ImageVerifierCode 换一换
格式:PDF , 页数:14 ,大小:73.98KB ,
资源ID:698205      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-698205.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(DLA SMD-5962-01513-2001 MICROCIRCUIT DIGITAL-LINEAR 256 OUTPUT THIN FILM TRANSISTOR (TFT) GATE DRIVER MONOLITHIC SILICON《单片硅数字线性微电路 256输出薄膜晶体管(TFT)门驱动器》.pdf)为本站会员(sumcourage256)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-01513-2001 MICROCIRCUIT DIGITAL-LINEAR 256 OUTPUT THIN FILM TRANSISTOR (TFT) GATE DRIVER MONOLITHIC SILICON《单片硅数字线性微电路 256输出薄膜晶体管(TFT)门驱动器》.pdf

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDREVSHEETREVSHEETREV STATUS REVOF SHETS SHET 1234567891011213PMIC N/A PREPARED BY RICK OFFICERDEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYRAJESH PITHADIACOLUMBUS, OHIO 43216http:/www.dscc.dla.milTHIS DRAWING IS AVAILABLEFOR USE B

2、Y ALLDEPARTMENTSAND AGENCIES OF THEAPPROVED BYRAYMOND MONNIN MICROCIRCUIT, DIGITAL-LINEAR, 256 OUTPUT,THIN FILM TRANSISTOR (TFT) GATE DRIVER,MONOLITHIC SILICONDEPARTMENT OF DEFENSEDRAWING APPROVAL DATE01-05-29AMSC N/AREVISION LEVEL SIZEACAGE CODE672685962-01513SHEET1 OF 13DSCC FORM 2233APR 97 5962-E

3、368-01DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-01513DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SH

4、EET2DSCC FORM 2234APR 971. SCOPE1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q andM) and space application (device class V). In addition for TAB devices, the requirements of Appendix F “General provision forTAB microcircuits” sha

5、ll be met. A choice of case outlines and lead finishes are available and are reflected in the Part orIdentifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.1.2 PIN. The PIN is as shown in the following example:5962 - 01513 01 Q X X Fe

6、deral RHA Device Device Case Lead stock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels andare mark

7、ed with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix Aspecified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.1.2.2 Device type(s). The device type(s) identify the circuit function as follows

8、:Device type Generic number Circuit function01 MPT57605 256 output, thin film transistor (TFT)gate driver1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level asfollows:Device class Device requirements documentationM Vendor self-certifi

9、cation to the requirements for MIL-STD-883 compliant,non-JAN class level B microcircuits in accordance with MIL-PRF-38535,appendix A and appendix F of MIL-PRF-38535.Q or V Certification and qualification to MIL-PRF-38535 and appendix F of MIL-PRF-385351.2.4 Case outline(s). The case outline(s) are a

10、s designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX See manufacturers 268 Environmentally protected tape automatedaltered item drawing bond1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 and appendix F for device classes Q an

11、d V or MIL-PRF-38535, appendix A and appendix F for device class M.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-01513DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET3DSCC FORM 2234AP

12、R 971.3 Absolute maximum ratings. 1/ 2/ 3/ 4/Power supply voltage:VDD-0.3 V to +7.0 VVEE-20.0 V to +0.3 VVLVEE 0.3 V to VEE+ 7.0 VVCOM VEE-0.3 V to 40.0 VInput voltage (VIN). -0.3 V to VDD+ 0.3 VStorage temperature range . -55C to +125C1.4 Recommended operating conditions. 2/Power supply voltage:VDD

13、+3.0 V to +3.6 VVCOM. +10 V to +25 VVEE-15 V to -5 VVL VEE0 V to 6.0 VVCOM VEE17 V to 35 VOperating frequency (fCPV) 100 kHzOperating ambient temperature range (TA) . -55C to +125C2. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks. The following specification, standards, a

14、nd handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed inthe issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in thesolicitation.SPECIFICATIONDEP

15、ARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Method Standard Microcircuits.MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.1/ Stresses above the absolute maximum rating may cause

16、permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.2/ VSS= 0 V.3/ Power up in the following order: VDD VEE input signal VCOM. Power down by reversing the sequence.4/ Unless otherwise specified, all voltages are with reference to VSS

17、.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-01513DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET4DSCC FORM 2234APR 97HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard

18、Microcircuit Drawings.MIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In

19、the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The ind

20、ividual item requirements for device classes Q and V shall be in accordance withMIL-PRF-38535, and appendix F MIL-PRF-38535 “General provisions for TAB microcircuits”, and as specified herein or asmodified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shal

21、l not affect theform, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and Appendix F as specified herein.3.2 Design, construction, and physical dimensions. The design, co

22、nstruction, and physical dimensions shall be as specifiedin MIL-PRF-38535, appendix F of MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A,appendix F and herein for device class M.3.2.1 Pin functions. The pin functions shall be as specified on figure 1.3.2.2 Device ope

23、ration. The device operation shall be as specified on figure 2.3.2.3 Block diagram. The block diagram shall be as specified on figure 3.3.2.4 Timing diagram. The timing diagram shall be as specified on figure 4.3.3 AID requirements. All AIDs written against this SMD shall be sent to DSCC-VA. The fol

24、lowing items shall be provided tothe device manufacturer by the customer as part of an AID.3.3.1 Case outline. The case outline shall be in accordance with the manufacturers altered item drawing.3.3.2 Terminal connections and pin assignments.3.3.3 Package type (see 1.2.4).3.3.4 Functional descriptio

