DLA MIL-STD-1276 H-2013 LEADS FOR ELECTRONIC COMPONENT PARTS.pdf

1、 AMSC N/A FSC 5999 INCH-POUND MIL-STD-1276H 02 January 2013 SUPERSEDING MIL-STD-1276G 14 March 2005 DEPARTMENT OF DEFENSE INTERFACE STANDARD LEADS FOR ELECTRONIC COMPONENT PARTS Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1276H ii FOREWOR

2、D 1. This standard is approved for use by all Departments and Agencies of the Department of Defense. 2. Comments, suggestions, or questions on this document should be addressed to: DLA Land and Maritime, ATTN: VAT, PO Box 3990, Columbus, OH 43218-3990, or emailed to Relaydla.mil. Since contact infor

3、mation can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.dla.mil/. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1276H iii CONTENTS PARAGRAPH PAGE FORWARD ii 1. SCO

4、PE 1 1.1 Scope 1 1.2 Classification . 1 1.2.1 Type designator 1 1.2.1.1 Cross section 1 1.2.1.2 Nominal size . 1 1.2.1.3 Composition 1 1.2.1.4 Final finish . 1 1.2.1.5 Underplating . 1 2. APPLICABLE DOCUMENTS 3 2.1 General . 3 2.2 Government documents 3 2.2.1 Specifications, standards, and handbooks

5、 3 2.3. Non-Government publications . 3 2.4. Order of precedence . 4 3. DEFINITIONS 5 3.1 Definitions . 5 4. GENERAL REQUIREMENTS . 6 4.1 Preferred methods of assembly 6 4.2 Solderability 7 4.3 Thickness 7 4.4 Adhesion . 7 4.5 Porosity . 7 4.6 Recycled, recovered, or environmentally preferable mater

6、ials 7 4.7 Pure tin . 7 4.8 Workmanship in finishes . 7 5. DETAILED REQUIREMENTS . 8 5.1 Composition 8 5.2 Final finish . 9 5.2.1 Underplating . 10 5.2.1.1 Gold plating . 10 5.2.1.2 Composition F, G, and K . 10 5.2.1.3 Hot solder dip 10 5.2.1.4 Composition A, B, J, and X . 10 6. NOTES 11 6.1 Intende

7、d use . 11 6.2 Precaution . 11 6.3 Removal of gold plating before soldering 11 6.4 Passive nickel . 11 6.5 Cross reference 11 6.6 Environmentally preferable material 12 6.7 Cleanliness . 12 6.8 Supersession data 12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license

8、from IHS-,-,-MIL-STD-1276H iv 6.9 Subject term (key word) listing 13 6.10 Changes from previous issue 13 TABLES I. Nominal size. 2 II. Preferred methods of assembly 6 III. Chemical Composition 8 IV. Cross reference of lead types . 11 V. Supersession data for final finishes 13 Provided by IHSNot for

9、ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1276H 1 1. SCOPE 1.1 Scope. This standard establishes the method of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition of the plating used therewith,

10、and the sizes of wire and flat wire (ribbon) leads on electronic and electrical parts when they are to be soldered or welded during assembly in equipment. 1.2 Classification. 1.2.1 Type designation. The type designation will be in the following format: L W (X.XX) D - 21 - A1 | | | | | | _ |_ _ |_ _|

11、_ _ _|_ _|_ _|_ Lead Cross-section Nominal Composition Final Under- (see 1.2.1.1) size (see 1.2.1.3) finish plating (see 1.2.1.2) (see 1.2.1.4) (see 1.2.1.5) 1.2.1.1 Cross section. The lead cross section will be identified by a single letter symbol as follows: R - Rectangular. S - Square. W - Wire (

12、round or circular). X - Other (as specified). 1.2.1.2 Nominal size. The lead size will be identified by the nominal diameter or nominal diagonal in millimeters (within parentheses) or inches (without parentheses). See table I for a list of suggested nominal sizes. 1.2.1.3 Composition. The lead compo

13、sition will be identified by a single letter symbol as specified in 5.1. 1.2.1.4 Final finish. The final finish for leads will be identified by a two-number code as specified in 5.2. 1.2.1.5 Underplating. The underplating type and thickness will be identified by a one or two digit alpha-numeric code

14、 as specified in 5.2.1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1276H 2 TABLE I. Nominal size (for information only). Wire size AWG (B and S) Diameter in inches Diameter in millimeters 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 2

15、0 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 .289 .257 .229 .204 .181 .162 .144 .128 .114 .101 .090 .080 .072 .064 .057 .050 .045 .040 .035 .032 .028 .025 .022 .020 .017 .015 .014 .012 .011 .010 .008 .008 .007 .006 .005 .005 .004 .004 .003 .003 7.34 6.53 5.82 5.18 4.60 4.11 3.65 3.2

16、5 2.90 2.57 2.29 2.03 1.83 1.63 1.45 1.27 1.14 1.02 0.89 0.81 0.71 0.64 0.56 0.51 0.43 0.38 0.36 0.30 0.28 0.25 0.20 0.20 0.18 0.15 0.13 0.13 0.10 0.10 0.08 0.08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1276H 3 2. APPLICABLE DOCUMENTS

17、2.1 General. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This section does not include documents cited in other sections of this standard or recommended for additional information or as examples. While every effort has been made to ensure the complete

18、ness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3, 4, and 5 of this standard, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards,

19、and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-45204 - Gold Plating, Electrodeposited DEPARTMENT OF DEFENSE STANDARDS MI

20、L-STD-202 - Test Methods for Electronic and Electronic and Electrical Component Parts. MIL-STD-750 - Test Methods for Semiconductor Devices. MIL-STD-883 - Test Methods and Procedures for Microelectronics. (Copies of these documents are available online at https:/assist.dla.mil/ or from the Standardi

21、zation Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitati

22、on or contract. IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. (Copies of these documents are available online at http:/www.ipc.org/ or from the, IPC ASSOCIAT

23、ION CONNECTING ELECTRONICS INDUSTRIES, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015-1249.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1276H 4 ASTM INTERNATIONAL ASTM B5 - Standard Specification for High Conductivity Tough-Pitc

24、h Copper Refinery Shapes. ASTM B122/B122M - Standard Specification for Copper-Nickel-Tin Alloy, Copper-Nickel-Zinc Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip and Rolled Bar. ASTM B170 - Standard Specification for Oxygen-Free Electrolytic Copper-Refinery Shapes. ASTM B452 - St

25、andard Practice for Electronic Application, Wire, Steel, Copper-Clad. ASTM B465 - Standard Specification for Copper-Iron Alloy Plate, Sheet, Strip, and Rolled Bar. ASTM B487 - Standard Practice for Measurement of Metal and Oxide Coating Thickness by Microscopical Examination of a Cross-section. ASTM

26、 B488 - Electrodeposited Coatings of Gold for Engineering Uses. ASTM B545 - Standard Specification for Electrodeposited Coatings of Tin. ASTM B567 - Standard Practice for Measurement of Coating Thickness by the Beta Backscatter Method. ASTM B571 - Standard Practice for Adhesion of Metallic Coating.

27、ASTM B592 - Standard Specification for Copper-Zinc-Aluminum-Cobalt or Nickel-Alloy Plate, Sheet, Strip, and Rolled Bar, Specification for. ASTM B700 - Standard Specification for Electrodeposited Coatings of Silver for Engineering Use. ASTM B735 - Standard Test Method for Porosity in Gold Coatings on

28、 Metal Substrates by Nitric Acid Vapor. ASTM B741 - Standard Test Method for Porosity in Gold Coatings on Metal Substrates by Paper Electrography. ASTM F15 - Standard Specification for Iron-Nickel-Cobalt Sealing Alloy. ASTM F29 - Standard Specification for Dumet Wire for Glass-to-Metal Seal Applicat

29、ions. ASTM F30 - Standard Specification for Iron-Nickel Sealing Alloy. (Copies of these documents are available online at http:/www.astm.org/ or from the ASTM INTERNATIONAL, P.O. Box C700,100 Barr Harbor Drive, West Conshohocken, PA 19482-2959.) SAE INTERNATIONAL SAE-AMS2404 - Nickel, Electroless, P

30、lating. SAE-AMS2418 - Plating, Copper. SAE-AMS P-81728 - Plating, Tin-Lead (Electrodeposited). SAE-AMS-QQ-N-290 - Nickel Plating (Electrodeposited). (Copies of these documents are available online at http:/www.sae.org/ or from SAE INTERNATIONAL, 400 Commonwealth Drive, Warrendale, PA 15096-0001). 2.

