DLA MIL-PRF-49464 C-2009 CAPACITORS CHIP SINGLE LAYER FIXED PARALLEL PLATE CERAMIC DIELECTRIC ESTABLISHED RELIABILITY GENERAL SPECIFICATION FOR.pdf

1、AMSC N/A FSC 5910 INCH-POUND MIL-PRF-49464C SUPERSEDING 24 June 2009 MIL-PRF-49464B 3 June 2004 PERFORMANCE SPECIFICATION CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR This specification is approved for use by all Depart

2、ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the general requirements for ceramic plate, single layer capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz and higher. Capacitors covered b

3、y this specification have failure rate levels (FRL) ranging from 1.0 to 0.001 percent per 1,000 hours. These failure rate levels are established at a 90-percent confidence level and maintained at a 10-percent producers risk. They are based on life tests performed at a maximum rated voltage at maximu

4、m rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. Statistical Process Control (SPC) techniques are required in the manufacturing process to minimize v

5、ariation in production of capacitors supplied to the requirements of this specification. 1.2 Classification. Capacitors covered by this specification are classified by the style, as specified (see 3.1). 1.2.1 Part or Identifying Number (PIN). Capacitors specified herein (see 3.1) are identified by a

6、 PIN which consists of the basic number of the performance specification and a series of coded characters. The coded characters provide information concerning the capacitors temperature coefficient, specification sheet number, capacitance value, capacitance tolerance, voltage, case code, termination

7、 finish, and failure rate level. The PIN is in the following form: M49464 F 01 1R0 B B J A H | | | | | | | | | | M Performance Temperature Specification Capacitance Capacitance Voltage Case code Termination Termination FRL specification coefficient sheet value tolerance (1.2.1.4) (1.2.1.5) configura

8、tion finish (1.2.1.8) number (1.2.1.1) number (1.2.1.2) (1.2.1.3) code (1.2.1.7) (1.2.1.6) 1.2.1.1 Temperature coefficient limits. The rated temperature and temperature coefficient limits are identified by a single letter. The rated temperature of these parts is -55C to +125C. The letter indicates t

9、he temperature coefficient limits as shown in table I. Comments, suggestions or questions on this document should be addressed to Defense Supply Center Columbus, ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990, or emailed to capacitorfilterdla.mil. Since contact information can change, you

10、may want to verify the currency of this address information using the ASSIST Online database at http:/assist.daps.dla.mil. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49464C 2 TABLE I. Temperature coefficient limits. Symbol Capacitance ch

11、ange with temperature Class F 0 25 ppm/C 1A G 0 30 ppm/C 1A W 20 percent 2 1.2.1.2 Capacitance. The nominal capacitance value expressed in picofarads (pF) is identified by a three-digit number; the first two digits represent significant figures and the last digit specifies the number of zeros to fol

12、low. When the nominal value is less than 10 pF, the letter “R“ is used to indicate the decimal point and the succeeding digit(s) of the group represent significant figure(s). For example, 1R0 indicates 1.0 pF and 0R5 indicates 0.5 pF. 1.2.1.3 Capacitance tolerance. The capacitance tolerance is ident

13、ified by a single letter in accordance with table II. TABLE II. Capacitance tolerance. Symbol Capacitance tolerance A .05 pF B .10 pF C .25 pF D .50 pF J 5 percent K 10 percent M 20 percent 1.2.1.4 Rated voltage. The rated voltage for continuous operation at +125C is identified by a single letter as

14、 shown in table III. TABLE III. Rated voltage. Symbol Rated voltage A 16 B 25 C 50 D 100 1.2.1.5 Case code. The case code is identified by a single letter (see 3.1). 1.2.1.6 Termination configuration code. There are three termination configurations available (see 3.1): A - Borders on top and bottom,

15、 B - Border on top and full metallization on bottom, and C - Full metallization on top and bottom. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49464C 3 1.2.1.7 Termination finish. The termination finish is identified by the letter H. H: A

16、 minimum of 100 microinches of 99.99 percent gold, on both sides. This is suitable for gold wire bonding and conductive epoxy or AuSn eutectic die attachment. 1.2.1.8 Failure rate level (FRL). The FRL is identified by a single letter as shown in table IV. TABLE IV. FRL. Symbol FRL (percent per 1,000

17、 hours) M 1.0 P 0.1 R 0.01 S 0.001 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as

18、examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of the documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specificat

19、ions. standards. and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (See 6.2). DEPARTMENT OF DEFENSE SPECIFICATION

20、S MIL-PRF-49464/1 - Capacitors, Chip, Single Layer, Fixed Unencapsulated, Ceramic Dielectric, Established Reliability, Style CPCR01 (High Frequency). DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Component Parts, Test Methods for. MIL-STD-690 - Failure Rate Sampling Plans a

21、nd Procedures. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-810 - Environmental Engineering Considerations and Laboratory Tests. MIL-STD-883 - Test Meth

22、ods and Procedures for Microelectronics. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents f

23、orm a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) EIA-557 - Statistical Process Control Systems. (DoD Adopted). (Copies of these documents are ava

24、ilable from http:/ or Global Engineering Documents, Attn: Customer Service Department, 15 Inverness Way East, Englewood CO 80112-5776.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49464C 4 2.4 Order of precedence. Unless otherwise noted h

25、erein or in the contract, in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specifi

26、c exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the applicable specification sheet. In the event of any conflict between the requirements of this specification and the specification sheet, t

27、he latter shall govern. 3.2 Qualification. Capacitors furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable qualified products list (QPL) before contract award. In addition, the manufacturer shall obtain certification from t

28、he qualifying activity that the QPL system requirements of 3.3 and 4.2 have been met and are being maintained. Authorized distributors who are approved to MIL-STD-790 distributor requirements by the QPL manufacturer are listed in the QPL. 3.3 QPL system. The manufacturer shall establish and maintain

