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本文(DLA MIL-PRF-19500 708 A-2011 DISPLAYS DIODE LIGHT EMITTING SOLID STATE RED NUMERIC AND HEXADECIMAL WITH ON BOARD DECODER DRIVER TYPES 4N51 4N52 4N53 AND 4N54 JAN AND JANTX.pdf)为本站会员(eventdump275)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA MIL-PRF-19500 708 A-2011 DISPLAYS DIODE LIGHT EMITTING SOLID STATE RED NUMERIC AND HEXADECIMAL WITH ON BOARD DECODER DRIVER TYPES 4N51 4N52 4N53 AND 4N54 JAN AND JANTX.pdf

1、 MIL-PRF-19500/708A 7 December 2011 SUPERSEDING MIL-PRF-19500/708 1 April 2003 * PERFORMANCE SPECIFICATION SHEET DISPLAYS, DIODE, LIGHT EMITTING, SOLID STATE, RED, NUMERIC AND HEXADECIMAL, WITH ON BOARD DECODER/DRIVER TYPES 4N51, 4N52, 4N53, AND 4N54, JAN AND JANTX This specification is approved for

2、 use by all Departments and Agencies of the Department of Defense. * The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for hermetically sealed red numeric

3、 and hexadecimal light emitting diode, 4 X 7 dot matrix array displays. Two levels of product assurance are provided as specified in MIL-PRF-19500. * 1.2 Part identification number. The part identification number scheme is as follows: JANQQ XN YY X X JAN brand and quality level (see 1.3.1 of MIL-PRF

4、-19500) Component designation (see 1.3.5 of MIL-PRF-19500) Identification number (see 1.3.6 of MIL-PRF-19500) Lead finish (see 1.2.4) Luminous intensity code (see 1.2.5) 1.2.1 Device type. Device types are as follows: Device type Function 4N51 Numeric indicator “0-9“, a “-“ sign, test pattern, and r

5、ight hand decimal point. 4N52 Numeric indicator “0-9“, a “-“ sign, test pattern, and left hand decimal point. 4N53 Numeric indicator “1“ overrange display with right hand decimal point. 4N54 Hexadecimal indicator “0-9“ and “A-F“. 1.2.2 Device quality level. The device quality levels are JAN and JANT

6、X as defined in MIL-PRF-19500. 1.2.3 Government certification mark. The certification mark JAN or the abbreviated prefix J indicates a performance specification item produced in full compliance with MIL-PRF-19500 and herein. AMSC N/A FSC 5980 INCH-POUND * Comments, suggestions, or questions on this

7、document should be addressed to DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.daps.d

8、la.mil/. The documentation and process conversion measures necessary to comply with this revision shall be completed by 7 March 2012. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/708A 2 * 1.2.4 Lead finish. The lead finishes are as s

9、pecified in 3.5. The lead finishes are designated by a single letter as follows: Finish letter Lead finish A Hot solder dip B Tin-lead plate C Gold plate NOTE: Finish letters are not be marked on the display or its packaging. This designation is provided for use in drawings, part lists, orders, or o

10、ther documentation where lead finishes A, B, or C are all considered acceptable and interchangeable without preference. * 1.2.5 Luminous intensity code. Luminous intensity codes are as follows: Luminous intensity code Minimum luminous intensity (1) Maximum luminous intensity (1) cd cd C 44 79 D 59 1

11、06 E 79 142 F 106 190 G 142 255 H 190 342 I 257 462 J 343 617 K 457 820 X (2) (2) (1) Test conditions are as specified in table I, subgroup 7. (2) The luminous intensity code “X“ is not to be marked on the display or its packaging. This designation is provided for use in drawings, parts lists, order

12、s, and other documentation. Where a luminous intensity code is required, it will be specified in the contract or order. (Due to the overlapping of the luminous intensity codes, it is recommended that the two adjacent categories be specified). 1.3 Physical dimensions. See figure 1. 1.4 Absolute maxim

13、um ratings. Maximum total power dissipation 4N51, 4N52, and 4N54 1/ - 935 mW. 4N53 2/ - 320 mW. Logic supply voltage (VCC) 3/ - 7.0 V dc. Voltage applied to input logic pins - 7.0 V dc. Voltage applied to blanking input 4N54- Vcc. Maximum solder temperature 4/ - 260C. Operating temperature range 5/

