) and any pertinent data

8、 which may be of use in improving this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. Provided by I

9、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-19491H 2 STANDARDS FEDERAL FED-STD-123 - Marking for Shipment (Civil Agencies). DEPARTMENT OF DEFENSE MIL-STD-129 - Military Marking, Standard Practice for. MIL-STD-750 - Test Methods for Semiconductor Devic

10、es. MIL-STD-1686 - Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices). MIL-STD-2073-1 - DOD Standard Practice for Military Packaging. (Unless otherwise indicated, copies of the above

11、 specifications, standards, and handbooks are available from the Document Automation and Production Services (DAPS), Building 4D (DPM-DODSSP), 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications . The following documents form a part of this document to the extent specif

12、ied herein. Unless otherwise specified, the issues of the documents, which are DoD adopted are those listed in the issue of the DoDISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the issues of the documents cited in the solicitation (se

13、e 6.2). ASTM INTERNATIONAL ASTM-D3951 - Standard Practice for Commercial Packaging. (Application for copies should be addressed to ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, Pennsylvania, USA 19428-2959.) AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) ANSI/NSCL Z540.1 -

14、 Laboratories, Calibration, and Measuring and Test Equipment. INTERNATIONAL STANDARDS ORGANIZATION (ISO) ISO10012-1 - Equipment, Quality Assurance Requirements for Measuring - Part 1: Metrological Confirmation System for Measuring Equipment. (Application for copies should be addressed to American Na

15、tional Standards Institute (ANSI), 11 West 42nd Street, New York, NY 10036.) 2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable law

16、s and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-19491H 3 3. REQUIREMENTS 3.1 General. The packaging terms used herein shall be in accordance with the definitions listed in MIL-S

17、TD-129, MIL-STD-1686, MIL-STD-2073-1. The following general requirements apply, as applicable, to military or commercial packaging. 3.1.1 Shipments to Government activities . 3.1.1.1 Pairs and sets . Semiconductor devices furnished in pairs or sets under one national stock number (NSN) shall be unit

18、 packaged as one pair or one set, as applicable. When specified in a detail specification, matched diodes shall be packaged with a statement to that effect. Unless otherwise specified, unit of issue (each pair, set) shall be individually unit packed. 3.1.1.2 Hardware. Hardware accompanying semicondu

19、ctor devices shall be protected and enclosed within the unit pack in a manner that will not damage the device or pack. When practical or when the semiconductor devices are not otherwise protected, the hardware should be mounted on each device. 3.1.1.3 Physical protection. Semiconductor devices and a

20、ccessories shall be packaged in a manner that will ensure compliance with the applicable requirements of MIL-STD-2073-1 as well as those specified herein. 3.1.1.4 Wrapping and cushioning and lead protection for semiconductor devices . Leads and terminals, excluding axial leaded devices, shall be pro

21、tected by container design, die-cut inserts, vials, or non-corrosive supporting materials or devices to prevent damage to the item or packaging. Leads or terminals shall extend outward and be maintained in a configuration as manufactured without causing undue loads or stresses capable of causing dam

22、age to the devices. Materials used to maintain item position and lead configuration shall permit item removal and replacement without bending the leads. All semiconductor devices shall be wrapped or cushioned with non-corrosive materials, which shall not crumble, flake, powder, or shed. In addition,

23、 no static generating materials shall be used for semiconductor devices susceptible to electric field force damage. For these susceptible devices, materials conforming to type II or III of MIL-PRF-81705 or bags conforming to MIL-DTL-117, type 1, class A, style 2 shall be used as wraps or pouches, re

24、spectively. Alternatively, cushioning materials conforming to CID (Commercial Item Description) A-A-59135 for sheet material and A-A-59136 for plank material may be used. Any materials used shall be in accordance with MIL-STD-2073-1 for wrapping materials and for cushioning materials. No special pro

25、tection is required for axial leaded devices that are not electrostatic discharge sensitive (ESDS). 3.1.1.5 Electrostatic and electromagnetic shielding and corrosion protection. Electrostatic and electromagnetic shielding (as well as protection from corrosion, and contamination) shall be provided by

26、 placing the wrapped or cushioned semiconductor device in heat sealed bags fabricated with material conforming to MIL-DTL-117, type 1, class F, style 1. For immediate use applications and for those instances where no exposure to electrostatic or electromagnetic fields are anticipated, barrier materi

27、al conforming to type II or III of MIL-PRF-81705 may be used. Electrostatic and electromagnetic shielding protection shall be mandatory for all: a. Mixer diodes (microwave diodes). b. MOSFET transistors (insulated gate field effect). c. Junction field-effect transistors. d. Silicon controlled rectif

28、iers (SCR). e. Small signal Schottky diodes (Schottky barrier). f. RF (semiconductor devices not otherwise named which operate at a frequency above 1 gigahertz). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-19491H 4 3.1.2 Preservation. Pre

29、servation shall be military or commercial as specified herein (see 6.2). 3.1.2.1 Military. 3.1.2.1.1 Cleaning. Semiconductor devices and accessories shall be clean or be cleaned in accordance with MIL-STD-2073-1, if applicable. 3.1.2.1.2 Drying. Semiconductor devices and accessories shall be dry or

30、be dried in accordance with MIL-STD-2073-1, if applicable. 3.1.2.1.3 Preservatives. Contact preservatives shall not be used. 3.1.2.1.4 Unit packs . Semiconductor devices shall be unit packed one each and protected in accordance with the requirements contained herein and in MIL-DTL-117, for bags conf

31、orming to MIL-DTL-117, type I, class E, style I or II. 3.1.2.1.5 Intermediate containers . The use of intermediate containers shall be in accordance with MIL-STD-2073-1. 3.1.2.2 Commercial. Commercial packaging shall be in accordance with ASTM-D3951. 3.1.3 Packing. Packing shall be level A, B, or mi

32、nimal as specified in MIL-STD-2073-1 (see 6.2). 3.1.4 Marking. 3.1.4.1 Military. In addition to any special marking required by the contract or order, marking for military or commercial levels shall be in accordance with MIL-STD-129 and, when applicable, as specified in 3.1.4.1.1. 3.1.4.1.1 Special

33、requirements . When required by the contract or order, containers shall be marked as specified in 3.1.4.1.1.1 and 3.1.4.1.1.2. 3.1.4.1.1.1 ESDS electronic devices . Unit, intermediate, and exterior packs containing ESDS devices susceptible to damage from electric field forces (see MIL-HDBK-263 for d

34、efinition of electric field) shall be marked in accordance with MIL-STD-129 requirements. 3.1.4.1.1.2 MIL-PRF-19500 semiconductor devices, additional marking. The unit packs of those semiconductor devices acquired in conformance with MIL-PRF-19500, shall be additionally marked with the following: a.

35、 JAN prefix. b. Type designation. c. Manufacturers designating symbol. d. Assembly plant code. e. Lot identification code. f. Inspection date. g. Reinspection date (if reinspection is applicable). h. Country of origin. J. Serialization may be included as a serialization range of individual serialize

36、d devices. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-19491H 5 3.1.5 Civil agencies . When specified in the contract or order (see 6.2), the marking of domestic shipments for civil agencies shall be in accordance with FED-STD-123. 3.1.6

37、First article and conformance inspections . First article and conformance inspections and tests shall be required as specified in 4.4 and 4.5, respectively. Samples for these tests shall be furnished in accordance with the procedures outlined in 4.4 and 4.5. The performance of the visual and dimensi

38、onal inspections, rough handling tests, and leakage tests shall conform to the inspections and tests outlined in 4.6.1, 4.6.2.1, and 4.6.2.2, respectively. 3.1.6.1 Functional requirements . 3.1.6.1.1 Rough handling test (when specified (see 6.2). When packs have been tested in accordance with 4.6.2.

39、1, all material and components comprising each pack shall be free from damage or evidence of displacement, which might affect the use of the preservation method or pack. The semiconductor devices and associated accessories within the tested packs shall show no visible signs of damage. When specified

40、 in the contract or order (see 6.2), functional tests in accordance with the group A inspection requirements of the commodity specification shall be conducted on those semiconductor devices subjected to the rough handling test to determine freedom from operational malfunction. The examination of the

41、 devices tested under this group A inspection shall be in accordance with the visual and mechanical inspection requirements specified in test method 2071 of MIL- STD-750 or the commodity specification. 3.1.6.1.2 Leakage test (when applicable). When a barrier enclosed unit pack has been tes ted in ac

42、cordance with 4.6.2.2, there shall be no evidence of moisture within the unit pack. 3.2 Shipments to non-Government activities . 3.2.1 Non-ESDS semiconductor devices. Shipments to original equipment manufacturers (OEM) and packaging distributors shall be in accordance with ASTM-D3951. 3.2.2 ESDS sem

43、iconductor devices. Shipments of ESDS semiconductor devices to OEMs and packaging distributors shall conform to the requirements specified 3.1.1.5. 3.2.2.1 Packaging material surface resistivity. Tape and reel, waffle pack, and other type carriers used in packaging shall have a surface resistivity o

44、f less than 1012 ohms per square. 3.2.2.2 Container. Tape and reel, waffle pack, and other type carriers used in packaging, if required, shall be placed in a bag conforming to MIL-DTL-117, type I, class A, style 2 or class F, style 1 using barrier material conforming to MIL-PRF-81705 type I, II, or

45、III as specified (see 6.2.2). 3.3 Recycled, recovered, or environmentally preferable materials . Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements, and pr

46、omotes economically advantageous life cycle costs. 3.4 Workmanship. The quality of workmanship shall assure acceptance of the completed preservation, packing, and marking requirements in accordance with the inspections specified in section 4 herein. 4. VERIFICATION 4.1 Classification of inspections

47、. The inspections specified herein are classified as follows: a. Materials inspection (see 4.3). b. First article inspection (see 4.4). c. Conformance inspection (see 4.5). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-19491H 6 4.2 Test equ

48、ipment and inspection facilities . Test and measuring equipment and inspection facilities of sufficient accuracy and quality to permit performance of the required inspection shall be established and maintained by the contractor. The establishment and maintenance of a calibration system to control th

49、e accuracy of the measuring and test equipment shall be in accordance with ISO10012-1 or ANSI/NSCL Z540-1 or equivalent. 4.2.1 Inspection conditions. Unless otherwise specified, all inspections shall be performed in accordance with the test conditions specified in the general requirements of MIL- STD-750. 4.3 Materials inspection. Materials inspection shall consist of certification supported by verifying data that the materials used are in accordance with the applicable requirements