25、n terms and symbols.3.3.5 Logic diagram (or equivalent structural VHDL description or mutually agreed to net list).3.3.6 Design tape number or Design document name (i.e., net list).3.3.7 Design functional tape number or name.3.3.8 Test functional tape number or name.3.3.9 Fault coverage measurement

26、of manufacturing logic tests.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-01513DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET5DSCC FORM 2234APR 973.3.10 Burn-in circuit.3.3.11 ESD

27、class and voltage.3.3.12 Device electrical performance characteristics (additions to Table I). Device electrical performance characteristicsshall include dc parametric, functional, ac parameters and any other data which would be considered required by a designengineer. All electrical performance cha

28、racteristics apply over the full recommended ambient operating temperature range andspecified test load conditions.3.3.13 Maximum power dissipation. Maximum power dissipation shall be in accordance with the application specific design.3.4 Electrical performance characteristics and post irradiation p

29、arameter limits. Unless otherwise specified herein, theelectrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over thefull ambient operating temperature range.3.5 Electrical test requirements. The electrical test requirements shall be

30、 the subgroups specified in table II. The electricaltests for each subgroup are defined in table I.3.6 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also bemarked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN

31、 number is not feasible due to spacelimitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, theRHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535 andappendix F MIL-PRF-38

32、535 (see 3.1 herein). Marking for device class M shall be in accordance with MIL-PRF-38535,appendix A and appendix F of MIL-PRF-38535. The AID number shall be added to the marking by the manufacturer.3.6.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “Q

33、ML” or “Q” as required inMIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A.3.7 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535listed manufacturer in order to supply to th

34、e requirements of this drawing (see 6.6.1 herein). For device class M, a certificate ofcompliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an a

35、pproved source of supply for thisdrawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and appendix F of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A andappendix F of MIL-PRF-38535 and

36、 herein.3.8 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or fordevice class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.3.9 Notification of change for device class M. For

37、 device class M, notification to DSCC-VA of change of product (see 6.2herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.3.10 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activi

38、ty retainthe option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be madeavailable onshore at the option of the reviewer.3.11 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be inmicroci

39、rcuit group number 55 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-01513DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET6DSCC FORM 2234APR 97TABLE I.

40、Electrical performance characteristics.Test SymbolGroup AsubgroupsDevicetypeLimits UnitConditions 1/ 2/-55C TA +125CVSS= 0 Vunless otherwise specifiedMin MaxLow level input voltage forall input pinsVIL1,2,3 01VSS0.1 xVDDVHigh level input voltage forall input pinsVIH1,2,3 01 0.9 xVDDVDDVLow level out

41、put voltage forSTV1 and STV2 pinsVOLIOL= 40 A1,2,3 01VSSVSS+0.4VHigh level output voltage forSTV1 and STV2 pinsVOHIOH= -40 A1,2,3 01VDD0.4VDDVLow level output resistancefor OUT1 OUT256 pinsROLVOUT= VL+ 0.2 V4,5,6 01 1000 High level output resistancefor OUT1 OUT256 pinsROHVOUT= VCOM 0.2 V4,5,6 01 100

42、0 Input current for all input pinsIIN1,2,3 01 -5.0 +5.0 ASupply currentIDD1,2,3 01 500 AICOM1,2,3 1001/ Current consumption by a 1/600 duty liquid crystal display.2/ The outputs are no load. The inputs are VIH= VDD, VIL= VSS, fCPV= 50 kHz, fSTV= 104.2 Hz, andOE1, OE2, OE3 = VIL.Provided by IHSNot fo

43、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-01513DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET7DSCC FORM 2234APR 97Pin name Input / Output FunctionCPV Input Vertical shift clock input.The shift regis

44、ters shift clock. Data are shifted in sync withthe rising edge of this pin.OE1, Input Output enable pins.OE2, The liquid-crystal control output is held low by setting pinsOE3 OE1, OE2, and OE3 high. However, the shift registers arenot cleared. OE is async with CPV.Enable control target pin:OE1: OUT1

45、, OUT4, OUT7OUT253, OUT256OE2: OUT2, OUT5, OUT8OUT254OE3: OUT3, OUT6, OUT9OUT255These combinations are generally as above, regardless ofthe L / R polarity.L / RInput Shift direction switching pin.This pin is used to switch the datas shift direction.L / R = L:STV1 OUT1 OUT2OUT255 OUT256 STV2L / R = H

46、STV1 OUT1 OUT2OUT255 OUT256 STV2STV1, I/O Shift data I/O pins.STV2 These pins are used to input/output data to/from a shift register.During input, data are captured in sync with the leading edge of CPV.During output, data are output in sync with its trailing edge.L / R = L:STV1 is the next-stage dat

47、a output pin, and STV2 is the shift data pin.L / R = H:STV1 is the shift data input pin, and STV2 is the next-stage dataoutput.OUT1 OUT256Output Liquid crystal control output pin.VCOMPower supply Power supply for high withstand voltage logic.VDDPower supply Power supply for logic input.VSSPower supp

48、ly Ground for logic input.VEEPower supply Ground.VLPower supply Negative power supply for liquid-crystal control.FIGURE 1. Pin functions.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-01513DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVEL SHEET8DSCC FORM 2234APR 97NOTES: The device enables negative voltage output for the liquid crystal control output.VCOM VL= 35 V maximum. VL VEE= 0 V 6 V. VCOM VSS= 10

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1