14、- -55C to +100C. Ambient storage temperature - -65C to +125C. _ 1/ VCC= 5.5 V dc (numeral 5 lighted for all types. Decimal point lighted on 4N51 and 4N52). 2/ IF= 10 mA dc for each LED. (Current limiting resistors will be used.) 3/ Voltage greater than VCC or lower than -0.5 V dc shall not be applie

15、d to any input as the excessive voltage may damage the on-board integrated circuit. Recommended voltage is 4.5 to 5.5 V dc. 4/ t 5 seconds at .062 inch (1.57 mm) below seating plane. 5/ RCA= 35C/W maximum. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-

16、,-,-MIL-PRF-19500/708A 3 Notes: 1. Dimensions are in inches. * 2. Millimeters are given for general information only. * FIGURE 1 Physical dimensions. Symbol Dimensions Inches Millimeters Min Max Min Max A .515 .545 13.08 13.84 B .400 10.20 C .275 .305 6.99 7.75 D .205 .235 5.21 5.97 E .045 .075 1.14

17、 1.91 F .105 .135 2.67 3.43 G .175 .205 4.45 5.18 H .125 .155 3.18 3.94 I .060 .090 1.52 2.29 J .135 .165 3.43 4.20 K .385 .415 9.78 10.54 L .585 .615 14.86 15.62 M .095 .125 2.41 3.18 N .155 .185 3.94 4.70 P .009 .015 .23 .38 R .120 .150 3.05 3.81 S .035 .065 .89 1.65 T .017 .023 .43 .58 V .095 .10

18、5 2.41 2.67 W 4 6 4 6 X 0 10 0 10 4N51 4N52 4N53 4N54 Marking per 3.6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/708A 4 1.5 Recommended operating conditions. Enable pulse width 6/ - - - - - - - - - - - - - - - 100 ns minimum. Set u

19、p time 6/ 7/ - - - - - - - - - - - - - - - - - - - 50 ns minimum. Hold time 6/ 8/ - - - - - - - - - - - - - - - - - - - - 50 ns minimum. Enable pulse rise time 6/ - - - - - - - - - - - - - 200 ns maximum. 2. APPLICABLE DOCUMENTS * 2.1 General. The documents listed in this section are specified in se

20、ctions 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they mu

21、st meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. * 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the e

22、xtent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. * DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. * DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for

23、 Semiconductor Devices. * (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or https:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) * 2.3 Order of precedence. Unless otherw

24、ise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

25、_ 6/ See figure 2 for timing diagrams of series logic. 7/ Minimum set-up time is the interval immediately preceding the positive going transition of the enable input, during which interval the data to be displayed will be maintained at the latch data inputs, to ensure its recognition. 8/ Minimum hol

26、d time is the interval immediately following the positive going transition of the enable input, during which interval the data to be displayed will be maintained at the latch data inputs, to ensure its continued recognition. Provided by IHSNot for ResaleNo reproduction or networking permitted withou

27、t license from IHS-,-,-MIL-PRF-19500/708A 5 3. REQUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a manufacturer authorized

28、by the qualifying activity for listing on the applicable qualified manufacturers list (QML) before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500 and as follows. IBHBlanking inp

29、ut current “1“ state. IBLBlanking input current “0“ state. IEHEnable high level input current. IELEnable low level input current. IIHLogic data input current “1“ state. IILLogic data input current “0“ state. tholdTime data will be held after positive transition of enable input. tsetupTime data will

30、be held before positive transition of enable input. tTLHEnable input pulse rise time. VBVoltage applied to blanking input. VBHBlanking high voltage; display blanked. VBL Blanking low voltage; display not blanked. VDP Voltage applied to decimal point. VE Voltage applied to enable input. VEH Enable in

31、put high voltage; data not being entered. VEL Enable input low voltage; data being entered. VI Voltage applied to input logic. VIH Logic data input voltage “1“ state. VIL Logic data input voltage “0“ state. v Luminous efficacy = Lumens/Watt. PEAK Peak wavelength. d Dominant wavelength. 3.4 Interface

32、 and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500 and on figure 1. Eutectic or epoxy die bonding may be used. When epoxy die bonding is used, the material, cure cycle, and other pertinent data shall be approved by the qualifying activity. 3.4.1 Termin

33、al connections. The terminal connections and functions shall be as specified on figures 1 and 2. 3.4.2 Truth tables. The truth tables and resultant displays of the binary data in the latches shall be as specified on figure 2. luminous power radiant power Provided by IHSNot for ResaleNo reproduction

34、or networking permitted without license from IHS-,-,-MIL-PRF-19500/708A 6 * 3.5 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). The lead fini

35、shes are designated by a single letter as follows: Finish letter Lead finish A Hot solder dip B Tin-lead plate C Gold plate NOTE: Finish letters are not to be marked on the display or its packaging. This designation is provided for use in drawings, part lists, orders, or other documentation where le

36、ad finishes A, B, or C are all considered acceptable and interchangeable without preference. 3.6 Marking. Marking shall be in accordance with MIL-PRF-19500 and as specified herein. At the option of the manufacturer, the marking may be on more than one line as shown by the following example: JANTX4N5

37、1 XX 3.7 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in 1.4, 1.5, and table I herein. 3.8 Electrical test requirements. The electrical test requirements shall be table I, group A as specified herein. 3.9 Workm

38、anship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and shall be free from other defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Classification of inspections. The inspection requirements specified herein are classified as f

39、ollows: a. Qualification inspection (see 4.2). b. Screening (see 4.3). c. Conformance inspection (see 4.5). 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and 4.4 herein. 4.2.1 Off-axis luminous intensity. Off-axis luminous intensity at 40 degrees fr

40、om the normal shall be measured in accordance with 4.5.4. Two samples shall be required and the minimum acceptable value of off-axis luminous intensity shall be 50 percent of the on-axis luminous intensity. 4.2.2 Dimming range capability. This test shall demonstrate dimming range capability. Two sam

41、ples shall be required and the dimming range shall be 1,000:1. Dimming range shall be measured in accordance with 4.5.6. 4.2.3 Display color and color uniformity. The purpose of this test is to determine that the color of the display falls visually within the required color range. Two displays shall

42、 be measured in accordance with 4.5.7 to determine dominant wavelength. Measurements shall fall between 625 and 660 nanometers for acceptable units. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/708A 7 4.3 Screening (JANTX only). Scre

43、ening shall be in accordance with table E-IV of MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see table E-IV of MIL-PRF-19500) Conditions 1B See 4.3.

44、1. 2 Not required. 3A Condition B (10 cycles) Dwell = 10 minutes. Transfer time 5 minutes. 4 10,000 G Y1, for 1 minute, minimum. 7A Test condition G or H maximum leak rate = 5 X 10-8atm cm3 / s. 7B Test condition A, C, E, or F. 9 Subgroups 1 and 7 of table 1 herein. 10A 160 hours at TA= 100C. See 4.

45、3.2 and figure 3. 11 Subgroups 1 and 7 of table I herein. 13 Iv= -20 percent of group A value; IIH1= 10 A dc. ICC1= 10 mA dc; IEH1= 13 A dc. 16 External visual. 4.3.1 Internal visual (precap) inspection. Internal visual (precap) inspection shall be in accordance with method 2072 of MIL-STD-750, exce

46、pt crack rejection criteria shall be as follows: a. Any crack which extends into an active region or through a guard ring. b. Any crack that exceeds 1.0 mils in length inside the scribe grid or scribe line that points toward operating metallization or functional elements. c. Any crack that exceeds 5

47、.0 mils in length. 4.3.2 Burn-in. The burn-in test circuits shall be as specified on figure 3. All displays shall be cooled in accordance with 4.5.1. 4.3.3 Visual and mechanical inspection. Displays shall be examined under a magnification between 3X and 10X with a field of view sufficiently large to

48、 contain the entire display. Displays that exhibit any of the following criteria shall be rejected: a. Lead identification, markings (content, placement, and legibility), materials, construction, and workmanship not in accordance with MIL-PRF-19500. b. Defects or damage resulting from manufacturing, handling, or testing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

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