DLA SMD-5962-00530 REV A-2002 MICROCIRCUIT HYBRID DIGITAL-LINEAR 12-BIT DUAL CHANNEL ANALOG TO DIGITAL CONVERTER《数字线性混合微电路 12位双通道数模转换器》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Table I, change limits for SFDR, subgroup 5 at 21 MHz and 37 MHz, SNR, subgroups 4 and 5 at 10 MHz, 21 MHz, and 37 MHz, SINAD, subgroups 4 and 5 at 10 MHz, 21 MHz, and 37 MHz, and IMD, subgroup 5. 02-04-10 Raymond Monnin REV SHEET REV SHEET REV S

2、TATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones POST OFFICE BOX 3990 COLUMBUS, OHIO 43216-5000 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY A

3、LL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUIT, HYBRID, DIGITAL-LINEAR, 12-BIT, DUAL CHANNEL, ANALOG TO DIGITAL CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 01-05-07 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-00530 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5

4、962-E330-02 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REV

5、ISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When availab

6、le, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 00530 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2

7、.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device ty

8、pe(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD13280BZ Dual channel, 12-bit, 80 MSPS, MCM, analog to digital converter 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All l

9、evels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This lev

10、el is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-

11、Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with ex

12、ception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality clas

13、s. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1

14、68 Leaded ceramic chip carrier 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43

15、216-5000 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Analog positive supply voltage (AVCC). 0 V dc to +7.0 V dc Digital positive supply voltage (DVCC) 0 V dc to +7.0 V dc Analog negative supply voltage (AVEE) . 0 V dc to -7.0 V dc Analog input voltage -7.0 V dc to +

16、7.0 V dc Analog input current -10 mA to +10 mA Digital input voltage (ENCODE) 0 V dc to +7.0 V dc ENCODE, ENCODE differential voltage. 4 V dc Digital output current . -10 mA to +10 mA Gain and offset adjust voltage range. AVEEto AVCCDigital input voltage range. +0.5 V to AVEEPower dissipation (PD).

17、3.9 W Thermal resistance junction-to-case (JC) . 2.22C/W Thermal resistance junction-to-ambient (JA) 24.3C/W Junction temperature (TJ) +175C Storage temperature . -65C to +150C Lead temperature (soldering, 10 seconds) +300C 1.4 Recommended operating conditions. Analog positive supply voltage (AVCC).

18、 +4.85 V dc to +5.25 V dc Digital positive supply voltage (DVCC) +3.14 V dc to +3.47 V dc Analog negative supply voltage (AVEE) . -5.25 V dc to -4.75 V dc Case operating temperature range (TC) -40C to +85C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following

19、specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

20、 solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE

21、MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111

22、-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Str

23、esses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S

24、IZE A 5962-00530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with M

25、IL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534

26、). Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. T

27、he design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical

28、 performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups speci

29、fied in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marke

30、d. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also,

31、the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of complia

32、nce. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of

33、 conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified

34、 in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015

35、of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and

36、 power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electri

37、cal parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION

38、 LEVEL SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -40C 10 pF will degrade performance. 6/ Input capacitance combines die and package capacitance. 7/ Maximum conversion rate allows for variation in ENCODE DUTY CYCLE of 50%, 5%. 8/ Analog i

39、nput signal equals -1 dBFS; SFDR is the ratio of converter full scale to worst spur. 9/ Analog input signal power at -1 dBFS; signal-to-noise ratio (SNR) is the ratio of signal level to total noise (first 5 harmonics removed). ENCODE = 80 MSPS. SNR is reported in dBFS, related back to converter full

40、 scale. 10/ Analog input signal power at -1 dBFS; signal-to-noise and distortion (SINAD) is the ratio of signal level to total noise plus harmonics. ENCODE = 80 MSPS. 11/ Two tone intermodulation distortion rejection is the ratio of the rms value of either input tone to the rms value of the worst th

41、ird order intermodulation product; reported in dBFS. 12/ Channel to channel isolation tested with A channel grounded and a full scale signal applied to B channel. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

42、62-00530 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 8 DSCC FORM 2234 APR 97 Case outline X. Millimeters Inches Symbol Min Max Min Max A 5.97 0.235 A1 4.45 0.175 A2 0.18 1.02 0.040 0.060 b 0.36 0.51 0.014 0.020 c 0.18 0.25 0.007 0.010 e 1.14 1.40 0.045 0.055 D/E 29.

43、72 30.23 1.170 1.190 D1/E1 27.18 1.070 D2/E2 23.88 24.38 0.940 0.960 D3/E3 20.32 BSC 0.800 BSC NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound

44、units, the inch-pound units shall rule. 2. Pin 1 dot and pin numbers are for reference only. FIGURE 1. Case outline(s). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-00530 DEFENSE SUPPLY CENTER COLUMBUS COL

45、UMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 9 DSCC FORM 2234 APR 97 Device type 01 Device type 01 Device type 01 Case outline X Case outline X Case outline X Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 Shield 24 D4A 47 D6B 2 Channel A analog grou

46、nd 25 D5A 48 D7B 3 Channel A analog ground 26 Channel A digital ground 49 D8B 4 A-IN 27 Channel A digital ground 50 D9D 5 A+IN 28 D6A 51 D10B 6 AMP-OUT-A 29 D7A 52 D11B (MSB) 7 AMP-IN-A-1 30 D8A 53 DVCCChannel B 8 AMP-IN-A-2 31 D9A 54 Channel B analog ground 9 Channel A analog ground 32 D10A 55 ENCO

47、DE B 10 Channel A analog ground 33 D11A (MSB) 56 ENCODE B 11 AVEEChannel A 34 Data Ready OUT A 57 Channel B analog ground 12 AVCCChannel A 35 Shield 58 AVCCChannel B 13 Channel A analog ground 36 Data Ready OUT B 59 AVEEChannel B 14 ENCODE A 37 No connection 60 Channel B analog ground 15 ENCODE A 38

48、 No conntection 61 Channel B analog ground 16 Channel A analog ground 39 D0B (LSB) 62 AMP-IN-B-2 17 DVCCChannel A 40 D1B 63 AMP-IN-B-1 18 No connection 41 D2B 64 AMP-OUT-B 19 No connection 42 D3B 65 B+IN 20 D0A (LSB) 43 Channel B digital ground 66 B-IN 21 D1A 44 Channel B digital ground 67 Channel B analog ground 22 D2A 45 D4B 68 Channel B analog ground 23 D3A 46 D5B FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU