DLA MIL-DTL-83734 H SUPP 1-2007 SOCKETS PLUG-IN ELECTRIONIC COMPONENTS DUAL-IN-LINE (DIPS) AND SINGLE-IN-LINE PACKAGES (SIPS) GENERAL SPECIFICATION FOR《充电式ELECTRIONIC组件双列直插(DIPS)和单.pdf

1、 INCH-POUNDMIL-DTL-83734H 30 April 2007 SUPERSEDING MIL-DTL-83734G 7 July 1998 DETAIL SPECIFICATION SOCKETS, PLUG-IN ELECTRONIC COMPONENTS, DUAL-IN-LINE (DIPS) AND SINGLE-IN-LINE PACKAGES (SIPS), GENERAL SPECIFICATION FOR This specification is approved for use by all Departments and Agencies of the

2、Department of Defense. 1. SCOPE 1.1 Scope. This specification covers plug-in electronic component sockets for use on panel boards, printed circuit boards, and microelectronic components (see 6.1). 1.2 Classification. Sockets covered by this specification are of the following types, styles and config

3、urations, as specified (see 3.1). 1.2.1 Termination types. Type I - Solderless wrap terminals (see figure 1). Type II - Printed circuit terminals (see figure 1). 1.2.2 Contact styles. Style A: 2-piece contact. A 2-piece contact assembly with a closed bottom seamless outer sleeve and a multi-finger i

4、nner spring contact (4 maximum) Style B: Stamped and formed contact. A contact which, in its entirety, is made by stamping conforming 1.2.3 Insulator body configurations. Configuration 1- Solid body without mounting holes. Configuration 2- Open frame. Configuration 3- Solid body with mounting holes.

5、 Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, Attn: VAI, P.O. Box 3990, Columbus, Ohio, 43218-3990 or emailed to RectangularConnectordla.mil. Since contact information can change, you may want to verify the currency of this a

6、ddress information using the ASSIST Online database at http:/assist.daps.dla.mil. AMSC N/A FSC 5935 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-83734H 2 Inches mm .002 .006 .017 .024 .028 .030 .085 .135 .615 0.05 0.15 0.43 0.61 0.71 0.76

7、2.16 3.43 15.62 FIGURE 1. Terminal types. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-83734H 3 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for information only. 3. May be raised edges, used as guide. 4. Configurati

8、on and location are optional (minimum of 2). 5. Recommended hole size (for type II terminals only) .035 inch (0.89 mm) .003 inch (0.076 mm). FIGURE 1. Terminal types - Continued. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this sp

9、ecification. This section does not include documents cited in other sections of this specification or recommended of for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified req

10、uirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unl

11、ess otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-M-24519 - Molding Plastics, Electrical, Thermoplastic MIL-DTL-83505/1 - Sockets (Lead, Electronic Components) (Type I, Solderless Wrap) MIL-S-83505/2 - Soc

12、kets (Lead, Electronic Components) (Type II, Printed Circuit) (See supplement 1 for list of specification sheets.) DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts MIL-STD-790 - Established Reliability and High Reliability Qualified Products Li

13、st (QPL) Systems For Electrical, Electronic, and Fiber Optic Parts Specifications MIL-STD-810 - Environmental Engineering Considerations and Laboratory Tests MIL-STD-1285 - Marking of Electrical and Electronic Parts (Copies of these documents are available online at http:/assist.daps.dla.mil/quickse

14、arch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-83734H 4 2.3 Non-Government publications. The f

15、ollowing documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solitation or contract. ASTM INTERNATIONAL ASTM B16B16M - Rod, Bar, and Shapes for use in Screw Machines, Free Cutting Brass ASTM B103B103M

16、 - Bronze Plate, Sheets, Strip, and Rolled Bar, Phosphor ASTM B122B122M - Plate, Sheet, Strip, and Rolled Bar, Copper, Nickel-Tin Alloy, Copper Nickel Zinc Alloy (Nickel Silver), and Copper Nickel Alloy ASTM B139B139M - Rod, Phosphor Bronze, Bar, and Shapes ASTM B194 - Copper-Beryllium Alloy Plate,

17、Sheet, Strip, and Rolled Bar ASTM B196B196M - Rod and Bar, Copper Beryllium Alloy ASTM B488 - Electrodeposited Coatings of Gold for Engineering Uses ASTM B579 - Alloy, Tin-Lead (Solder Plate) Electrodeposited Coatings of ASTM B740 - Copper-Nickel-Tin Spinodal Alloy Strip, Standard Specification for

18、ASTM D4067 - Reinforced and Filled Poly (Phenylene Sulfide) (PPS) Injection Molding and Extrusion Materials ASTM-D5948 - Molding Compounds, Thermosetting (Copies of these documents are available online at http:/www.astm.org or from the ASTM International, P.O. Box C700, 100 Barr Harbor Drive, West C

19、onshohocken, PA 19428-2959.) ELECTRONIC INDUSTRIES ALLIANCE (EIA) EIA-364 - Electrical Connector/Socket Test Procedures Including Environmental Classifications EIA-364-20 - Withstanding Voltage Test Procedure for Electrical Connectors, Sockets and Coaxial Contacts EIA-364-21 - Insulation Resistance

20、Test Procedure for Electrical Connectors, Sockets, and Coaxial Contacts EIA-364-23 - Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets EIA-364-27 - Mechanical Shock (Specified Pulse) Test Procedure for Electrical Connectors EIA-364-28 - Vibration Test Procedure for El

21、ectrical Connectors and Sockets EIA-364-31 - Humidity Test Procedure for Electrical Connectors and Sockets EIA-364-32 - Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets EIA-364-71 - Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connector

22、s and Sockets (Copies of these documents are available online at http:/www.eia.org or from the Electronic Industries Alliance, Technology Strategy polyester-glass filled, type GPT-15F, GPT-20F, GPT-30F and GPT-30F in accordance with MIL-M-24519; polyphenylene sulfide-glass filled in accordance with

23、ASTM D4067, type PPS000G40A43443E1 1 (see 3.1). 3.4.2 Socket contacts (including termination). Unless otherwise specified, the socket contacts (including termination) shall be brass in accordance with ASTM B16B16M; beryllium-copper in accordance with ASTM B139B139M, ASTM B194, or ASTM B196B196M; cop

24、per-nickel-tin (C72900) in accordance with ASTM B740; phosphor bronze in accordance with ASTM B103B103M; copper-nickel alloy (C72500); or nickel-silver (CA77000) in accordance with ASTM B122B122M and shall meet the applicable requirements herein and as specified (see 3.1). 3.4.3 Contact plating guid

25、elines. Electrical contact plating shall be gold in accordance ASTM B488, code C, type 2, class 0.75, .00003 inch (0.0008 mm) thickness. 3.4.4 Contact finish. All contact finishes shall have an underplate of nickel in accordance with SAE-AMS-QQ-N-290, class 2, .00003 to .00015 inch (0.0008 to 0.0038

26、 mm) thick. When contacts have been provided in strip form, the absence of plating in the area where the contact was removed from the strip is acceptable provided it is in a nonfunctional area and any corrosion formed as a result of salt spray testing does not creep into the contact engagement area.

27、 3.4.4.1 Overall finish. All parts of the contact finish shall be gold in accordance with ASTM B488, code C, type 2, class 0.75, or tin-lead in accordance with ASTM B579, .0001 inch (0.003 mm) thick minimum (5 percent minimum lead) for those contacts having a solderless wrap termination and .0001 in

28、ch (0.003 mm) thick minimum (50 to 70 percent tin) for those contacts having wave solder tail terminations (see 3.1 and 3.4.3). 3.4.4.2 Localized finish contact engagement area. The finish shall be gold in accordance with ASTM B488, code C, type 2, class 0.75, or tin-lead in accordance with ASTM B57

29、9, .0001 inch (0.003 mm) thick minimum (5 percent minimum lead) (see figure 2 and 3.4.3). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-83734H 7 Inches mm .008 .015 .020 0.20 0.38 0.51 FIGURE 2. Localized finish for contact styles A and B.

30、3.4.4.3 Localized finish termination area. 3.4.4.3.1 Solderless wrappost. The finish shall be gold in accordance with ASTM B488, type 2, code C, type 1.25 or tin-lead in accordance with ASTM B579, .0001 inch thick minimum (5 percent minimum lead) (see 3.1 and 3.4.3). 3.4.4.3.2 Wave solder tail. The

31、finish shall be gold or tin-lead in accordance with ASTM B579, .0001 inch (0.003 mm) thick minimum (50 to 70 percent tin) (see 3.1 and 3.4.3). 3.4.4.3.3 Nonfunctional areas. Any portion of the contact other than the contact engagement or termination area shall be as specified in 3.4.4 or 3.4.4.1 (se

32、e 3.1). 3.4.5 Termination. The form factor and dimensions of the terminals shall be as specified (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-83734H 8 3.4.6 Contact identification. Contact identification shall be as specifi

33、ed (see 3.1). 3.4.7 Body design. The body shall be designed and constructed with proper sections and radii so that it will not crack, chip, or break in assembly or in normal service. Depressions, when used to achieve longer creepage paths, shall not cause structural weakness. 3.4.8 Polarization. A p

34、olarization feature (mechanical or visual) shall be incorporated in each socket to assist correct insertion. 3.4.9 Alignment. Sockets shall have a feature which will insure proper alignment of mating component leads. 3.4.10 Mounting. Sockets shall be mounted as specified (see 3.1). 3.4.11 Mounting s

35、tandoffs. Socket bodies intended to be soldered to a printed circuit board shall be provided with mounting bosses so that a minimum of .012 inch (0.30 mm) clearance is maintained between the mounting board and the socket body at each terminal location. 3.5 Performance. Connectors shall be designed t

36、o meet the performance requirements specified herein. 3.5.1 Test gauge mating force. When tested in accordance with 4.6.2, the maximum mating force shall be .75 pound (0.34 kg) times the number of contact positions. 3.5.2 Test gauge withdrawal force. When tested in accordance with 4.6.3, the withdra

37、wal force shall be not less than .5 ounce (14.7 grams). 3.5.3 Contact retention. When tested in accordance with 4.6.4, there shall be no damage or loosening of the contacts. For type II terminals (printed circuit), distortion of the solder tail shall not be considered damage. 3.5.4 Insulation resist

38、ance. When tested in accordance with 4.6.5, the initial insulation resistance shall be not less than 5,000 megohms. 3.5.5 Dielectric withstanding voltage. When tested in accordance with 4.6.6, there shall be no evidence of breakdown of insulation or flashover. 3.5.6 Low-signal level contact resistan

39、ce. When tested in accordance with 4.6.7, the socket contacts shall not exceed 20 milliohms initially. After exposure, the socket contacts shall not exceed the initial value by more than 10 milliohms. 3.5.7 Capacitance. When tested in accordance with 4.6.8, the capacitance shall not exceed two picof

40、arads. 3.5.8 Terminal strength (applicable to type I). Testing of terminals as specified in 4.6.9.1 and 4.6.9.2 shall not result in damage to the terminal. 3.5.9 Vibration. When tested in accordance with 4.6.10, there shall be no physical or mechanical damage to the socket body or contacts. During v

41、ibration, there shall be no interruption in continuity greater than 1 microsecond of the test circuit which incorporates mated contacts. After the test, the mounting hardware shall show no signs of loosening, fracture, or other deterioration, and the sockets shall meet the contact resistance require

42、ment of 3.5.6 and the test gauge withdrawal force of 3.5.2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-DTL-83734H 9 3.5.10 Mechanical shock. When tested in accordance with 4.6.11, there shall be no physical damage to the socket. During the t

43、est, there shall be no interruption in continuity greater than 1 microsecond of the test circuit which incorporates mated contacts. 3.5.11 Socket durability. When tested in accordance with 4.6.12, the sockets shall show no evidence of cracking or breaking. The contact resistance requirement of 3.5.6

44、 shall not be exceeded, and the test gauge withdrawal force requirement of 3.5.2 shall be met. 3.5.12 Temperature cycling. When a socket with a dummy plug-in fixture is tested in accordance with 4.6.13, there shall be no evidence of cracking or crazing of the body or other physical damage to the soc

45、ket. The socket component shall be capable of mating and unmating without damage to either component. 3.5.13 Humidity. When tested in accordance with 4.6.14, insulation resistance shall be not less than 300 megohms. 3.5.14 Corrosive atmosphere. When tested in accordance with 4.6.15, there shall be n

46、o evidence of porous plating or exposure of base metal on the contacting surfaces and the contact resistance requirement of 3.5.6 shall not be exceeded. 3.5.15 Solderability. Terminations shall withstand the test specified in 4.6.16. 3.5.16 Solder wicking. Socket bodies and terminals intended for so

47、ldering to a printed circuit board shall be tested in accordance with 4.6.17. The anti-wicking feature shall be an integral part of the socket design. 3.5.17 Resistance to soldering heat. Sockets shall withstand the test specified in 4.6.18. 3.5.18 Fungus. When tested in accordance with 4.6.19, ther

48、e shall be no evidence of fungus growth on the external surfaces. 3.6 Marking. Sockets shall be marked in accordance with method I of MIL-STD-1285, and shall include the military PIN (see 3.1), the manufacturers name or code symbol, and date code. Sockets with 12 or less contacts the military PIN sh

49、all be marked on the package. Sockets with 14 contacts or more shall be marked with the military PIN (as a minimum). 3.6.1 JAN brand. The United States Government has adopted, and is exercising legitimate control over the certification marks “JAN” “J”, respectively, to indicate that items so marked or identified are manufactured to, and meet all the requirements of specifications. Accordingly items