29、 a QPL system for parts covered by this specification. Requirements for this system are specified in MIL-STD-690 and MIL-STD-790. In addition, the manufacturer shall establish a Statistical Process Control (SPC) system that meets the requirements of 3.3.1. 3.3.1 SPC system. As part of the overall MI

30、L-STD-790 QPL system, the manufacturer shall establish an SPC system which meets the requirements of EIA-557. Typical manufacturing processes for application of SPC include raw material mixing and blending, dielectric sheet manufacturing, metallization, cutting, and firing. 3.4 Materials. Materials

31、shall be as specified herein. However, when a definite material is not specified, a material shall be used which will enable the capacitors to meet the performance requirements of this specification. Acceptance or approval of any constituent material shall not be construed as a guarantee of the acce

32、ptance of the finished product. 3.4.1 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of capacitor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (se

33、e 6.8). 3.5 Interface and physical dimension requirements. Capacitors shall meet the interface and physical dimensions specified (see 3.1). 3.5.1 Body structure. The body shall be a single ceramic plate or a single ceramic plate with buried electrodes and multiple via connections that meets the requ

34、irements specified herein (see 3.1). 3.6 Thermal shock and voltage conditioning. When tested as specified in 4.8.3, capacitors shall withstand the extremes of high and low temperature without visible damage and meet the following requirements: a. Capacitance (at +25C): Shall be within the tolerance

35、as specified in 3.7. b. Dissipation factor (at +25C): Shall not exceed the value as specified in 3.8. c. Insulation resistance (at +25C): Shall not be less than the value specified in 3.9. d. Dielectric withstanding voltage (at +25C): Shall be as specified in 3.10. Not applicable if optional voltage

36、 conditioning was performed at or above 250 percent of rated voltage. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49464C 5 3.7 Capacitance. When measured as specified in 4.8.4, the capacitance shall be within the specified tolerance (see

37、3.1). 3.8 Dissipation factor. When determined as specified in 4.8.5, the dissipation factor for capacitors of 4.7 pF or greater shall not exceed: Symbol F and G characteristics: 0.15 percent Symbol W: 50 and 100 volts 2.5 percent Symbol W: 16 and 25 volts 3.5 percent 3.9 Insulation resistance. When

38、measured as specified in 4.8.6, the insulation resistance at +25C shall be not less than 105megohms. At +125C it should not be less than 104megohms. 3.10 Dielectric withstanding voltage. When capacitors are tested as specified in 4.8.7, there shall be no evidence of breakdown or visible evidence of

39、arcing or damage. 3.11 Bond strength. When tested as specified in 4.8.8, bond strength shall be at least 3.0 grams force, and there shall be no fracturing of the bond at the wire to electrode interface or separation of the electrode from the dielectric. 3.12 Die shear strength. When tested as specif

40、ied in 4.8.9, parts shall not shear from their mountings within the gram force limits specified. 3.13 Temperature coefficient limits. When capacitors are tested as specified in 4.8.10, the capacitance change shall not exceed the limits specified in table I. 3.14 Immersion. When tested as specified i

41、n 4.8.11, capacitors shall meet the following requirements: a. Visual examination: No mechanical damage. b. Dielectric withstanding voltage: As specified in 3.10. c. Insulation resistance (+25C): Not less than 30 percent of the initial requirement (see 3.9). d. Capacitance change: (1) Symbols F and

42、G: Shall change not more than 0.5 percent of the nominal value or 0.5 pF, whichever is greater, from the initial value. (2) Symbol W: Shall change not more than 10 percent from the initial measured value. e. Dissipation factor: Shall be as specified in 3.8. 3.15 Humidity, steady state, low voltage.

43、When tested as specified in 4.8.12, capacitors shall meet the following requirements: a. Visual examination: No mechanical damage. b. Insulation resistance (+25C): Shall meet the initial +25C requirement (see 3.9). c. Capacitance change: (1) Symbols F and G: Shall change not more than 0.5 percent of

44、 the nominal value or 0.5 pF from the initial value, whichever is greater. (2) Symbol W: Shall change not more than 10 percent from the initial measured value. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-49464C 6 3.16 Life (at +125C). Whe

45、n tested as specified in 4.8.13, capacitors shall meet the following requirements: a. Visual examination: No mechanical damage. b. Insulation resistance (at +125C): Shall not be less than 30 percent of initial requirement (see 3.9). c. Insulation resistance (at +25C): Shall not be less than 30 perce

46、nt of initial requirement (see 3.9). d. Capacitance change: (1) Symbols F and G: Shall change not more than 2.0 percent of the nominal value or 0.5 pF from the initial value, whichever is greater. (2) Symbol W: Shall change not more than 10 percent from the initial measured value. e. Dissipation fac

47、tor: Shall be as specified in 3.8. 3.17 Fungus. The manufacturer shall certify that all materials are fungus resistant or shall perform the test as specified in 4.8.14. When capacitors are tested as specified in 4.8.14, there shall be no evidence of fungus growth on the external surface. 3.18 Markin

48、g. There shall be no marking on the capacitors. Capacitor packaging containers shall be marked with the PIN, capacitance, capacitance tolerance, voltage, date code and lot symbol, “JAN” brand, and the Commercial and Government Entity (CAGE) code. 3.18.1 JAN and J marking. The United States Governmen

49、t has adopted and is exercising legitimate control over the certification marks “JAN“ and “J“, respectively, to indicate that items so marked or identified are manufactured to, and meet all the requirements of specifications. Accordingly, items acquired to, and meeting all of the criteria specified herein and in applicable specifications shall bear the certification mark “JAN“ except that items too