31、4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a sp

32、ecific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1276H 5 3. DEFINITIONS 3.1 Definitions. This section is not applicable to this standard. Provided by IHSNot for ResaleNo reproduction or networking permitted

33、without license from IHS-,-,-MIL-STD-1276H 6 4. GENERAL REQUIREMENTS 4.1 Preferred methods of assembly. The preferred methods of assembly shall be in accordance with table II. TABLE II. Preferred methods of assembly. 1/ , 2/ Composition (see 5.1) Underplating (see 5.2.1) Final finish (see 5.2) 01 21

34、 22 32 34 41 43 51 52 61 71 72 A “ “ B “ “ C “ “ “ “ D “ “ “ “ E “ “ “ “ F “ “ “ G “ “ “ H “ “ “ “ J “ “ K “ “ “ L “ “ “ “ M “ “ “ “ A B C A B C A B P N A B C P N A B C P N A B C P A B C P A B C P N A B C A B C P A B P N C P N - - - - - - - - - - W - - - - - - - - - - - - - - - - - - - - - - - - - -

35、 - - - - - - - - - - - S,W S,W - S,W S,W - - - - - - S,W S,W - - - S,W S,W - - - S,W S,W - - S,W S,W - - S,W S,W - - - S,W S,W - S,W S,W - - - - - - - - - S,W S,W - S,W S,W - - - - - - S,W S,W - - - S,W S,W - - - S,W S,W - - S,W S,W - - S,W S,W - - - S,W S,W - S,W S,W - - - - - - - - - S “ “ “ “ “ “

36、 “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ S “ “ “

37、 “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ W

38、 “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “

39、 “ “ See notes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-STD-1276H 7 TABLE II. Preferred methods of assembly - Continued. 1/ , 2/ Composition (see 5.1) Underplating (see 5.2.1) Final finish (see 5.2) 01 21 22 32 34 41 43 51

40、52 61 71 72 N “ “ “ “ W “ “ “ “ C P N A B P N - - W - - - - - - - S,W S,W - - - - - S,W S,W - - S “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ W “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ S “ “ “ “ “ “ “ “ “ X As specified in the ac

41、quisition document. 1/ S = Solder. 2/ W = Weld. 4.2 Solderability. When specified in the acquisition documents, leads shall meet the following solderability requirements. a. Discrete semiconductor devices: Test method 2026 of MIL-STD-750. b. Microelectronics: Test method 2003 of MIL-STD-883. c. Othe

42、r electronic and electrical component parts: Test method 208 of MIL-STD-202. 4.3 Thickness. When specified in the acquisition document, the thickness of the final finish and underplating shall be determined in accordance with ASTM B487 or ASTM B567. 4.4 Adhesion. When specified in the acquisition do

43、cument, the adhesion of the final finish and underplating shall be determined in accordance with ASTM B571 or method 2025 of MIL-STD-883. 4.5 Porosity. When specified in the acquisition document, there shall be no evidence of porosity for final finishes 21, 22, and 61 when tested in accordance with

44、ASTM B735 or ASTM B741. 4.6 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes

45、 economically advantageous life cycle costs. 4.7 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of leads and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.

46、6). 4.8 Workmanship in finishes. All plating or primary finishes or underplating shall be deposited in such a way that the plating is applied to a clean, nonoxidized metal surface that is free from defects that will be detrimental to the utility, form, fit, function, or protective value of the finis

47、h. Where surface cleaning, deoxidation, activation, or undercoating are used, the material or device so treated must proceed immediately to the primary finish process in order to maintain the ability to overplate effectively. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-