DLA MIL-PRF-19500 741 A-2009 SEMICONDUCTOR DEVICE FIELD EFFECT RADIATION HARDENED (TOTAL DOSE AND SINGLE EVENT EFFECTS) TRANSISTOR DIE N-CHANNEL AND P-CHANNEL SILICON VARIOUS TYPES.pdf

1、 MIL-PRF-19500/741A 30 January 2009 SUPERSEDING MIL-PRF-19500/741 14 March 2006 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED (TOTAL DOSE AND SINGLE EVENT EFFECTS) TRANSISTOR DIE, N-CHANNEL AND P-CHANNEL, SILICON, VARIOUS TYPES, JANHC AND JANKC This specifica

2、tion is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for N-channel and

3、 P-channel, enhancement-mode, MOSFET, radiation hardened (total dose and single event effects (SEE), power transistor die. Two levels of product assurance are provided for each device type as specified in MIL-PRF-19500. 1.2 Physical dimensions. See figures 1 through 8 herein. 1.3 Maximum ratings. Se

4、e the applicable performance specification sheet from table I herein. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recomme

5、nded for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. AMSC

6、N/A FSC 5961 METRIC Comments, suggestions, or questions on this document should be addressed to Defense Supply Center, Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordscc.dla.mil. Since contact information can change, you may want to verify the currency

7、of this address information using the ASSIST Online database at http:/assist.daps.dla.mil/. The documentation and process conversion measures necessary to comply with this revision shall be completed by 30 April 2009. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen

8、se from IHS-,-,-MIL-PRF-19500/741A 2 2N7467, 2N7478, 2N7468, 2N7470 Dimensions Ltr. Micrometers Mils Tolerance A 8634.0 339.9 B 6602.0 259.9 200 m (7.87 mils) Die bond pad coordinates Micrometers Mils Key X Y X Y Tolerance 1 0 0 0 0 2 541.00 0 21.299 0 3 0 538.30 0 21.193 4 541.0 538.30 21.299 21.19

9、3 5 -424.1 2005.1 -16.7 78.941 6 969.0 2005.1 38.15 78.941 7 -424.1 3397.5 -16.7 133.76 8 969.0 3397.5 38.15 133.76 9 -424.1 4814.1 -16.7 189.53 10 965.1 4814.1 37.996 189.53 11 -424.1 6033.1 -16.7 237.52 12 965.1 6033.1 37.996 237.52 5 m (0.2 mils) NOTES: 1. Dimensions are in micrometers. Mils are

10、given for general information only. 2. Top metal: Aluminum, 8 m (0.31 mils) thick. 3. Back metal: Titanium, nickel, silver, 0.1, 0.2, 0.25 m thick, respectively. 4. All dimensions are valid for all radiation hardness levels specified. 5. Backside metal is the drain connection. 6. Die thickness: 330

11、m (13 mils). 7. For sawn die, outline dimensions (A and B) will be reduced by 25 m (0.98 mils), due to saw kerf. 8. Die bond pad coordinates are provided for use in automated bonding equipment. Key locations 1 through 12 refer to adjacent gate(G)/source(S) pad corners. Key 2 through 12 are relative

12、to Key 1. 9. See 6.5 for ordering information. FIGURE 1. JANHC and JANKC A-version die dimensions, 2N7467, 2N7478, 2N7468, and 2N7470. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/741A 3 2N7469, 2N7471, 2N7472, 2N7475, 2N7473, 2N7476

13、, 2N7474, 2N7477, 2N7549, 2N7550 Dimensions Micrometers Mils Ltr. Min Max Min Max ToleranceA 9144.0 360.0 B 6602.0 259.9 200 m (7.87 mils)Die bond pad coordinates Micrometers Mils Key X Y X Y Tolerance1 0 0 0 0 2 541.0 0 21.299 0 3 0 538.3 0 21.193 4 541.0 538.3 21.299 21.193 5 -424.1 2199.6 -16.7 8

14、6.598 6 969.0 2199.6 38.150 86.598 7 -424.1 3592.0 -16.7 141.42 8 969.0 3592.0 38.150 141.42 9 -424.1 5013.9 -16.7 197.40 10 965.1 5013.9 37.996 197.40 11 -424.1 6232.9 -16.7 245.39 12 965.1 6232.9 37.996 245.39 5 m (0.2 mils) NOTES: 1. Dimensions are in micrometers. Mils are given for general infor

15、mation only. 2. Top metal: Aluminum, 8 m (0.31 mils) thick. 3. Back metal: Titanium, nickel, silver, 0.1, 0.2, 0.25 m thick, respectively. 4. All dimensions are valid for all radiation hardness levels specified. 5. Backside metal is the drain connection. 6. Die thickness: 330 m (13 mils). 7. For saw

16、n die, outline dimensions (A and B) will be reduced by 25 m (0.98 mils), due to saw kerf. 8. Die bond pad coordinates are provided for use in automated bonding equipment. Key locations 1 through 12 refer to adjacent gate (G)/source (S) pad corners. Key 2 through 12 are relative to Key 1. 9. See 6.5

17、for ordering information. FIGURE 2. JANHC and JANKC A-version die dimensions, 2N7469, 2N7471, 2N7472, 2N7475, 2N7473, 2N7476, 2N7474, 2N7477, 2N7549, 2N7550. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/741A 4 2N7479, 2N7482, 2N7491,

18、 2N7494, 2N7480, 2N7483, 2N7492, 2N7495 Dimensions Ltr. Micrometers Mils ToleranceA 4604.3 181.3 B 2946.4 116.0 200 m (7.87 mils)Die bond pad coordinates Micrometers Mils Key X Y X Y Tolerance1 0 0 0 0 2 685.9 0 27.004 0 3 0 509.9 0 20.075 4 685.9 509.9 27.004 20.075 5 -206.1 3474.3 -8.114 136.78 6

19、871.9 3474.3 34.327 136.78 7 -206.1 4235.4 -8.114 166.75 8 871.9 4235.4 34.327 166.75 5 m (0.2 mils) NOTES: 1. Dimensions are in micrometers. Mils are given for general information only. 2. Top metal: Aluminum, 8 m (0.31 mils) thick. 3. Back metal: Titanium, nickel, silver, 0.1, 0.2, 0.25 m thick, r

20、espectively. 4. All dimensions are valid for all radiation hardness levels specified. 5. Backside metal is the drain connection. 6. Die thickness: 330 m (13 mils). 7. For sawn die, outline dimensions (A and B) will be reduced by 25 m (0.98 mils), due to saw kerf. 8. Die bond pad coordinates are prov

21、ided for use in automated bonding equipment. Key locations 1 through 8 refer to adjacent gate/source pad corners. Key 2 through 8 are relative to Key 1. 9. See 6.5 for ordering information. FIGURE 3. JANHC and JANKC A-version die dimensions, 2N7479, 2N7482, 2N7491, 2N7494, 2N7480, 2N7483, 2N7492, 2N

22、7495. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/741A 5 2N7481, 2N7484, 2N7493, 2N7496, 2N7545, 2N7547 Dimensions Ltr Micrometers Mils ToleranceA 4604.3 181.3 B 2946.4 116.0 200 m (7.87 mils)Die bond pad coordinates Micrometers Mil

23、s Key X Y X Y Tolerance1 0 0 0 0 2 685.9 0 27.004 0 3 0 509.9 0 20.075 4 685.9 509.9 27.004 20.075 5 -206.1 3398.5 -8.114 133.8 6 871.9 3398.5 34.327 133.8 7 -206.1 4155.6 -8.114 163.61 8 871.9 4155.6 34.327 163.61 5 m (0.2 mils) NOTES: 1. Dimensions are in micrometers. Mils are given for general in

24、formation only. 2. Top metal: Aluminum, 8 m (0.31 mils) thick. 3. Back metal: Titanium, nickel, silver, 0.1, 0.2, 0.25 m thick, respectively. 4. All dimensions are valid for all radiation hardness levels specified. 5. Backside metal is the drain connection. 6. Die thickness: 330 m (13 mils). 7. For

25、sawn die, outline dimensions (A and B) will be reduced by 25 m (0.98 mils), due to saw kerf. 8. Die bond pad coordinates are provided for use in automated bonding equipment. Key locations 1 through 8 refer to adjacent gate/source pad corners. Key 2 through 8 are relative to Key 1. 9. See 6.5 for ord

26、ering information. FIGURE 4. JANHC and JANKC A-version die dimensions, 2N7481, 2N7484, 2N7493, 2N7496, 2N7545, and 2N7547. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/741A 6 2N7485, 2N7488, 2N7497, 2N7500, 2N7486, 2N7489, 2N7498, 2N

27、7501, 2N7487, 2N7490, 2N7499, 2N7502, 2N7546, 2N7548 Dimensions Ltr. Micrometers Mils ToleranceA 4604.3 181.3 B 2946.4 116.0 200 m (7.87 mils)Die bond pad coordinates Micrometers Mils Key X Y X Y Tolerance1 0 0 0 0 2 685.9 0 27.004 0 3 0 508.0 0 20.000 4 685.9 508.0 27.004 20.000 5 -206.1 3357.3 -8.

28、114 132.18 6 891.9 3357.3 35.114 132.18 7 -206.1 4358.0 -8.114 171.58 8 891.9 4358.0 35.114 171.58 5 m (0.2 mils) NOTES: 1. Dimensions are in micrometers. Mils are given for general information only. 2. Top metal: Aluminum, 8 m (0.31 mils) thick. 3. Back metal: Titanium, nickel, silver, 0.1, 0.2, 0.

29、25 m thick, respectively. 4. All dimensions are valid for all radiation hardness levels specified. 5. Backside metal is the drain connection. 6. Die thickness: 203 m (8 mils). 7. For sawn die, outline dimensions (A and B) will be reduced by 25 m (0.98 mils), due to saw kerf. 8. Die bond pad coordina

30、tes are provided for use in automated bonding equipment. Key locations 1 through 8 refer to adjacent gate/source pad corners. Key 2 through 8 are relative to Key 1. 9. See 6.5 for ordering information. FIGURE 5. JANHC and JANKC A-version die dimensions, 2N7485, 2N7488, 2N7497, 2N7500, 2N7486, 2N7489

31、, 2N7498, 2N7501, 2N7487, 2N7490, 2N7499, 2N7502, 2N7546, and 2N7548. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/741A 7 2N7519, 2N7520 Dimensions Ltr. Micrometers Mils ToleranceA 4610.8 181.5 B 2946.4 116.0 200 m (7.87 mils)Die bon

32、d pad coordinates Micrometers Mils Key X Y X Y Tolerance1 0 0 0 0 2 541 0 21.299 0 3 0 537.6 0 21.165 4 541 537.6 21.299 21.165 5 72 929.9 2.835 36.610 6 1170 929.9 46.063 36.610 7 72 4017.9 2.835 158.185 8 1170 4017.9 46.063 158.185 5 m (0.2 mils) NOTES: 1. Dimensions are in micrometers. Mils are g

33、iven for general information only. 2. Top metal: Aluminum, 8 m (0.31 mils) thick. 3. Back metal: Titanium, nickel, silver, 0.1, 0.2, 0.25 m thick, respectively. 4. All dimensions are valid for all radiation hardness levels specified. 5. Backside metal is the drain connection. 6. Die thickness: 203 m

34、 (8 mils). 7. For sawn die, outline dimensions (A and B) will be reduced by 25 m (0.98 mils), due to saw kerf. 8. Die bond pad coordinates are provided for use in automated bonding equipment. Key locations 1 through 8 refer to adjacent gate (G)/source pad corners. Key 2 through 8 are relative to Key

35、 1. 9. See 6.5 for ordering information. FIGURE 6. JANHC and JANKC A-version die dimensions, 2N7519 and 2N7520. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/741A 8 2N7523, 2N7524 Dimensions Ltr. Micrometers Mils ToleranceA 9144 360.0

36、 B 6604 260.0 200 m (7.87 mils)Die bond pad coordinates Micrometers Mils Key X Y X Y Tolerance1 0 0 0 0 2 541 0 21.299 0 3 0 538.3 0 21.193 4 541 538.3 21.299 21.193 5 73.7 1023 2.902 40.276 6 1528.8 1023 60.189 40.276 7 73.7 7737 2.902 304.606 8 1528.8 7737 60.189 304.606 5 m (0.2 mils) NOTES: 1. D

37、imensions are in micrometers. Mils are given for general information only. 2. Top metal: Aluminum, 8 m (0.31 mils) thick. 3. Back metal: Titanium, nickel, silver, 0.1, 0.2, 0.25 m thick, respectively. 4. All dimensions are valid for all radiation hardness levels specified. 5. Backside metal is the d

38、rain connection. 6. Die thickness: 203 m (8 mils). 7. For sawn die, outline dimensions (A and B) will be reduced by 25 m (0.98 mils), due to saw kerf. 8. Die bond pad coordinates are provided for use in automated bonding equipment. Key locations 1 through 8 refer to adjacent gate (G)/source pad corn

39、ers. Key 2 through 8 are relative to Key 1. 9. See 6.5 for ordering information. FIGURE 7. JANHC and JANKC A-version die dimensions, 2N7523 and 2N7524. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/741A 9 2N7503, 2N7506, 2N7518 N or P

40、 channel, 2N7521, 2N7525, 2N7522, 2N7526 Dimensions Ltr. Micrometers Mils ToleranceA 2542.9 100.1 B 2010.0 79.1 200 m (7.87 mils)Die bond pad coordinates Micrometers Mils Key X Y X Y Tolerance1 0 0 0 0 2 685.9 0 27.004 0 3 0 502.0 0 19.764 4 685.9 502.0 27.004 19.764 5 -10.0 1560.5 -0.394 61.437 6 6

41、95.8 1560.5 27.394 61.437 7 -10.0 2099.9 -0.394 82.673 8 695.8 2099.9 27.394 82.673 5 m (0.2 mils) NOTES: 1. Dimensions are in micrometers. Mils are given for general information only. 2. Top metal: Aluminum, 8 m (0.31 mils) thick. 3. Back metal: Titanium, nickel, silver, 0.1, 0.2, 0.25 m thick, res

42、pectively. 4. All dimensions are valid for all radiation hardness levels specified. 5. Backside metal is the drain connection. 6. Die thickness: 330 m (13 mils). 7. For sawn die, outline dimensions (A and B) will be reduced by 25 m (0.98 mils), due to saw kerf. 8. Die bond pad coordinates are provid

43、ed for use in automated bonding equipment. Key locations 1 through 8 refer to adjacent gate/source pad corners. Key 2 through 8 are relative to Key 1. 9. See 6.5 for ordering information. * FIGURE 8. JANHC and JANKC A-version die dimensions, 2N7503, 2N7506, 2N7518-N or P channel, 2N7521, 2N7525, 2N7

44、522, and 2N7526. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/741A 10 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to th

45、e extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for

46、Semiconductor Devices. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) * 2.3 Order of precedence. Unless otherwise n

47、oted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. RE

48、QUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500. 3.4 Interface and physical dimensions. Interface and p